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IS62WV25616ALL-70T

256KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44

器件类别:存储    存储   

厂商名称:Integrated Silicon Solution ( ISSI )

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Integrated Silicon Solution ( ISSI )
零件包装代码
TSOP2
包装说明
PLASTIC, TSOP2-44
针数
44
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
70 ns
I/O 类型
COMMON
JESD-30 代码
R-PDSO-G44
JESD-609代码
e0
长度
18.415 mm
内存密度
4194304 bit
内存集成电路类型
STANDARD SRAM
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
44
字数
262144 words
字数代码
256000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
256KX16
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装等效代码
TSOP44,.46,32
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
1.8/2 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大待机电流
0.000015 A
最小待机电流
1.2 V
最大压摆率
0.025 mA
最大供电电压 (Vsup)
2.2 V
最小供电电压 (Vsup)
1.65 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
10.16 mm
文档预览
IS62WV25616ALL
IS62WV25616BLL
256K x 16 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC SRAM
FEATURES
• High-speed access time: 55ns, 70ns
• CMOS low power operation
36 mW (typical) operating
9 µW (typical) CMOS standby
• TTL compatible interface levels
• Single power supply
1.65V--2.2V V
DD
(IS62WV25616ALL)
2.5V--3.6V V
DD
(IS62WV25616BLL)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
ISSI
DECEMBER 2003
®
DESCRIPTION
The
ISSI
IS62WV25616ALL/IS62WV25616BLL are high-
speed, low power, 4M bit SRAMs organized as 256K words
by 16 bits. It is fabricated using
ISSI
's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
When
CS1
is HIGH (deselected) or when
CS1
is LOW and
both
LB
and
UB
are HIGH, the device assumes a standby
mode at which the power dissipation can be reduced down
with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory. A
data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
The IS62WV25616ALL/IS62WV25616BLL are packaged in
the JEDEC standard 44-Pin TSOP (TYPE II) and 48-pin
mini BGA (6mmx8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A17
DECODER
256K x 16
MEMORY ARRAY
V
DD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CS1
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
12/10/03
1
IS62WV25616ALL, IS62WV25616BLL
PIN CONFIGURATIONS
48- ball mini BGA (6mm x 8mm)
(Package Code B)
1
2
3
4
5
6
ISSI
44-Pin mini TSOP (Type II)
(Package Code T)
A4
A3
A2
A1
A0
CS1
I/O0
I/O1
I/O2
I/O3
V
DD
GND
I/O4
I/O5
I/O6
I/O7
WE
A16
A15
A14
A13
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
V
DD
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
A17
®
A
B
C
D
E
F
G
H
LB
I/O
8
I/O
9
GND
VDD
I/O
14
I/O
15
NC
OE
UB
I/O
10
I/O
11
I/O
12
I/O
13
NC
A8
A0
A3
A5
A17
NC
A14
A12
A9
A1
A4
A6
A7
A16
A15
A13
A10
A2
CSI
I/O
1
I/O
3
I/O
4
I/O
5
WE
A11
NC
I/O
0
I/O
2
VDD
GND
I/O
6
I/O
7
NC
PIN DESCRIPTIONS
A0-A17
I/O0-I/O15
CS1
OE
WE
LB
UB
NC
V
DD
GND
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Output Enable Input
Write Enable Input
Lower-byte Control (I/O0-I/O7)
Upper-byte Control (I/O8-I/O15)
No Connection
Power
Ground
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
12/10/03
IS62WV25616ALL, IS62WV25616BLL
TRUTH TABLE
Mode
Not Selected
Output Disabled
Read
WE
X
X
H
H
H
H
H
L
L
L
CS1
H
X
L
L
L
L
L
L
L
L
OE
X
X
H
H
L
L
L
X
X
X
LB
X
H
L
X
L
H
L
L
H
L
UB
X
H
X
L
H
L
L
H
L
L
I/O PIN
I/O0-I/O7
I/O8-I/O15
High-Z
High-Z
High-Z
High-Z
D
OUT
High-Z
D
OUT
D
IN
High-Z
D
IN
High-Z
High-Z
High-Z
High-Z
High-Z
D
OUT
D
OUT
High-Z
D
IN
D
IN
ISSI
V
DD
Current
I
SB
1
, I
SB
2
I
SB
1
, I
SB
2
I
CC
I
CC
I
CC
®
Write
I
CC
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
V
DD
T
STG
P
T
Parameter
Terminal Voltage with Respect to GND
V
DD
Related to GND
Storage Temperature
Power Dissipation
Value
–0.2 to V
DD
+0.3
–0.2 to V
DD
+0.3
–65 to +150
1.0
Unit
V
V
°C
W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
OPERATING RANGE (V
DD
)
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
IS62WV25616ALL
1.65V - 2.2V
1.65V - 2.2V
IS62WV25616BLL
2.5V-3.6V
2.5V-3.6V
DC ELECTRICAL CHARACTERISTICS
(Over Operating Range)
Symbol Parameter
V
OH
V
OL
V
IH
V
IL(1)
I
LI
I
LO
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage
Output Leakage
GND
V
IN
V
DD
GND
V
OUT
V
DD
, Outputs Disabled
Test Conditions
I
OH
= -0.1 mA
I
OH
= -1 mA
I
OL
= 0.1 mA
I
OL
= 2.1 mA
V
DD
1.65-2.2V
2.5-3.6V
1.65-2.2V
2.5-3.6V
1.65-2.2V
2.5-3.6V
1.65-2.2V
2.5-3.6V
Min.
1.4
2.2
1.4
2.2
–0.2
–0.2
–1
–1
Max.
0.2
0.4
V
DD
+ 0.2
V
DD
+ 0.3
0.4
0.6
1
1
Unit
V
V
V
V
V
V
V
V
µA
µA
Notes:
1. V
IL
(min.) = –1.0V for pulse width less than 10 ns.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
12/10/03
3
IS62WV25616ALL, IS62WV25616BLL
IS62WV25616ALL, POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
I
CC
I
CC
1
Parameter
V
DD
Dynamic Operating
Supply Current
Operating Supply
Current
TTL Standby Current
(TTL Inputs)
Test Conditions
V
DD
= Max.,
I
OUT
= 0 mA, f = f
MAX
V
DD
= Max.,
CS1
= 0.2V
WE
= V
DD
-0.2V
f=1
MHZ
V
DD
= Max.,
V
IN
= V
IH
or V
IL
CS1
= V
IH
, f = 1 MH
Z
Com.
Ind.
Com.
Ind.
Com.
Ind.
OR
ULB Control
I
SB
2
CMOS Standby
Current (CMOS Inputs)
V
DD
= Max., V
IN
= V
IH
or V
IL
CS1
= V
IL
, f = 0,
UB
= V
IH
,
LB
= V
IH
V
DD
= Max.,
CS1
V
DD
– 0.2V,
V
IN
V
DD
– 0.2V, or
V
IN
0.2V, f = 0
Com.
Ind.
OR
15
15
µA
Max.
70
25
30
10
10
0.35
0.35
ISSI
Unit
mA
mA
®
I
SB
1
mA
ULB Control
V
DD
= Max.,
CS1
= V
IL
,
V
IN
0.2V, f = 0;
UB
/
LB
= V
DD
– 0.2V
IS62WV25616BLL, POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
I
CC
I
CC
1
Parameter
V
DD
Dynamic Operating
Supply Current
Operating Supply
Current
TTL Standby Current
(TTL Inputs)
Test Conditions
V
DD
= Max.,
I
OUT
= 0 mA, f = f
MAX
V
DD
= Max.,
CS1
= 0.2V
WE
= V
DD
-0.2V
f=1
MHZ
V
DD
= Max.,
V
IN
= V
IH
or V
IL
CS1
= V
IH
, f = 1 MH
Z
Com.
Ind.
Com.
Ind.
Com.
Ind.
OR
ULB Control
I
SB
2
CMOS Standby
Current (CMOS Inputs)
V
DD
= Max., V
IN
= V
IH
or V
IL
CS1
= V
IL
, f = 0,
UB
= V
IH
,
LB
= V
IH
V
DD
= Max.,
Com.
CS1
V
DD
– 0.2V,
Ind.
V
IN
V
DD
– 0.2V, or
V
IN
0.2V, f = 0
OR
V
DD
= Max.,
CS1
= V
IL
,
V
IN
0.2V, f = 0;
UB
/
LB
= V
DD
– 0.2V
Max.
55
40
45
15
15
0.35
0.35
Max.
70
35
40
15
15
0.35
0.35
Unit
mA
mA
I
SB
1
mA
15
15
15
15
µA
ULB Control
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
12/10/03
IS62WV25616ALL, IS62WV25616BLL
CAPACITANCE
(1)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
8
10
Unit
pF
pF
ISSI
®
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
IS62WV25616ALL
(Unit)
0.4V to V
DD
-0.2V
5 ns
V
REF
See Figures 1 and 2
IS62WV25616BLL
(Unit)
0.4V to V
DD
-0.3V
5ns
V
REF
See Figures 1 and 2
IS62WV25616ALL
1.65V-2.2V
R1(Ω)
Ω)
R2(Ω)
Ω)
V
REF
V
TM
3070
3150
0.9V
1.8V
IS62WV25616BLL
2.5V - 3.6V
3070
3150
1.5V
2.8V
AC TEST LOADS
R1
VTM
VTM
R1
OUTPUT
30 pF
Including
jig and
scope
R2
OUTPUT
5 pF
Including
jig and
scope
R2
Figure 1
Figure 2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
12/10/03
5
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参数对比
与IS62WV25616ALL-70T相近的元器件有:IS62WV25616ALL-70BI、IS62WV25616ALL-70TI、IS62WV25616BLL-55T。描述及对比如下:
型号 IS62WV25616ALL-70T IS62WV25616ALL-70BI IS62WV25616ALL-70TI IS62WV25616BLL-55T
描述 256KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44 Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 256KX16 STANDARD SRAM, 70ns, PDSO44, PLASTIC, TSOP2-44 256KX16 STANDARD SRAM, 55ns, PDSO44, PLASTIC, TSOP2-44
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 TSOP2 BGA TSOP2 TSOP2
包装说明 PLASTIC, TSOP2-44 TFBGA, BGA48,6X8,30 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44
针数 44 48 44 44
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 70 ns 70 ns 70 ns 55 ns
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDSO-G44 R-PBGA-B48 R-PDSO-G44 R-PDSO-G44
JESD-609代码 e0 e0 e0 e0
长度 18.415 mm 8 mm 18.415 mm 18.415 mm
内存密度 4194304 bit 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 16 16 16 16
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端子数量 44 48 44 44
字数 262144 words 262144 words 262144 words 262144 words
字数代码 256000 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 70 °C
组织 256KX16 256KX16 256KX16 256KX16
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TFBGA TSOP2 TSOP2
封装等效代码 TSOP44,.46,32 BGA48,6X8,30 TSOP44,.46,32 TSOP44,.46,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 1.8/2 V 1.8/2 V 1.8/2 V 3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大待机电流 0.000015 A 0.000015 A 0.000015 A 0.000015 A
最小待机电流 1.2 V 1.2 V 1.2 V 1.2 V
最大压摆率 0.025 mA 0.03 mA 0.03 mA 0.04 mA
最大供电电压 (Vsup) 2.2 V 2.2 V 2.2 V 3.6 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 2.5 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 2.8 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING BALL GULL WING GULL WING
端子节距 0.8 mm 0.75 mm 0.8 mm 0.8 mm
端子位置 DUAL BOTTOM DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 10.16 mm 6 mm 10.16 mm 10.16 mm
厂商名称 Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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