Speech Synthesizer With RCDG, 20s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28
厂商名称:Winbond(华邦电子)
厂商官网:http://www.winbond.com.tw
器件标准:
下载文档型号 | ISD1420PYI | ISD1416S |
---|---|---|
描述 | Speech Synthesizer With RCDG, 20s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 16s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 |
是否Rohs认证 | 符合 | 不符合 |
厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | DIP | SOIC |
包装说明 | DIP, DIP28,.6 | SOP, |
针数 | 28 | 28 |
Reach Compliance Code | unknown | unknown |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 |
长度 | 36.83 mm | 17.9 mm |
功能数量 | 1 | 1 |
端子数量 | 28 | 28 |
最高工作温度 | 85 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified |
最长读取时间 | 20 s | 16 s |
座面最大高度 | 4.83 mm | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V |
表面贴装 | NO | YES |
技术 | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 7.5 mm |
Base Number Matches | 1 | 1 |