Speech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
器件类别:消费电路
厂商名称:Winbond(华邦电子)
厂商官网:http://www.winbond.com.tw
器件标准:
下载文档型号 | ISD2548SY | ISD2532PY | ISD2532SY |
---|---|---|---|
描述 | Speech Synthesizer With RCDG, 48s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 | Speech Synthesizer With RCDG, 32s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 32s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 |
是否Rohs认证 | 符合 | 符合 | 符合 |
厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | SOIC | DIP | SOIC |
包装说明 | SOP, SOP28,.4 | DIP, DIP28,.6 | SOP, SOP28,.4 |
针数 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown |
应用 | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 |
长度 | 17.93 mm | 36.83 mm | 17.93 mm |
功能数量 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 |
片上内存类型 | EEPROM | EEPROM | EEPROM |
最高工作温度 | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP |
封装等效代码 | SOP28,.4 | DIP28,.6 | SOP28,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 245 | NOT SPECIFIED | 245 |
电源 | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
最长读取时间 | 48 s | 32 s | 32 s |
座面最大高度 | 2.64 mm | 4.83 mm | 2.64 mm |
最大压摆率 | 30 mA | 30 mA | 30 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | NO | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 |
宽度 | 7.52 mm | 15.24 mm | 7.52 mm |