ISP1507
High Performance Bluetooth 5 Ready, NFC
*
& ANT Low Energy Module
with MCU & Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52 Chip. Its powerful Cortex™ M4 CPU, flash
and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Multiple
digital and analogue interfaces give optimum flexibility
for sensor integration.
Key Features
Multi-protocol 2.4GHz Ultra Low Power
RF Transceiver
Bluetooth 5-Ready stack
ANT/ANT+ stack
2.4 GHz proprietary stack
(*) NFC-A Tag for OOB pairing in option
Fully integrated RF matching and Antenna
Integrated 32 MHz& 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4 CPU
512 kB Flash and 64 kB SRAM
or 192 kB Flash and 24 kB SRAM versions
From 13 to 30 configurable GPIOs including
up to 3 to 8 ADC
Many interfaces SPI, UART, PDM, I2C
Single 1.7 to 3.6 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
Beacons
Certifications
Fully FCC certified module
Fully CE certified module
Fully IC certified module
Fully TELEC certified module
Bluetooth SIG certified QDL listing
RoHS compliant
May 24, 2019
Document Ref: isp_ble_DS1507_R13.docx
Page 1/28
Insight SiP
– Green Sid e – 400 ave nue Rou m anille – B P 30 9 – 06906 S ophia - Antipolis C edex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1507
Contents
1.
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
6.
6.1.
6.2.
7.
7.1.
7.2.
7.3.
7.4.
7.5.
8.
8.1.
8.2.
8.3.
9.
9.1.
9.2.
9.3.
9.4.
9.5.
9.6.
9.7.
Block Diagram ....................................................................................................................................................... 3
Specifications ........................................................................................................................................................ 4
General Notice ...........................................................................................................................................4
Absolute Maximum Ratings ........................................................................................................................4
Operating Conditions ..................................................................................................................................4
Power Consumption ...................................................................................................................................5
Clock Sources ............................................................................................................................................5
Radio Specifications ...................................................................................................................................5
Electrical Schematic ...................................................................................................................................8
Pin Description .................................................................................................................................................... 10
Mechanical Outlines ............................................................................................................................................ 13
Mechanical Dimensions ............................................................................................................................ 13
SMT Assembly Guidelines ........................................................................................................................ 14
Antenna Keep-Out Zone ........................................................................................................................... 14
Product Development Tools............................................................................................................................... 15
Hardware ................................................................................................................................................. 15
Firmware .................................................................................................................................................. 15
Development Tools................................................................................................................................... 16
Reference Designs .............................................................................................................................................. 17
Beacon Design ......................................................................................................................................... 17
Sensor Board Design ............................................................................................................................... 18
Packaging & Ordering information.................................................................................................................... 21
Marking .................................................................................................................................................... 21
Prototype Packaging ................................................................................................................................ 21
Jedec Trays.............................................................................................................................................. 21
Tape and Reel .......................................................................................................................................... 22
Ordering Information................................................................................................................................. 23
Storage & Soldering information ....................................................................................................................... 24
Storage and Handling ............................................................................................................................... 24
Moisture Sensitivity................................................................................................................................... 24
Soldering information................................................................................................................................ 25
Quality & User information ................................................................................................................................. 26
Certifications ............................................................................................................................................ 26
USA – User information ............................................................................................................................ 26
Canada – User information ....................................................................................................................... 26
RF Exposure Information .......................................................................................................................... 27
Informations concernant l'exposition aux fréquences radio (RF) ................................................................ 27
Discontinuity ............................................................................................................................................. 27
Disclaimer ................................................................................................................................................ 28
May 24, 2019
Document Ref: isp_ble_DS1507_R13.docx
Page 2/28
Insight SiP
– Green Sid e – 400 ave nue Rou m anille – B P 30 9 – 06906 S ophia- Ant ipolis C edex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1507
1. Block Diagram
This module is based on nRF52 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4 CPU, either 512 kB or 192 kB flash
memory, either 64 kB RAM or 24 kB RAM and analog and digital peripherals.
It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from
Nordic Semiconductor.
Fully qualified BLE stacks for nRF52 are implemented in the S112/S132 SoftDevices which can be
freely downloaded. ISP1507 can then be used in Central, Peripheral or both roles for BLE and for both
ends of other proprietary protocols. nRF52 platform also provides extensive software support for ANT
applications with S212 SoftDevices and dual ANT/BLE stack S332 SoftDevices.
Ultra-low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter,
RF matching circuit and antenna in addition to the wireless SoC.
Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor
applications require the further addition of appropriate sensors. The antenna was designed to be
optimized with several standard ground plane sizes. When NFC function is available, the NFC tag
antenna can be connected externally.
May 24, 2019
Document Ref: isp_ble_DS1507_R13.docx
Page 3/28
Insight SiP
– Green Sid e – 400 ave nue Rou m anille – B P 30 9 – 06906 S ophia- Ant ipolis C edex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1507
2. Specifications
2.1. General Notice
The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for nRF52 chipset series. Bellow information is only a summary of the main parameters. For more
detailed information, especially about current consumption, please refer to the up-to-date specification of
the chipset available on Nordic Semi website.
2.2. Absolute Maximum Ratings
Parameter
Supply Voltage respect to ground - VCC
IO Pin Voltage
RF Input Level
NFC Antenna pin current
Module Total Capacity
Module Total Inductance
Storage Temperature
Moisture Sensitivity Level
ESD Human Body Model
ESD Charged Device Model
Flash Endurance
-40
Min
-0.3
-0.3
Typ
Max
3.9
3.9
10
80
2.5
15
+125
5
4000
750
10000
Unit
V
V
dBm
mA
µF
µH
°C
-
V
V
cycles
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.3. Operating Conditions
Parameter
Operating Supply Voltage, independent of DCDC enable
Extended Industrial Operating Temperature Range
Min
1.7
-40
Typ
3.0
+25
Max
3.6
+85
Unit
V
°C
May 24, 2019
Document Ref: isp_ble_DS1507_R13.docx
Page 4/28
Insight SiP
– Green Sid e – 400 ave nue Rou m anille – B P 30 9 – 06906 S ophia- Ant ipolis C edex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1507
2.4. Power Consumption
Parameter
Peak current, Receiver active
(1)
Peak current, Transmitter active -40 dBm Output Power
(2)
Peak current, Transmitter active 0 dBm Output Power
(2)
System OFF, no RAM retention, wake on reset
System ON, full RAM retention, wake on any event
Additional RAM retention current per 4 KB block
(1)
(2)
DCDC enable, Power supply 3V, 1 Mbps
DCDC enable, Power supply 3V
Typ / AL version
4.6
3.4
4.6
0.3
1.5
40
Typ / AX version
5.4
4.1
5.3
0.3
1.9
40
Unit
mA
mA
mA
µA
µA
nA
2.5. Clock Sources
Parameter
Internal High Frequency Clock for RF Stability:
32 MHz Crystal Frequency Tolerance
(1)
Internal Low Frequency Clock for BLE Synchronization:
32.768 kHz Crystal Frequency Tolerance
(1)
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator
(2)
RF Frequency tolerance:
For BLE operation Channels0 to 39
(1)
(2)
including initial tolerance, drift, aging, and frequency pulling
Frequency tolerance after calibration
Max
+/- 40
+/- 40
+/- 250
+/- 40
Unit
ppm
ppm
ppm
ppm
2.6. Radio Specifications
Parameter
Frequency Range
Channel 0 to 39 Spacing
Output Power Channels0 to 39
Rx sensitivity Level for BER <0,1% ideal Tx
Antenna Gain
EIRP
Range Open field @1m height
Data Rate
-19.4
100
1000 / 2000
-20
-96
0.6
4.6
Min
2402
2
+4
Typ
Max
2480
Unit
Mhz
Mhz
dBm
dBm
dBi
dBm
m
kbps
May 24, 2019
Document Ref: isp_ble_DS1507_R13.docx
Page 5/28
Insight SiP
– Green Sid e – 400 ave nue Rou m anille – B P 30 9 – 06906 S ophia- Ant ipolis C edex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
