型号
- 型号
- 关键词
| 型号 | ISP1760ETUM | ISP1760ETGA | ISP1760ET | ISP1760BEUM | ISP1760BEGA |
|---|---|---|---|---|---|
| 描述 | Bus Controller, PBGA128 | Bus Controller, PBGA128 | USB Bus Controller, CMOS, PBGA128, 9 X 9 MM, 0.80 MM HEIGHT, PLASTIC, MO-195, SOT-857-1, TFBGA-128 | Bus Controller, PQFP128 | Bus Controller, PQFP128 |
| 厂商名称 | ST-Ericsson | ST-Ericsson | ST-Ericsson | ST-Ericsson | ST-Ericsson |
| 包装说明 | FBGA, BGA128,16X16,20 | FBGA, BGA128,16X16,20 | TFBGA, | QFP, QFP128,.63X.87,20 | QFP, QFP128,.63X.87,20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PBGA-B128 | S-PBGA-B128 | S-PBGA-B128 | R-PQFP-G128 | R-PQFP-G128 |
| 端子数量 | 128 | 128 | 128 | 128 | 128 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | TFBGA | QFP | QFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD |
| Is Samacsys | N | N | N | - | - |
| 封装等效代码 | BGA128,16X16,20 | BGA128,16X16,20 | - | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
| 电源 | 1.8/3.3,3.3/5 V | 1.8/3.3,3.3/5 V | - | 1.8/3.3,3.3/5 V | 1.8/3.3,3.3/5 V |
| Base Number Matches | 1 | 1 | 1 | - | - |