I
NTEGRATED
C
IRCUITS
D
IVISION
Features
•
4A Source/Sink Drive Current
•
Wide Operating Voltage Range: 4.5V to 35V
•
-40°C to +125°C Extended Operating Temperature
Range
•
Logic Input Withstands Negative Swing of up to 5V
•
Outputs May be Connected in Parallel for Higher
Drive Current
•
Matched Rise and Fall Times
•
Low Propagation Delay Time
•
Low, 10A Supply Current
•
Low Output Impedance
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate drivers are especially well suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of current
while producing voltage rise and fall times of less than
10ns. The input of each driver is virtually immune to
latch up, and proprietary circuitry eliminates cross
conduction and current “shoot-through.” Low
propagation delay and fast, matched rise and fall times
make the IXD_604 family ideal for high-frequency and
high-power applications.
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The IXD_604 family is available in a standard 8-pin
DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an
exposed metal back (SI), and an 8-pin DFN (D2)
package.
IXD_604
Applications
•
•
•
•
•
•
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Ordering Information
Part Number
IXDD604D2TR
IXDD604PI
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604PI
IXDF604SI
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604PI
IXDI604SI
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604PI
IXDN604SI
IXDN604SITR
IXDN604SIA
IXDN604SIATR
DS-IXD_604-R09
Logic
Configuration
ENA
INA
ENB
INB
Package Type
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
Packing
Method
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Quantity
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
1
A
OUTA
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
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I
NTEGRATED
C
IRCUITS
D
IVISION
IXD_604
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: T
A
= 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: -40°C < T
A
< +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
6
6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10
10
10
10
11
2
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R09
I
NTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Pin Configurations
IXDD604PI/SI/SIA
ENA
INA
GND
INB
1
2
3
4
8
ENB
OUTA
V
CC
OUTB
ENA
INA
INB
ENB
1
2
3
4
IXD_604
1.2 Pin Definitions
IXDD604D2
8
OUTA
GND
V
CC
OUTB
Pin Name
INA
INB
ENA
Description
Channel A Logic Input
Channel B Logic Input
Channel A Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
Channel B Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
Supply Voltage - Provides power to the device
Ground - Common ground reference for the
device
A
7
6
A
B
7
6
5
B
5
IXDI604PI/SI/SIA
NC
INA
GND
INB
1
2
3
4
8
NC
OUTA
V
CC
OUTB
NC
INA
GND
INB
IXDF604PI/SI/SIA
1
2
3
4
8
NC
OUTA
V
CC
OUTB
A
7
6
A
7
6
ENB
OUTA
OUTA
OUTB
OUTB
V
CC
GND
B
5
B
5
IXDN604PI/SI/SIA
NC
INA
GND
INB
1
2
3
4
8
NC
OUTA
V
CC
OUTB
A
7
6
B
5
1.3 Absolute Maximum Ratings
Parameter
Supply Voltage
Input Voltage
Output Current
Output Pulsed Current (0.5s)
Junction Temperature
Storage Temperature
Symbol
V
CC
V
INx
, V
ENx
I
OUT
I
out_pulsed
T
J
T
STG
Minimum
-0.3
-5
-
-
-55
-65
Maximum
40
V
CC
+0.3
±4
±5
Units
V
V
A
A
°C
°C
+150
+150
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature Range
Symbol
V
CC
T
A
Range
4.5 to 35
-40 to +125
Units
V
°C
R09
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I
NTEGRATED
C
IRCUITS
D
IVISION
1.5 Electrical Characteristics: T
A
= 25°C
Test Conditions: 4.5V < V
CC
< 35V, one channel (unless otherwise noted).
Parameter
Input Voltage, High
Input Voltage, Low
Input Current
High EN Input Voltage
Low EN Input Voltage
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Output Current, Continuous
Rise Time
Fall Time
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
Enable Pull-Up Resistor
Power Supply Current
Conditions
4.5V
<
V
CC
<
18V
4.5V
<
V
CC
<
18V
0V
<
V
IN
<
V
CC
IXDD604 only
IXDD604 only
-
-
V
CC
=18V, I
OUT
=-10mA
V
CC
=18V, I
OUT
=10mA
Limited by package power
dissipation
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
IXDD604 only, V
CC
=18V
IXDD604 only, V
CC
=18V
-
V
CC
=18V, V
IN
=3.5V
V
CC
=18V, V
IN
=0V
V
CC
=18V, V
IN
=V
CC
Symbol
V
IH
V
IL
I
IN
V
ENH
V
ENL
V
OH
V
OL
R
OH
R
OL
I
DC
t
r
t
f
t
ondly
t
offdly
t
ENOH
t
DOLD
R
EN
I
CC
Minimum
3.0
-
-
2/3V
CC
-
V
CC
-0.025
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typical
-
-
-
-
-
-
-
1.3
1.1
-
9
8
29
35
35
40
200
1
<1
<1
IXD_604
Maximum
-
0.8
±10
-
1/3V
CC
-
0.025
2.5
2
±1
16
14
50
50
55
55
-
3
10
10
Units
V
A
V
V
A
ns
k
mA
A
1.6 Electrical Characteristics: -40°C
<
T
A
<
+125°C
Test Conditions: 4.5V < V
CC
< 35V, one channel (unless otherwise noted).
Parameter
Input Voltage, High
Input Voltage, Low
Input Current
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Output Current, Continuous
Rise Time
Fall Time
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
Power Supply Current
Conditions
4.5V
<
V
CC
<
18V
4.5V
<
V
CC
<
18V
0V
<
V
IN
<
V
CC
-
-
V
CC
=18V, I
OUT
=-10mA
V
CC
=18V, I
OUT
=10mA
Limited by package power
dissipation
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
IXDD604 only, V
CC
=18V
IXDD604 only, V
CC
=18V
V
CC
=18V, V
IN
=3.5V
V
CC
=18V, V
IN
=0V
V
CC
=18V, V
IN
=V
CC
Symbol
V
IH
V
IL
I
IN
V
OH
V
OL
R
OH
R
OL
I
DC
t
r
t
f
t
ondly
t
offdly
t
ENOH
t
DOLD
I
CC
Minimum
3.3
-
-10
V
CC
-0.025
-
-
-
-
-
-
-
-
-
-
-
-
-
Maximum
-
0.65
10
-
0.025
3
2.5
±1
16
14
65
65
65
65
3.5
150
150
mA
A
ns
A
A
V
Units
V
4
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R09
I
NTEGRATED
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D
IVISION
1.7 Thermal Characteristics
Package
D2 (8-
Pin
DFN)
PI (8-Pin DIP)
SI (8-
Pin
Power SOIC)
SIA (8-
Pin
SOIC)
SI (8-
Pin
Power SOIC)
Thermal Resistance, Junction-to-Case
JC
Thermal Resistance, Junction-to-Ambient
JA
Parameter
Symbol
Rating
35
125
85
120
10
IXD_604
Units
°C/W
°C/W
2 IXD_604 Performance
2.1 Timing Diagrams
V
IH
INx
V
IL
t
offdly
t
ondly
90%
OUTx
90%
10%
t
f
t
r
t
r
t
f
OUTx
10%
INx
V
IH
V
IL
t
ondly
t
offdly
2.2 Characteristics Test Diagram
+
0.1μF
10μF
V
CC
-
V
CC
V
IN
INA
INB
V
CC
OUTA
OUTB
C
LOAD
Tektronix
Current Probe
6302
ENA
ENB
GND
C
LOAD
Tektronix
Current Probe
6302
R09
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