I
NTEGRATED
C
IRCUITS
D
IVISION
Features
•
2A Peak Source/Sink Drive Current
•
Wide Operating Voltage Range: 4.5V to 35V
•
-40°C to +125°C Extended Operating Temperature
Range
•
Logic Input Withstands Negative Swing of up to 5V
•
Outputs May be Connected in Parallel for Higher
Drive Current
•
Matched Rise and Fall Times
•
Low Propagation Delay Time
•
Low 10A Supply Current
•
Low Output Impedance
2-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Description
The IXDF602/IXDI602/IXDN602 dual high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each of the two outputs
can source and sink 2A of peak current while
producing voltage rise and fall times of less than 10ns.
The input of each driver is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_602 family
ideal for high-frequency and high-power applications.
The IXDN602 is configured as a dual non-inverting
driver, the IXDI602 is configured as a dual inverting
driver, and the IXDF602 has one inverting and one
non-inverting driver.
The IXD_602 family is available in a standard 8-pin
DIP (PI), an 8-pin SOIC (SIA), an 8-pin Power SOIC
with an exposed metal back (SI), and an 8-pin DFN
(D2) package.
IXD_602
Applications
•
•
•
•
•
•
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Pb
Ordering Information
Part Number
IXDF602D2TR
IXDF602PI
IXDF602SI
IXDF602SITR
IXDF602SIA
IXDF602SIATR
IXDI602D2TR
IXDI602PI
IXDI602SI
IXDI602SITR
IXDI602SIA
IXDI602SIATR
IXDN602D2TR
IXDN602PI
IXDN602SI
IXDN602SITR
IXDN602SIA
IXDN602SIATR
e
3
Logic
Configuration
Package Type
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
8-Pin SOIC
Packing
Method
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Quantity
2000
50
100
2000
100
2000
2000
50
100
2000
100
2000
2000
50
100
2000
100
2000
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
DS-IXD_602-R05
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1
I
NTEGRATED
C
IRCUITS
D
IVISION
IXD_602
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: T
A
= 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: T
A
= - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
5
2. IXD_602 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IXDI602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IXDF602. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IXDN602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10
10
10
11
2
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R05
I
NTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Pin Configurations
IXDF602
NC
INA
GND
INB
1
2
3
4
8
NC
OUTA
V
CC
OUTB
IXD_602
1.2 Pin Definitions
Pin Name
INA
INB
OUTA
OUTA
OUTB
OUTB
8
NC
OUTA
V
CC
OUTB
7
6
Description
Channel A Logic Input
Channel B Logic Input
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
Channel B Output - Sources or sinks current to
turn on or turn off a discrete MOSFET or IGBT
Supply Voltage - Provides power to the device
Ground - Common ground reference for the
device
A
7
6
B
5
IXDI602
NC
INA
GND
INB
1
2
3
4
A
V
CC
GND
B
5
IXDN602
NC
INA
GND
INB
1
2
3
4
8
NC
OUTA
V
CC
OUTB
A
7
6
B
5
1.3 Absolute Maximum Ratings
Parameter
Supply Voltage
Input Voltage
Output Current
Junction Temperature
Storage Temperature
Symbol
V
CC
V
IN
I
OUT
T
J
T
STG
Minimum
-0.3
-5.0
-
-55
-65
Maximum
40
V
CC
+0.3
±2
+150
+150
Units
V
V
A
°C
°C
Unless otherwise specified, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature Range
R05
Symbol
V
CC
T
A
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Range
4.5 to 35
-40 to +125
Units
V
°C
3
I
NTEGRATED
C
IRCUITS
D
IVISION
1.5 Electrical Characteristics: T
A
= 25°C
Test Conditions: 4.5V < V
CC
< 35V, one channel (unless otherwise noted).
Parameter
Input Voltage, High
Input Voltage, Low
Input Current
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Output Current, Continuous
Rise Time
Fall Time
On-Time Propagation Delay
Off-Time Propagation Delay
Power Supply Current
Conditions
4.5V < V
CC
< 18V
4.5V < V
CC
< 18V
0V < V
IN
< V
CC
-
-
V
CC
=18V, I
OUT
=-10mA
V
CC
=18V, I
OUT
=10mA
Limited by package power
dissipation
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, V
IN
=3.5V
V
CC
=18V, V
IN
=0V
V
CC
=18V, V
IN
=V
CC
Symbol
V
IH
V
IL
I
IN
V
OH
V
OL
R
OH
R
OL
I
DC
t
r
t
f
t
ondly
t
offdly
I
CC
IXD_602
Minimum
3.0
-
-
V
CC
-0.025
-
-
-
-
-
-
-
-
-
-
-
Typical
-
-
-
-
-
2.5
1.5
-
7.5
6.5
35
38
1
<1
<1
Maximum
-
0.8
±10
-
0.025
4
3
±1
15
15
60
60
3
10
10
Units
V
A
V
A
ns
mA
A
1.6 Electrical Characteristics: T
A
= - 40°C to +125°C
Test Conditions: 4.5V < V
CC
< 35V, one channel (unless otherwise noted).
Parameter
Input Voltage, High
Input Voltage, Low
Input Current
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Output Current, Continuous
Rise Time
Fall Time
On-Time Propagation Delay
Off-Time Propagation Delay
Power Supply Current
Conditions
4.5V < V
CC
< 18V
4.5V < V
CC
< 18V
0V < V
IN
< V
CC
-
-
V
CC
=18V, I
OUT
=-10mA
V
CC
=18V, I
OUT
=10mA
Limited by package power
dissipation
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, C
LOAD
=1000pF
V
CC
=18V, V
IN
=3.5V
V
CC
=18V, V
IN
=0V
V
CC
=18V, V
IN
=V
CC
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Symbol
V
IH
V
IL
I
IN
V
OH
V
OL
R
OH
R
OL
I
DC
t
r
t
f
t
ondly
t
offdly
I
CC
Minimum
3.3
-
-10
V
CC
-0.025
-
-
-
-
-
-
-
-
-
-
-
Maximum
-
0.65
10
-
0.025
6
5
±1
18
18
75
75
3.5
150
150
Units
V
A
V
A
ns
mA
A
4
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
1.7 Thermal Characteristics
Package
IXDD602D2 (8-Pin DFN)
IXD_602PI (8-Pin DIP)
IXD_602SI (8-Pin Power SOIC)
IXD_602SIA (8-Pin SOIC)
IXD_602SI (8-Pin Power SOIC)
Thermal Resistance, Junction-to-Case
JC
Thermal Resistance, Junction-to-Ambient
JA
Parameter
Symbol
Rating
35
125
85
120
10
IXD_602
Units
°C/W
°C/W
2 IXD_602 Performance
2.1 Timing Diagrams
V
IH
INx
V
IL
t
ondly
90%
OUTx
10%
t
r
t
f
OUTx
90%
10%
t
f
t
r
t
offdly
INx
V
IH
V
IL
t
offdly
t
ondly
Non-Inverting Driver Waveforms
2.2 Characteristics Test Diagram
Inverting Driver Waveforms
+
V
CC
INA
INB
GND
V
IN
Tektronix
Current Probe
6302
OUTA
OUTB
C
LOAD
Tektronix
Current Probe
6302
0.1μF
10μF
V
CC
-
C
LOAD
R05
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5
