型号
- 型号
- 关键词
Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TQFP-100
器件类别：存储
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | KM4132G271BTQ-12 | KM4132G271BQ-12 | KM4132G271BTQ-H | KM4132G271BQ-H |
|---|---|---|---|---|
| 描述 | Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TQFP-100 | Synchronous Graphics RAM, 256KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 3 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100 | Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 14 X 20 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TQFP-100 | Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 14 X 20 MM, 3 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | TQFP, | QFP, | TQFP, | QFP, |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| 最长访问时间 | 8 ns | 8 ns | 6 ns | 6 ns |
| 其他特性 | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH | AUTO REFRESH/SELF REFRESH |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM | SYNCHRONOUS GRAPHICS RAM |
| 内存宽度 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TQFP | QFP | TQFP | QFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, THIN PROFILE | FLATPACK | FLATPACK, THIN PROFILE | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 3 mm | 1.2 mm | 3 mm |
| 自我刷新 | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |