型号
- 型号
- 关键词
Video DRAM, 256KX4, 60ns, CMOS, PDSO28, PLASTIC, TSOP2-28
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | KM424C257T-6 | KM424C257T-10 | KM424C257J-10 | KM424C257T-8 | KM424C257Z-10 |
|---|---|---|---|---|---|
| 描述 | Video DRAM, 256KX4, 60ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Video DRAM, 256KX4, 100ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Video DRAM, 256KX4, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Video DRAM, 256KX4, 80ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Video DRAM, 256KX4, 100ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | TSOP | TSOP | SOJ | TSOP | ZIP |
| 包装说明 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 | TSOP2, TSOP28,.46 | ZIP, ZIP28,.1 |
| 针数 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 100 ns | 100 ns | 80 ns | 100 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PZIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | SOJ | TSOP2 | ZIP |
| 封装等效代码 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 | TSOP28,.46 | ZIP28,.1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 3.76 mm | 1.2 mm | 10.16 mm |
| 最大待机电流 | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| 最大压摆率 | 0.17 mA | 0.14 mA | 0.14 mA | 0.15 mA | 0.14 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | J BEND | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 2.96 mm |
| 长度 | 18.41 mm | 18.41 mm | 18.42 mm | 18.41 mm | - |
