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KM68V4000BLZI-8L

Standard SRAM, 512KX8, 85ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48

器件类别:存储    存储   

厂商名称:SAMSUNG(三星)

厂商官网:http://www.samsung.com/Products/Semiconductor/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SAMSUNG(三星)
零件包装代码
BGA
包装说明
VFBGA, BGA36,6X8,30
针数
48
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.A
最长访问时间
85 ns
I/O 类型
COMMON
JESD-30 代码
R-PBGA-B48
JESD-609代码
e0
长度
11.65 mm
内存密度
4194304 bit
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端子数量
48
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
512KX8
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装等效代码
BGA36,6X8,30
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
座面最大高度
0.81 mm
最大待机电流
0.00002 A
最小待机电流
2 V
最大压摆率
0.09 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
0.75 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.2 mm
文档预览
KM68V4000BZ, KM68U4000BZ Family
Document Title
512Kx8 Low Voltage & Low Power SRAM
Data Sheets for 48-CSP
Preliminary
CMOS SRAM
Revision History
Rev. No.
Rev. 0.0
History
- 1′st edition
- Package Dimension Finalized
Draft Data
Feb. 4′th, 1997
Remark
Preliminary
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics reserve CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters
of
this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or contact Headquarters
.
Revision 0.0
February 1997
KM68V4000BZ, KM68U4000BZ Family
512Kx8 bit Low Power and Low Voltage CMOS SRAM
with 48-CSP(Chip Scale Package)
FEATURES
¡Ü
¡Ü
Preliminary
CMOS SRAM
GENERAL DESCRIPTION
The KM68V4000BZ and KM68U4000BZ family are fabricated
by SAMSUNG′s advanced Full CMOS process technology. The
family can support various operating temperature ranges and
has very small size with 0.75 ball pitch and 6 x 8 ball array. The
family also support low data retention voltage for battery back-
up operation with low data retention current.
¡Ü
¡Ü
¡Ü
¡Ü
Process Technology : 0.4µm CMOS
Organization : 512Kx8
Power Supply Voltage
KM68V4000BZ Family : 3.3V±0.3V
KM68U4000BZ Family : 3.0V±0.3V
Low Data Retention Voltage : 2V(Min)
Three state output and TTL Compatible
Package Type : 48-CSP with 0.75mm ball pitch
PRODUCT FAMILY
Power Dissipation
Product
Family
KM68V4000BLZ-L
KM68U4000BLZ-L
KM68V4000BLZI-L
KM68U4000BLZI-L
Operating
Temp.Range
Commercial
(0~70°C)
Industrial
(-40~85°C)
Vcc Range
Speed
(ns)
85
100
85
100
Standby
(I
SB1
)
15µA
(Max)
20µA
(Max)
Operating
(I
CC2
)
70mA(Max)
70mA(Max)
70mA(Max)
70mA(Max)
48-CSP
(6x8 ball area with
0.75mm ball pitch)
PKG Type
3.0~3.6V
2.7~3.3V
3.0~3.6V
2.7~3.3V
48-CSP PIN TOP VIEW
1
A
B
C
D
E
F
G
H
A
0
I/O
5
I/O
6
V
SS
V
CC
I/O
7
I/O
8
A
9
OE
A
10
A
18
CS
A
11
A
17
A
16
A
12
A
15
A
13
2
A
1
A
2
3
N.C
WE
NC
4
A
3
A
4
A
5
5
A
6
A
7
6
A
8
I/O
1
I/O
2
V
CC
V
SS
I/O
3
I/O
4
A
14
FUNCTIONAL BLOCK DIAGRAM
X-Decorder
A
2~7
, A
12
,
A
14
, A
16
, A
18
Cell
Array
A
0
, A
1
, A
8~11
,
A
13
, A
15
, A
17
Y-Decorder
Control
Logic
I/O Buffer
I/O
1~8
CS, WE, OE
Name
A
0
~A
18
WE
CS
OE
Function
Address Inputs
Write Enable Input
Chip Select Input
Output Enable Input
Name
Vcc
Vss
Function
Power
Ground
I/O
1
~I/O
8
Data Inputs/Outputs
SAMSUNG ELECTRONICS CO., LTD.
reserves the right
to change products and specifications without notice.
Revision 0.0
February 1997
KM68V4000BZ, KM68U4000BZ Family
PRODUCT LIST & ORDERING INFORMATION
PRODUCT LIST
Commercial Temp Product
(0~70°C)
Part Name
KM68V4000BLZ-8L
KM68U4000BLZ-10L
Function
48-CSP, 85ns, 3.3V, LL
48-CSP, 100ns, 3.0V, LL
Part Name
KM68V4000BLZI-8L
KM68U4000BLZI-10L
Preliminary
CMOS SRAM
Industrial Temp Product
(-40~85°C)
Function
48-CSP, 85ns, 3.3V, LL
48-CSP, 100ns, 3.0V, LL
ORDERING INFORMATION
KM6 8 X 4000 B X X X - X X
L-Low Low Power, Blank-Low Power or Normal Power
Access Time : 8=85ns, 10=100ns
Operating Temperature : Blank=Commercial, I=Industrial
Package Type : T=TSOP Forward, R=TSOP Reverse
Z=48-CSP with 0.75mm pitch
L-Low Power, LL-Low Low Power, Blank-Normal Power
Die Version : B=2′nd revision
Density : 4000=4Mbit
V=3.0~3.6V, U=2.7~3.3V
Organization : 8= x8
SEC Standard SRAM
Revision 0.0
February 1997
KM68V4000BZ, KM68U4000BZ Family
ABSOLUTE MAXIMUM RATINGS
*
Item
Voltage on any pin relative to Vss
Voltage on Vcc supply relative to Vss
Power Dissipation
Storage temperature
Symbol
V
IN
,V
OUT
V
CC
P
D
T
STG
Ratings
-0.5 to V
CC
+0.5
-0.3 to 4.6
0.7
-65 to 150
0 to 70
Operating Temperature
T
A
-40 to 85
Soldering temperature and time
T
SOLDER
260°C, 10sec(Lead Only)
°C
-
Unit
V
V
W
°C
°C
Preliminary
CMOS SRAM
Remark
-
-
-
-
KM68V4000BLZ-L
KM68U4000BLZ-L
KM68V4000BLZI-L
KM68U4000BLZI-L
-
* Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional opera tion should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect r eliability.
RECOMMENDED DC OPERATING CONDITIONS
*
Item
Supply voltage
Ground
Input high voltage
Input low voltage
Symbol
Vcc
Vss
V
IH
V
IL
Product
KM68V4000BZ Family
KM68U4000BZ Family
All Family
KM68V4000BZ Family
KM68U4000BZ Family
KM68V4000BZ Family
KM68U4000BZ Family
Min
3.0
2.7
0
2.2
2.2
-0.3***
-0.3***
Typ**
3.3
3.0
0
-
-
-
-
Max
3.6
3.3
0
Vcc+0.3
Vcc+0.3
0.4
0.4
Unit
V
V
V
V
V
V
V
* 1) Commercial Product : T
A
=0 to 70°C, unless otherwise specified
2) Industrial Product : T
A
=-40 to 85°C, unless otherwise specified
** T
A
=25°C
*** V
IL
(Min)=-3.0V for
≤30ns
pulse width
CAPACITANCE*
(f=1MHz, T
A
=25°C)
Item
Input capacitance
Input/Output capacitance
* Capacitance is sampled not, 100% tested
Symbol
C
IN
C
IO
Test Condition
V
IN
=0V
V
IO
=0V
Min
-
-
Max
8
10
Unit
pF
pF
Revision 0.0
February 1997
KM68V4000BZ, KM68U4000BZ Family
DC AND OPERATING CHARACTERISTICS
Item
Input leakage current
Output leakage current
Operating power supply current
Symbol
I
LI
I
LO
I
CC
V
IN
=Vss to Vcc
CS=V
IH
or V
IL,
V
IO
=Vss to Vcc
CS=V
IL
, V
IN
=V
IH
or V
IL
,
I
I0
=0mA
Cycle time=1µs100%duty
CS≤0.2V, V
IL
≤0.2V,
V
IH
≥Vcc-0.2V,
I
IO
=0mA
Read
Write
Read
Write
Test Conditions*
Min
-1
-1
-
-
-
-
-
-
2.4
-
Low Low Power
Low Low Power
I
SB1
KM68U4000BLZ-L
KM68U4000BLIZ-L
CS≥Vcc-0.2V, Others=0~Vcc
Low Low Power
Low Low Power
-
-
-
-
Preliminary
CMOS SRAM
Typ**
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max
1
1
20
40
20
Unit
µA
µA
mA
I
CC1
Average operating current
I
CC2
Output low voltage
Output high voltage
Standby Current(TTL)
KM68V4000BLZ-L
Standby
Current
(CMOS)
KM68V4000BLZI-L
V
OL
V
OH
I
SB
mA
40
90
0.4
-
0.5
15
20
15
20
mA
V
V
mA
µA
µA
µA
µA
Min cycle, 100%duty, I
IO
=0mA, CS=V
IL
,V
IN
=V
IH
or V
IL
I
OL
=2.1mA
I
OH
=-1.0mA
CS=V
IH
* 1) Commercial Product : T
A
=0 to 70°C, Vcc=3.3±0.3V (68V4000BLZ/-L Family), Vcc=3.0±0.3V (68U4000BLZ/-L Family)
2) Industrial Product : T
A
=-40 to 85°C, Vcc=3.3±0.3V (68V4000BLZI/-L Family), Vcc=3.0±0.3V (68U4000BLZI/-L Family)
** T
A
=25°C
A.C OPERATING CONDITIONS
TEST CONDITIONS
(1.Test Load and Test Input/Output Reference)*
Item
Input pulse level
Input rising and falling time
input and output reference voltage
Output load (See right)
* See DC Operating conditions
Value
0.4 to 2.2V
5ns
1.5V
C
L
=100pF+1TTL
Remark
-
-
-
-
* Including scope and jig capacitance
C
L
*
Revision 0.0
February 1997
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参数对比
与KM68V4000BLZI-8L相近的元器件有:KM68V4000BLZ-8L、KM68U4000BLZI-10L、KM68U4000BLZ-10L。描述及对比如下:
型号 KM68V4000BLZI-8L KM68V4000BLZ-8L KM68U4000BLZI-10L KM68U4000BLZ-10L
描述 Standard SRAM, 512KX8, 85ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48 Standard SRAM, 512KX8, 85ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48 Standard SRAM, 512KX8, 100ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48 Standard SRAM, 512KX8, 100ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 BGA BGA BGA BGA
包装说明 VFBGA, BGA36,6X8,30 VFBGA, BGA36,6X8,30 VFBGA, BGA36,6X8,30 VFBGA, BGA36,6X8,30
针数 48 48 48 48
Reach Compliance Code unknown unknown unknown unknow
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 85 ns 85 ns 100 ns 100 ns
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48
JESD-609代码 e0 e0 e0 e0
长度 11.65 mm 11.65 mm 11.65 mm 11.65 mm
内存密度 4194304 bit 4194304 bit 4194304 bit 4194304 bi
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 48 48 48 48
字数 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 70 °C
组织 512KX8 512KX8 512KX8 512KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA
封装等效代码 BGA36,6X8,30 BGA36,6X8,30 BGA36,6X8,30 BGA36,6X8,30
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.81 mm 0.81 mm 0.81 mm 0.81 mm
最大待机电流 0.00002 A 0.000015 A 0.00002 A 0.000015 A
最小待机电流 2 V 2 V 2 V 2 V
最大压摆率 0.09 mA 0.09 mA 0.09 mA 0.09 mA
最大供电电压 (Vsup) 3.6 V 3.3 V 3.3 V 3.3 V
最小供电电压 (Vsup) 3 V 3 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3 V 3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 0.75 mm 0.75 mm 0.75 mm 0.75 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.2 mm 7.2 mm 7.2 mm 7.2 mm
厂商名称 SAMSUNG(三星) - SAMSUNG(三星) SAMSUNG(三星)
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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