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KMPC870VR133

Microprocessors - MPU PQ I HIP6W DUET

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
BGA
包装说明
HBGA, BGA256,16X16,50
针数
256
Reach Compliance Code
unknown
ECCN代码
5A992
地址总线宽度
32
位大小
32
边界扫描
YES
外部数据总线宽度
32
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B256
JESD-609代码
e1
长度
23 mm
低功率模式
YES
湿度敏感等级
3
端子数量
256
封装主体材料
PLASTIC/EPOXY
封装代码
HBGA
封装等效代码
BGA256,16X16,50
封装形状
SQUARE
封装形式
GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度)
245
电源
1.8,3.3 V
认证状态
Not Qualified
座面最大高度
2.54 mm
速度
133 MHz
最大供电电压
1.9 V
最小供电电压
1.7 V
标称供电电压
1.8 V
表面贴装
YES
技术
CMOS
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
23 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
文档预览
Freescale Semiconductor
Technical Data
Document Number: MPC875EC
Rev. 4, 08/2007
MPC875/MPC870 PowerQUICC™
Hardware Specifications
This hardware specification contains detailed information on
power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MPC875/MPC870. The
CPU on the MPC875/MPC870 is a 32-bit core built on
Power Architecture™ technology that incorporates memory
management units (MMUs) and instruction and data caches.
For functional characteristics of the MPC875/MPC870, refer
to the
MPC885 PowerQUICC™ Family Reference Manual.
To locate published errata or updates for this document, refer
to the MPC875/MPC870 product summary page on our
website listed on the back cover of this document or, contact
your local Freescale sales office.
1.
2.
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4.
5.
6.
7.
8.
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10.
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12.
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17.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 9
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal Calculation and Measurement . . . . . . . . . . 12
Power Supply and Power Sequencing . . . . . . . . . . . 14
Mandatory Reset Configurations . . . . . . . . . . . . . . . 15
Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 17
IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 45
CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 47
USB Electrical Characteristics . . . . . . . . . . . . . . . . . 67
FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67
Mechanical Data and Ordering Information . . . . . . . 71
Document Revision History . . . . . . . . . . . . . . . . . . . 80
© Freescale Semiconductor, Inc., 2003–2007. All rights reserved.
Overview
1
Overview
The MPC875/MPC870 is a versatile single-chip integrated microprocessor and peripheral combination
that can be used in a variety of controller applications and communications and networking systems. The
MPC875/MPC870 provides enhanced ATM functionality over that of other ATM-enabled members of the
MPC860 family.
Table 1
shows the functionality supported by the MPC875/MPC870.
Table 1. MPC875/MPC870 Devices
Cache (Kbytes)
Part
I Cache
MPC875
MPC870
8
8
D Cache
8
8
10BaseT
1
10/100
2
2
1
1
1
1
1
Ethernet
SCC
SMC
USB
Security
Engine
Yes
No
2
Features
The MPC875/MPC870 is comprised of three modules that each use the 32-bit internal bus: a MPC8xx
core, a system integration unit (SIU), and a communications processor module (CPM).
The following list summarizes the key MPC875/MPC870 features:
• Embedded MPC8xx core up to 133 MHz
• Maximum frequency operation of the external bus is 80 MHz (in 1:1 mode)
— The 133-MHz core frequency supports 2:1 mode only
— The 66-/80-MHz core frequencies support both the 1:1 and 2:1 modes
• Single-issue, 32-bit core (compatible with the Power Architecture definition) with thirty-two
32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch and without conditional
execution
— 8-Kbyte data cache and 8-Kbyte instruction cache (see
Table 1)
– Instruction cache is two-way, set-associative with 256 sets in 2 blocks
– Data cache is two-way, set-associative with 256 sets
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word)
cache blocks
– Caches are physically addressed, implement a least recently used (LRU) replacement
algorithm, and are lockable on a cache block basis
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address
spaces and 16 protection groups
— Advanced on-chip emulation debug mode
• Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
2
Freescale Semiconductor
Features
Thirty-two address lines
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank
— Up to 30 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROMs, Flash EPROMs, and other memory
devices
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbytes–256 Mbytes)
— Selectable write protection
— On-chip bus arbitration logic
General-purpose timers
— Four 16-bit timers or two 32-bit timers
— Gate mode can enable/disable counting
— Interrupt can be masked on reference match and event capture
Two Fast Ethernet controllers (FEC)—Two 10/100 Mbps Ethernet/IEEE Std. 802.3® CDMA/CS
that interface through MII and/or RMII interfaces
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Clock synthesizer
— Decrementer and time base
— Reset controller
— IEEE 1149.1™ Std. test access port (JTAG)
Security engine is optimized to handle all the algorithms associated with IPsec, SSL/TLS, SRTP,
IEEE 802.11i® standard, and iSCSI processing. Available on the MPC875, the security engine
contains a crypto-channel, a controller, and a set of crypto hardware accelerators (CHAs). The
CHAs are:
— Data encryption standard execution unit (DEU)
– DES, 3DES
– Two key (K1, K2, K1) or three key (K1, K2, K3)
– ECB and CBC modes for both DES and 3DES
— Advanced encryption standard unit (AESU)
– Implements the Rijndael symmetric key cipher
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Freescale Semiconductor
3
Features
– ECB, CBC, and counter modes
– 128-, 192-, and 256-bit key lengths
— Message digest execution unit (MDEU)
– SHA with 160- or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— Master/slave logic, with DMA
– 32-bit address/32-bit data
– Operation at MPC8xx bus frequency
— Crypto-channel supporting multi-command descriptors
– Integrated controller managing crypto-execution units
– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes
Interrupts
— Six external interrupt request (IRQ) lines
— Twelve port pins with interrupt capability
— Twenty-three internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
Communications processor module (CPM)
— RISC controller
— Communication-specific commands (for example,
GRACEFUL STOP TRANSMIT
,
ENTER HUNT
MODE
, and
RESTART TRANSMIT
)
— Supports continuous mode transmission and reception on all serial channels
— 8-Kbytes of dual-port RAM
— Several serial DMA (SDMA) channels to support the CPM
— Three parallel I/O registers with open-drain capability
On-chip 16
×
16 multiply accumulate controller (MAC)
— One operation per clock (two-clock latency, one-clock blockage)
— MAC operates concurrently with other instructions
— FIR loop—Four clocks per four multiplies
Four baud-rate generators
— Independent (can be connected to SCC or SMC)
— Allows changes during operation
— Autobaud support option
SCC (serial communication controller)
— Ethernet/IEEE 802.3® standard, supporting full 10-Mbps operation
— HDLC/SDLC
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
4
Freescale Semiconductor
Features
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support point-to-point protocol (PPP)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC))
SMC (serial management channel)
— UART (low-speed operation)
— Transparent
Universal serial bus (USB)—Supports operation as a USB function endpoint, a USB host
controller, or both for testing purposes (loopback diagnostics)
— USB 2.0 full-/low-speed compatible
— The USB function mode has the following features:
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— The USB host controller has the following features:
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and
data rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
Serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
Inter-integrated circuit (I
2
C) port
— Supports master and slave modes
— Supports a multiple-master environment
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Freescale Semiconductor
5
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参数对比
与KMPC870VR133相近的元器件有:KMPC875CVR66、KMPC875VR66、KMPC875ZT133、KMPC870CVR66、KMPC875CVR133、KMPC875ZT80、KMPC870ZT133、KMPC875CZT66、KMPC870CZT133。描述及对比如下:
型号 KMPC870VR133 KMPC875CVR66 KMPC875VR66 KMPC875ZT133 KMPC870CVR66 KMPC875CVR133 KMPC875ZT80 KMPC870ZT133 KMPC875CZT66 KMPC870CZT133
描述 Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET Microprocessors - MPU PQ I HIP6W DUET
是否Rohs认证 符合 符合 符合 不符合 符合 符合 不符合 不符合 不符合 不符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 PLASTIC, BGA-256 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50 HBGA, BGA256,16X16,50
针数 256 256 256 256 256 256 256 256 256 256
Reach Compliance Code unknown unknown unknown not_compliant unknown unknown not_compliant not_compliant not_compliant not_compliant
ECCN代码 5A992 5A002 5A002 5A002 5A992 5A002 5A002 5A992 5A002 5A992
地址总线宽度 32 32 32 32 32 32 32 32 32 32
位大小 32 32 32 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES YES YES YES
外部数据总线宽度 32 32 32 32 32 32 32 32 32 32
格式 FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES YES YES YES YES YES YES YES YES
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e1 e1 e1 e0 e1 e1 e0 e0 e0 e0
长度 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
低功率模式 YES YES YES YES YES YES YES YES YES YES
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
端子数量 256 256 256 256 256 256 256 256 256 256
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA HBGA
封装等效代码 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50 BGA256,16X16,50
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度) 245 245 245 245 245 245 245 245 245 245
电源 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
速度 133 MHz 66 MHz 66 MHz 133 MHz 66 MHz 133 MHz 80 MHz 133 MHz 66 MHz 133 MHz
最大供电电压 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
最小供电电压 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30 30 30
宽度 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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