PCM Codec, MU-Law, 1-Func, CMOS, CDIP16, CERDIP-16
厂商名称:SAMSUNG(三星)
厂商官网:http://www.samsung.com/Products/Semiconductor/
下载文档型号 | KT8554BJ | KT8557BD | KT8554BN | KT8557BJ | KT8557BN | KT8554BD |
---|---|---|---|---|---|---|
描述 | PCM Codec, MU-Law, 1-Func, CMOS, CDIP16, CERDIP-16 | PCM Codec, A-Law, 1-Func, CMOS, PDSO16, 0.300 INCH, SOP-16 | PCM Codec, MU-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, DIP-16 | PCM Codec, A-Law, 1-Func, CMOS, CDIP16, CERDIP-16 | PCM Codec, A-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, DIP-16 | PCM Codec, MU-Law, 1-Func, CMOS, PDSO16, 0.300 INCH, SOP-16 |
零件包装代码 | DIP | SOIC | DIP | DIP | DIP | SOIC |
包装说明 | DIP, DIP16,.3 | SOP, SOP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.3 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
压伸定律 | MU-LAW | A-LAW | MU-LAW | A-LAW | A-LAW | MU-LAW |
滤波器 | YES | YES | YES | YES | YES | YES |
最大增益公差 | 0.15 dB | 0.15 dB | 0.15 dB | 0.15 dB | 0.15 dB | 0.15 dB |
JESD-30 代码 | R-GDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-GDIP-T16 | R-PDIP-T16 | R-PDSO-G16 |
长度 | 19.495 mm | 10.25 mm | 19.4 mm | 19.495 mm | 19.4 mm | 10.25 mm |
线性编码 | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE |
负电源额定电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | DIP | DIP | SOP |
封装等效代码 | DIP16,.3 | SOP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 2.65 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.65 mm |
最大压摆率 | 0.009 mA | 0.009 mA | 0.009 mA | 0.009 mA | 0.009 mA | 0.009 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |