KU8230925,KU8230925 pdf中文资料,KU8230925引脚图,KU8230925电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

Intel(英特尔)

零件包装代码

QFP

包装说明

PLASTIC, QFP-100

针数

100

Reach Compliance Code

compliant

地址总线宽度

边界扫描

外部数据总线宽度

JESD-30 代码

S-PQFP-G100

JESD-609代码

长度

19.05 mm

低功率模式

区块数量

端子数量

100

最高工作温度

70 °C

最低工作温度

封装主体材料

PLASTIC/EPOXY

封装代码

BQFP

封装等效代码

SPQFP100,.9SQ

封装形状

SQUARE

封装形式

FLATPACK, BUMPER

电源

5 V

认证状态

Not Qualified

座面最大高度

4.572 mm

最大压摆率

180 mA

最大供电电压

5.5 V

最小供电电压

4.5 V

标称供电电压

5 V

表面贴装

YES

技术

CHMOS

温度等级

COMMERCIAL

端子面层

Tin/Lead (Sn/Pb)

端子形式

GULL WING

端子节距

0.635 mm

端子位置

QUAD

宽度

19.05 mm

uPs/uCs/外围集成电路类型

MEMORY CONTROLLER, DRAM

Base Number Matches

参数对比

与KU8230925相近的元器件有：KU8230920、KD8230920、KU8230916、KD8230925、KD82309SX16、KD82309SX20、KD8230916、KU82309SX20。描述及对比如下：

型号	KU8230925	KU8230920	KD8230920	KU8230916	KD8230925	KD82309SX16	KD82309SX20	KD8230916	KU82309SX20
描述	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100	DRAM Controller, CHMOS, PQFP100, PLASTIC, QFP-100
厂商名称	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	PLASTIC, QFP-100	PLASTIC, QFP-100	BQFP,	PLASTIC, QFP-100	BQFP,	BQFP,	BQFP,	BQFP,	BQFP,
针数	100	100	100	100	100	100	100	100	100
Reach Compliance Code	compliant	compliant	unknown	compliant	unknown	unknown	unknown	unknown	unknown
地址总线宽度	11	11	11	11	11	11	11	11	11
边界扫描	NO	NO	NO	NO	NO	NO	NO	NO	NO
外部数据总线宽度	8	8	8	8	8	8	8	8	8
JESD-30 代码	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
长度	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm
低功率模式	NO	NO	NO	NO	NO	NO	NO	NO	NO
区块数量	4	4	4	4	4	4	4	4	4
端子数量	100	100	100	100	100	100	100	100	100
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BQFP	BQFP	BQFP	BQFP	BQFP	BQFP	BQFP	BQFP	BQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER	FLATPACK, BUMPER
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CHMOS	CHMOS	CHMOS	CHMOS	CHMOS	CHMOS	CHMOS	CHMOS	CHMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm	19.05 mm
uPs/uCs/外围集成电路类型	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM	MEMORY CONTROLLER, DRAM