(1-Form-B) solid state relay featuring high sensitivity.
It uses optically coupled relay technology to provide
a 3750V
rms
isolation barrier between the input and
the output of the relay.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The LCB111 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no moving
parts, it can offer faster, bounce-free switching in a
more compact surface mount or thru-hole package.
Features
•
Low Input Control Current: 2mA
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Tape & Reel, Surface Mount Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LCB111
LCB111S
LCB111STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics of Normally
Closed Devices
Form-B
I
F
I
LOAD
10%
90%
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t
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LCB111
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
DC Configuration, Continuous
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
-
-
10ms
I
L
=120mA
I
L
=200mA
V
L
=350V
P
I
F
=2mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=120mA
-
I
F
=5mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
23
7
-
2
2
25
1
0.7
1.2
-
3
120
200
±350
35
10
1
5
5
-
2
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
ms
pF
mA
mA
V
A
pF
2
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Manufacturing Information
Moisture Sensitivity
LCB111
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCB111 / LCB111S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCB111 / LCB111S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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MECHANICAL DIMENSIONS
LCB111
8.382 ± 0.381
(0.330 ± 0.015)
7.239 TYP
(0.285 TYP)
LCB111
PCB Hole Pattern
6 - 0.800 DIA.
(6 - 0.031 DIA.)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
Dimensions
mm
(inches)
LCB111S
8.382 ± 0.381
(0.330 ± 0.015)
0.635 ± 0.127
(0.025 ± 0.005)
2.54 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
2.54
(0.10)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
1.65
(0.0649)
8.90
(0.3503)
Pin 1
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
0.65
(0.0255)
Dimensions
mm
(inches)
4
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LCB111
LCB111STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B
0
= 10.10
(0.398)
K
0
= 4.90
(0.19)
K
1
= 3.80
(0.15)
Embossed
Carrier
P = 12.00
(0.472)
A
0
= 10.10
(0.398)
Dimensions
mm
(inches)
User Direction of Feed
Embossment
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
