型号
- 型号
- 关键词
Video Imager, 12-Bit, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-047-AE, LCC-68
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：LOGIC Devices
厂商官网：http://www.logicdevices.com/
下载文档| 型号 | LF2301JC66 | LF2301GM30 | LF2301GMB30 | LF2301GMB66 | LF2301GM55 | LF2301GM66 | LF2301GC66 | LF2301GMB55 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Video Imager, 12-Bit, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-047-AE, LCC-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Video Imager, 12-Bit, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| 包装说明 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 15.15 MHz | 33.33 MHz | 33.33 MHz | 15.18 MHz | 18.18 MHz | 15.18 MHz | 15.15 MHz | 18.18 MHz |
| 外部数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| JESD-30 代码 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 输出数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| 封装等效代码 | LDCC68,1.0SQ | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm | 4.4196 mm |
| 最大压摆率 | 75 mA | 75 mA | 75 mA | 75 mA | 75 mA | 75 mA | 75 mA | 75 mA |
| 最大供电电压 | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING | DSP PERIPHERAL, VIDEO IMAGING |
| 厂商名称 | LOGIC Devices | - | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C |
