型号
- 型号
- 关键词
Circuit Board Hardware - PCB MINI SMT TEST POINT
厂商名称：Lattice(莱迪斯)
厂商官网：http://www.latticesemi.com
器件标准：
| 型号 | LFE3-35EA-8FN484C | LFE3-150EA-8FN1156CTW | BLU0603ER-2640-AT50Q | LFE3-70EA-7FN672C | LFE3-150EA-7FN672ITW | LFE3-150EA-8FN672CTW |
|---|---|---|---|---|---|---|
| 描述 | Circuit Board Hardware - PCB MINI SMT TEST POINT | FPGA - Field Programmable Gate Array 149K LUTs 586 I/O 1.2V -8 Speed | Fixed Resistor, Thin Film, 0.1W, 264ohm, 75V, 0.05% +/-Tol, 50ppm/Cel, 0603, | FPGA - Field Programmable Gate Array 66.5K LUTs 380 I/O SERDES 1.2V -7 Speed | FPGA - Field Programmable Gate Array 149K LUTs, 380 I/O, 1.2V, -7 Speed, Pb-Free, IND | |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | unknown | compliant | not_compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e1 | e1 | e0 | e1 | e1 | e1 |
| 端子数量 | 484 | 1156 | 2 | 672 | 672 | 672 |
| 最高工作温度 | 85 °C | 85 °C | 155 °C | 85 °C | 100 °C | 85 °C |
| 封装形式 | GRID ARRAY | GRID ARRAY | SMT | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| 厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | - | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
| 零件包装代码 | BGA | BGA | - | BGA | BGA | BGA |
| 包装说明 | BGA, BGA484,22X22,40 | 35 X 35 MM, LEAD FREE, FPBGA-1156 | - | BGA, BGA672,26X26,40 | 27 X 27 MM, LEAD FREE, FPBGA-672 | 27 X 27 MM, LEAD FREE, FPBGA-672 |
| 针数 | 484 | 1156 | - | 672 | 672 | 672 |
| 最大时钟频率 | 500 MHz | 500 MHz | - | 420 MHz | 420 MHz | 500 MHz |
| CLB-Max的组合延迟 | 0.281 ns | 0.281 ns | - | 0.335 ns | 0.335 ns | 0.281 ns |
| JESD-30 代码 | S-PBGA-B484 | S-PBGA-B1156 | - | S-PBGA-B672 | S-PBGA-B672 | S-PBGA-B672 |
| 长度 | 23 mm | 35 mm | - | 27 mm | 27 mm | 27 mm |
| 湿度敏感等级 | 3 | 3 | - | 3 | 3 | 3 |
| 输入次数 | 295 | 586 | - | 380 | 380 | 380 |
| 逻辑单元数量 | 33000 | 149000 | - | 67000 | 149000 | 149000 |
| 输出次数 | 295 | 586 | - | 380 | 380 | 380 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | - | BGA | BGA | BGA |
| 封装等效代码 | BGA484,22X22,40 | BGA1156,34X34,40 | - | BGA672,26X26,40 | BGA672,26X26,40 | BGA672,26X26,40 |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 峰值回流温度（摄氏度） | 250 | 250 | - | 250 | 250 | 250 |
| 电源 | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V |
| 可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | - | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.6 mm | 2.6 mm | - | 2.6 mm | 2.6 mm | 2.6 mm |
| 最大供电电压 | 1.26 V | 1.26 V | - | 1.26 V | 1.26 V | 1.26 V |
| 最小供电电压 | 1.14 V | 1.14 V | - | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 温度等级 | OTHER | OTHER | - | OTHER | INDUSTRIAL | OTHER |
| 端子形式 | BALL | BALL | - | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | - | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 |
| 宽度 | 23 mm | 35 mm | - | 27 mm | 27 mm | 27 mm |
