型号
- 型号
- 关键词
| 型号 | LM2512SM | LM2512SN | LM2512SMX |
|---|---|---|---|
| 描述 | SPECIALTY INTERFACE CIRCUIT, PBGA49 | SPECIALTY INTERFACE CIRCUIT, QCC40, 6 X 6 MM, 0.40 MM HEIGHT, 0.50 MM PITCH, LLP-40 | SPECIALTY INTERFACE CIRCUIT, PBGA49, 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, UFBGA-49 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | TFBGA, | HVQCCN, | TFBGA, |
| Reach Compliance Code | unknown | unknown | compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | S-PBGA-B49 | S-XQCC-N40 | S-PBGA-B49 |
| 长度 | 4 mm | 6 mm | 4 mm |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 49 | 40 | 49 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | TFBGA | HVQCCN | TFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.13 mm | 0.4 mm | 1.13 mm |
| 最大供电电压 | 2 V | 2 V | 2 V |
| 最小供电电压 | 1.6 V | 1.6 V | 1.6 V |
| 标称供电电压 | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | BALL | NO LEAD | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | QUAD | BOTTOM |
| 宽度 | 4 mm | 6 mm | 4 mm |
| JESD-609代码 | e0 | - | e0 |
| 湿度敏感等级 | 3 | - | 3 |
| 端子面层 | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn63Pb37) |