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LM2796TL

Dual-Display White LED Driver with 3/2x Switched Capacitor Boost

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:National Semiconductor(TI )

厂商官网:http://www.ti.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
National Semiconductor(TI )
包装说明
2.10 X 2.40 MM, 0.60 MM HEIGHT, THIN MICRO SMD, 18 PIN
Reach Compliance Code
_compli
ECCN代码
EAR99
接口集成电路类型
LED DISPLAY DRIVER
JESD-30 代码
R-PBGA-B18
JESD-609代码
e0
长度
2.403 mm
湿度敏感等级
1
复用显示功能
NO
功能数量
1
区段数
7
端子数量
18
最高工作温度
85 °C
最低工作温度
-30 °C
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装等效代码
BGA18,4X5,20/17
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
电源
3/5 V
认证状态
Not Qualified
座面最大高度
0.675 mm
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Lead (Sn63Pb37)
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
宽度
2.098 mm
文档预览
LM2796 Dual-Display White LED Driver with 3/2x Switched Capacitor Boost
February 2004
LM2796
Dual-Display White LED Driver with 3/2x Switched
Capacitor Boost
General Description
The LM2796 is a charge-pump based white-LED driver that
is ideal for mobile phone display backlighting. It can drive up
to 7 LEDs in parallel with up to 20mA through each LED.
Regulated internal current sources deliver excellent current
and brightness matching in all LEDs. The LED-driver current
sources are split into two independently controlled groups.
The primary group (4 LEDs) can be used to backlight the
main phone display. The second group (3 LEDs) can be
used to backlight a secondary display or to provide other
lighting features (keypad LEDs, for example). Brightness of
the two groups can be adjusted independently with pulse-
width modulated (PWM) digital signals.
The LM2796 works off an extended Li-Ion input voltage
range (2.7V to 5.5V). Voltage boost is achieved with a high-
efficiency 3/2x-gain charge pump.
The LM2796 is available in National’s chip-scale 18-bump
micro SMD package.
Features
n
Drives up to 7 LEDs with up to 20mA each
n
LEDs controlled in 2 Distinct Groups, for Backlighting 2
Displays (main LCD and sub-LCD)
n
Excellent Current and Brightness Matching
n
High-Efficiency 3/2x Charge Pump
n
Extended Li-Ion Input: 2.7V to 5.5V
n
PWM Brightness Control: 100Hz - 1kHz
n
18-bump Thin Micro SMD Package:
(2.1mm x 2.4mm x 0.6mm)
Applications
n
n
n
n
Mobile Phone Display Lighting
Mobile Phone Keypad Lighting
PDAs
General LED Lighting
Typical Application Circuit
20093801
© 2004 National Semiconductor Corporation
DS200938
www.national.com
LM2796
Connection Diagram
18-Bump Thin Micro SMD Package, Large Bump
NS Package Number TLA18
20093802
Pin Description
Pin #s
C1
D2
A3
A1, B2, A5, E1
A7
D6, E5, D4, E3
C5, B4, C3
B6
Pin Names
V
IN
GND
P
OUT
C1+, C1-, C2+,
C2-
EN
D1A, D2A, D3A,
D4A
D1B, D2B, D3B
EN-A
Ground
Charge pump output. Approximately 1.5xV
IN
Flying capacitor connections.
Enable pin. Logic input. High = normal operation, Low = shutdown (charge
pump and all current sources OFF).
LED Outputs - Group A
LED Outputs - Group B
Enable for Group-A LEDs (current outputs). Logic input.
High = Group-A LEDs ON. Low = Group A LEDs OFF.
Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.
Enable for Group-B LEDs (current outputs). Logic input.
High = Group-B LEDs ON. Low = Group B LEDs OFF.
Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.
Placing a resistor (R
SET
) between this pin and GND sets the LED current for
all LEDs. LED Current = 100 x (1.25V ÷ R
SET
).
Pin Descriptions
Input voltage. Input range: 2.7V to 5.5V.
E7
EN-B
C7
I
SET
Ordering Information
Order Information
LM2796TL
LM2796TLX
Package
TLA18 Micro SMD
Supplied As
250 Units, Tape & Reel
3000 Units, Tape & Reel
www.national.com
2
LM2796
Absolute Maximum Ratings
(Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN
pin voltage
EN, ENA, ENB pin voltages
Continuous Power Dissipation
(Note 3)
Junction Temperature (T
J-MAX
)
Storage Temperature Range
Maximum Lead Temperature
(Soldering, 10 sec.)
ESD Rating (Note 4)Human Body
Model:
Machine Model
-0.3V to 7.1V
-0.3V to (V
IN
+0.3V)
w/ 5.6V max
Internally Limited
150 C
-65
o
C to +150
o
C
265
o
C
2.0kV
200V
o
Operating Rating
Input Voltage Range
(Notes 1, 2)
2.7V to 5.5V
-30˚C to +125˚C
-30˚C to +85˚C
Junction Temperature (T
J
) Range
Ambient Temperature (T
A
) Range
(Note 5)
Thermal Properties
Juntion-to-Ambient Thermal
Resistance (θ
JA
), (Note 6)
100˚C/W
Electrical Characteristics
(Notes 2, 7)
Limits in standard typeface and typical values apply for T
J
= 25
o
C. Limits in
boldface
type apply over the full operating junction
temperature range (-30˚C
T
J
+85˚C) . Unless otherwise specified: V
IN
= 3.6V; V
Dxx
= 3.6V; V(EN) = 2.0V; Group A and
Group B LEDs not ON simultaneously (ENA = V
IN
and ENB = GND, or ENA = GND and ENB = V
IN
); R
SET
= 8.35kΩ; C
IN
, C
1
,
C
2
, and C
POUT
= 1µF. (Note 8)
Symbol
Parameter
Condition
3.0V
V
IN
4.2V, and V
IN
= 5.5V
2.5V
V
Dxx
3.8V;
R
SET
= 8.35kΩ
3.0V
V
IN
5.5V;
2.5V
V
Dxx
3.6V;
R
SET
= 6.25kΩ
I
Dxx
Output Current Regulation
3.0V
V
IN
5.5V;
2.5V
V
Dxx
3.9V;
R
SET
= 12.5kΩ
2.7V
V
IN
3.0V;
2.5V
V
Dxx
3.3V;
R
SET
= 8.35kΩ
ENA and ENB ON (all 7 I
DX
outputs active),
V
IN
= 3.0V, C
IN
= C
OUT
= 2.2µF
I
Dxx-MATCH
Current Matching Between Any
Two Group A Outputs or Group
B Outputs
I
Q
Quiescent Supply Current
V
IN
= 3.0V (Note 10)
Min
13.8
(-8%)
Typ
15
20
mA
10
mA
15
mA
15
1
Max
16.2
(+8%)
Units
mA
(%)
mA
%
2.7V
V
IN
4.2V;
No Load Current,
EN = ON, ENA = ENB = OFF
2.7V
V
IN
5.5V, EN = OFF
2.7V
V
IN
5.5V
3.5
6
mA
I
SD
V
SET
I
Dxx
/I
SET
R
OUT
V
HR
Shutdown Supply Current
I
SET
Pin Voltage
Output Current to Current Set
Ratio
3
1.25
100
2.7
320
4.5
µA
V
Charge Pump Output Resistance V
IN
= 3.0V
(Note 11)
Current Source Headroom
Voltage Requirement (Note 12)
I
Dxx
= 95% X I
Dxx
(nom)
R
SET
= 8.35kΩ
(I
Dxx
(nom)
15mA)
I
Dxx
= 95%X I
Dxx
(nom)
R
SET
= 12.5kΩ
(I
Dxx
(nom)
10mA)
3
mV
220
www.national.com
LM2796
Electrical Characteristics
(Notes 2, 7)
(Continued)
Limits in standard typeface and typical values apply for T
J
= 25
o
C. Limits in
boldface
type apply over the full operating junction
temperature range (-30˚C
T
J
+85˚C) . Unless otherwise specified: V
IN
= 3.6V; V
Dxx
= 3.6V; V(EN) = 2.0V; Group A and
Group B LEDs not ON simultaneously (ENA = V
IN
and ENB = GND, or ENA = GND and ENB = V
IN
); R
SET
= 8.35kΩ; C
IN
, C
1
,
C
2
, and C
POUT
= 1µF. (Note 8)
Symbol
f
SW
t
START
1.5x/1x
Parameter
Switching Frequency
Start-up Time
Charge pump gain cross-over:
Gain = 1.5 when V
IN
is below
threshold. Gain = 1 when V
IN
is
above threshold.
Input Logic Low
Input Logic High
Input Leakage Current
3.0V
V
IN
4.2V
I
Dx
= 90% steady state
1.5x to 1x Threshold
1x to 1.5x Threshold
Condition
Min
325
Typ
500
100
4.75
4.55
Max
675
Units
kHz
µs
V
V
Logic Pin Specifications: EN, ENA, ENB
V
IL
V
IH
I
LEAK
2.7V
V
IN
5.5V
2.7V
V
IN
5.5V
V
ENx
= 0V
V
ENx
= 3V (Note 13)
0
1.1
0.1
10
0.5
V
IN
V
V
µA
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 160˚C (typ.) and disengages at T
J
=
120˚C (typ.). The thermal shutdown function is guaranteed by design.
Note 4:
The Human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor discharged directly
into each pin. MIL-STD-883 3015.7
Note 5:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125˚C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
x P
D-MAX
).
Note 6:
Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 7:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8:
C
IN
, C
OUT
, C
1
, and C
2
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
Note 9:
If both LED groups are to be ON simultaneously, the maximum V
Dxx
voltage may need to be derated, depending on minimum input voltage conditions. Refer
to the "MAXIMUM OUTPUT CURRENT, MAXIMUM LED VOLTAGE, MINIMUM INPUT VOLTAGE" section.
Note 10:
For the two groups of outputs on a part (Group A and Group B), the following are determined: the maximum output current in the group (MAX), the
minimum output current in the group (MIN), and the average output current of the group (AVG). For each group, two matching numbers are calculated:
(MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the group. The matching figure for a given
part is considered to be the highest matching figure of the two groups. The typical specification provided is the most likely norm of the matching figure for all parts.
Note 11:
Output resistance (R
OUT
) models all voltage losses in the charge pump. R
OUT
can be used to estimate the voltage at the charge pump output (P
OUT
):
V
Pout
= (1.5 x V
IN
) – (R
OUT
x I
OUT
). In the equation, I
OUT
is the total output current: the sum of all active Dxx output currents and all current drawn from P
OUT
. The
equation applies when the charge pump is operating with a gain of 3/2 (V
IN
4.75V typ.).
Note 12:
Headroom voltage: V
HR
= V
Pout
– V
Dxx
. If headroom voltage requirement is not met, LED current regulation will be compromised.
Note 13:
There is a 300kΩ(typ.) pull-down resistor connected internally between each enable pin (EN, ENA, ENB) and GND.
www.national.com
4
LM2796
Typical Performance Characteristics
Unless otherwise specified: V
IN
= 3.6V; V
DXX
= 3.6V; V(EN) =
2.0V; V(ENA) = 2.0V; V(ENB) = 0V; R
SET
= 8.3 kΩ; C
IN
, C
1
, C
2
, and C
POUT
= 1 µF.
LED Current vs. Input Voltage
LED Current vs. R
SET
Resistance
20093803
20093804
LED Current vs. PWM Duty Cycle,
PWM Applied to ENA and/or ENB
Charge Pump Output Resistance
vs. Ambient Temperature
20093805
20093806
5
www.national.com
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参数对比
与LM2796TL相近的元器件有:LM2796、LM2796TLX。描述及对比如下:
型号 LM2796TL LM2796 LM2796TLX
描述 Dual-Display White LED Driver with 3/2x Switched Capacitor Boost Dual-Display White LED Driver with 3/2x Switched Capacitor Boost Dual-Display White LED Driver with 3/2x Switched Capacitor Boost
是否Rohs认证 不符合 - 不符合
厂商名称 National Semiconductor(TI ) - National Semiconductor(TI )
包装说明 2.10 X 2.40 MM, 0.60 MM HEIGHT, THIN MICRO SMD, 18 PIN - 2.10 X 2.40 MM, 0.60 MM HEIGHT, THIN MICRO SMD, 18 PIN
Reach Compliance Code _compli - _compli
ECCN代码 EAR99 - EAR99
接口集成电路类型 LED DISPLAY DRIVER - LED DISPLAY DRIVER
JESD-30 代码 R-PBGA-B18 - R-PBGA-B18
JESD-609代码 e0 - e0
长度 2.403 mm - 2.403 mm
湿度敏感等级 1 - 1
复用显示功能 NO - NO
功能数量 1 - 1
区段数 7 - 7
端子数量 18 - 18
最高工作温度 85 °C - 85 °C
最低工作温度 -30 °C - -30 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 VFBGA - VFBGA
封装等效代码 BGA18,4X5,20/17 - BGA18,4X5,20/17
封装形状 RECTANGULAR - RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 - 260
电源 3/5 V - 3/5 V
认证状态 Not Qualified - Not Qualified
座面最大高度 0.675 mm - 0.675 mm
最大供电电压 5.5 V - 5.5 V
最小供电电压 2.7 V - 2.7 V
标称供电电压 3 V - 3 V
表面贴装 YES - YES
技术 CMOS - CMOS
温度等级 OTHER - OTHER
端子面层 Tin/Lead (Sn63Pb37) - Tin/Lead (Sn63Pb37)
端子形式 BALL - BALL
端子节距 0.5 mm - 0.5 mm
端子位置 BOTTOM - BOTTOM
处于峰值回流温度下的最长时间 40 - 40
宽度 2.098 mm - 2.098 mm
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