型号 | LM313H/NOPB | LM113GMW8 | LM113WG-QML | LM113MDS | LM113WG-MPR |
---|---|---|---|---|---|
描述 | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, MBCY2, METAL CAN, TO-46, 2 PIN | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, UUC, WAFER | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, CDSO10, CERAMIC, SOIC-10 | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, UUC, DIE | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, CDSO10, CERAMIC, SOIC-10 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | , | DIE, | SOP, | DIE, | SOP, |
Reach Compliance Code | compliant | unknown | unknown | compliant | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE |
JESD-30 代码 | O-MBCY-W2 | X-XUUC-N | R-GDSO-G10 | X-XUUC-N | R-GDSO-G10 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
输出次数 | 1 | 1 | 1 | 1 | 1 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
最大输出电压 | 1.28 V | 1.232 V | 1.232 V | 1.232 V | 1.232 V |
最小输出电压 | 1.16 V | 1.21 V | 1.21 V | 1.21 V | 1.21 V |
标称输出电压 | 1.22 V | 1.22 V | 1.22 V | 1.22 V | 1.22 V |
封装主体材料 | METAL | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
封装形状 | ROUND | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
封装形式 | CYLINDRICAL | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | YES | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | WIRE | NO LEAD | GULL WING | NO LEAD | GULL WING |
端子位置 | BOTTOM | UPPER | DUAL | UPPER | DUAL |
微调/可调输出 | NO | NO | NO | NO | NO |
端子数量 | 2 | - | 10 | - | 10 |
封装代码 | - | DIE | SOP | DIE | SOP |