型号
- 型号
- 关键词
ARM Microcontrollers - MCU X00 SERIES - STELLARIS MICROCONTROLLER
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | LM3S612-EGZ50-C2T | LM3S612-EGZ50-C2 | LM3S612-IGZ50-C2T | LM3S612-EQN50-C2T | LM3S612-EQN50-C2 | LM3S612-IGZ50-C2 |
|---|---|---|---|---|---|---|
| 描述 | ARM Microcontrollers - MCU X00 SERIES - STELLARIS MICROCONTROLLER | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU X00 SERIES - STELLARIS MICROCONTROLLER | ARM Microcontrollers - MCU | ARM Microcontrollers - MCU | ARM Microcontrollers - MCU Stellaris Microcon troller |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | QFN | QFN | QFP | QFP | QFN |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | LFQFP, QFP48,.35SQ,20 | LFQFP, QFP48,.35SQ,20 | HVQCCN, LCC48,.27SQ,20 |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compli | compli | compli | compliant | compliant | unknown |
| 具有ADC | YES | YES | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| CPU系列 | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 |
| 最大时钟频率 | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQCC-N48 | S-PQCC-N48 | S-PQCC-N48 | S-PQFP-G48 | S-PQFP-G48 | S-PQCC-N48 |
| 长度 | 6.875 mm | 6.875 mm | 6.875 mm | 7 mm | 7 mm | 6.875 mm |
| I/O 线路数量 | 34 | 34 | 34 | 34 | 34 | 34 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 105 °C | 105 °C | 85 °C | 105 °C | 105 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | LFQFP | LFQFP | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | QFP48,.35SQ,20 | QFP48,.35SQ,20 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| ROM（单词） | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1.6 mm | 1.6 mm | 1 mm |
| 速度 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 最大压摆率 | 110 mA | 110 mA | 110 mA | 110 mA | 110 mA | 110 mA |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.875 mm | 6.875 mm | 6.875 mm | 7 mm | 7 mm | 6.875 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| 厂商名称 | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
