型号
- 型号
- 关键词
| 型号 | LM4819MBD/NOPB | LM4819MBD-NOPB | LM4819LDX/NOPB | LM4819MMX/NOPB | LM4819MM/NOPB | LM4819LD/NOPB | LM4819MX/NOPB | LM4819 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Audio IC Development Tools LM4819MBD EVAL MOD | Audio IC Development Tools LM4819MBD EVAL MOD | Audio Amplifiers 350mW Audio Amplifier with Shutdown Mode 8-WSON -40 to 85 | 350mW Audio Amplifier with Shutdown Mode 8-VSSOP -40 to 85 | 350mW Audio Amplifier with Shutdown Mode 8-VSSOP -40 to 85 | 350mW Audio Amplifier with Shutdown Mode 8-WSON -40 to 85 | 350mW Audio Amplifier with Shutdown Mode 8-SOIC -40 to 85 | LM4819 350mW Audio Amplifier with Shutdown Mode |
| Brand Name | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否无铅 | - | - | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | - | - | SOIC | MSOP | MSOP | SOIC | SOIC | - |
| 包装说明 | - | - | VSON, SOLCC8,.1,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | VSON, SOLCC8,.1,20 | SOP, SOP8,.25 | - |
| 针数 | - | - | 8 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | - | - | compliant | compliant | compliant | compliant | compliant | - |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | - | - | 1 week | 1 week | 1 week | 6 weeks | 1 week | - |
| 标称带宽 | - | - | 20 kHz | 20 kHz | 20 kHz | 20 kHz | 20 kHz | - |
| 商用集成电路类型 | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - |
| 谐波失真 | - | - | 10% | 10% | 10% | 10% | 10% | - |
| JESD-30 代码 | - | - | S-PDSO-N8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-N8 | R-PDSO-G8 | - |
| JESD-609代码 | - | - | e3 | e3 | e3 | e3 | e3 | - |
| 长度 | - | - | 2.5 mm | 3 mm | 3 mm | 2.5 mm | 4.9 mm | - |
| 湿度敏感等级 | - | - | 3 | 1 | 1 | 3 | 1 | - |
| 信道数量 | - | - | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | - | - | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | - | - | 8 | 8 | 8 | 8 | 8 | - |
| 最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 标称输出功率 | - | - | 0.35 W | 0.35 W | 0.35 W | 0.35 W | 0.35 W | - |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | - | VSON | TSSOP | TSSOP | VSON | SOP | - |
| 封装等效代码 | - | - | SOLCC8,.1,20 | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.1,20 | SOP8,.25 | - |
| 封装形状 | - | - | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | - | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | - |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | - | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | - | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.75 mm | - |
| 最大压摆率 | - | - | 3 mA | 3 mA | 3 mA | 3 mA | 3 mA | - |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | - | 2 V | 2 V | 2 V | 2 V | 2 V | - |
| 表面贴装 | - | - | YES | YES | YES | YES | YES | - |
| 温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | - | - | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | - |
| 端子节距 | - | - | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 1.27 mm | - |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | - | 2.5 mm | 3 mm | 3 mm | 2.5 mm | 3.9 mm | - |
