型号
- 型号
- 关键词
Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-SOIC -40 to 85
| 型号 | LMC6772AIM | LMC6772AIMMX | LMC6772AIMX | LMC6772BIM | LMC6772BIMX | LMC6772BIN |
|---|---|---|---|---|---|---|
| 描述 | Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-SOIC -40 to 85 | Analog Comparators Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-VSSOP -40 to 85 | Analog Comparators R 926-LMC6772AIMX/NOPB | Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-SOIC -40 to 85 | Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-SOIC -40 to 85 | Analog Comparators Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-PDIP -40 to 85 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | MSOP | SOIC | SOIC | SOIC | DIP |
| 包装说明 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 最大输入失调电压 | 5000 µV | 8000 µV | 8000 µV | 5000 µV | 5000 µV | 18000 µV |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 4.9 mm | 3 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.817 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出类型 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SOP | SOP | SOP | DIP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 235 | 260 | 235 | 235 | 235 | NOT SPECIFIED |
| 电源 | 2.7/15 V | 2.7/15 V | 2.7/15 V | 2.7/15 V | 2.7/15 V | 2.7/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称响应时间 | 4000 ns | 4000 ns | 4000 ns | 4000 ns | 4000 ns | 4000 ns |
| 座面最大高度 | 1.75 mm | 1.1 mm | 1.75 mm | 1.75 mm | 1.75 mm | 5.08 mm |
| 最大压摆率 | 0.01 mA | 0.025 mA | 0.025 mA | 0.01 mA | 0.01 mA | 0.025 mA |
| 供电电压上限 | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | - |
| Factory Lead Time | 6 weeks | 1 week | 10 weeks | 1 week | 1 week | - |
RF/无线
FPGA/CPLD
单片机
FPGA/CPLD
RF/无线
电路观察室
