型号 | LMH6702MAX | LMH6702MFX | LMH6702MF | LMH6702MA |
---|---|---|---|---|
描述 | Operational Amplifiers - Op Amps | Operational Amplifiers - Op Amps | Operational Amplifiers - Op Amps | 1.7 GHz, Ultra Low Distortion, Wideband Op Amp 8-SOIC -40 to 85 |
是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | SOIC | SOT-23 | SOT-23 | SOIC |
包装说明 | SOP, | LSSOP, | LSSOP, | SOP, |
针数 | 8 | 5 | 5 | 8 |
Reach Compliance Code | _compli | _compli | _compli | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 4.9 mm | 2.92 mm | 2.92 mm | 4.905 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 5 | 5 | 8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | LSSOP | LSSOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | 235 | 260 | 260 | 235 |
座面最大高度 | 1.75 mm | 1.22 mm | 1.22 mm | 1.75 mm |
表面贴装 | YES | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.953 mm | 0.953 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.899 mm | 1.6 mm | 1.6 mm | 3.895 mm |