描述 |
IC REG LINEAR 3.1V 150MA 8USMD |
IC REG LIN 2.5/2.8V 150MA 8DSBGA |
IC REG LIN 2.5V/2.8V 150MA 8USMD |
IC REG LINEAR 2.85V 150MA 8USMD |
IC REG LINEAR 3.3V 150MA 8USMD |
是否Rohs认证 |
符合 |
符合 |
不符合 |
不符合 |
不符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
包装说明 |
VFBGA, |
VFBGA, BGA8,3X3,20 |
VFBGA, BGA8,3X3,20 |
VFBGA, BGA8,3X3,20 |
VFBGA, BGA8,3X3,20 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
最大回动电压 1 |
0.1 V |
0.1 V |
0.1 V |
0.1 V |
0.1 V |
最大回动电压 2 |
0.1 V |
0.1 V |
0.1 V |
0.1 V |
0.1 V |
最大输入电压 |
6 V |
6 V |
6 V |
6 V |
6 V |
最小输入电压 |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
JESD-30 代码 |
S-PBGA-B8 |
S-PBGA-B8 |
S-PBGA-B8 |
S-PBGA-B8 |
S-PBGA-B8 |
长度 |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
输出次数 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
工作温度TJ-Max |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
工作温度TJ-Min |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
最大输出电流 1 |
0.15 A |
0.15 A |
0.15 A |
0.15 A |
0.15 A |
最大输出电流 2 |
0.15 A |
0.15 A |
0.15 A |
0.15 A |
0.15 A |
最大输出电压 1 |
3.193 V |
2.575 V |
2.575 V |
2.9355 V |
3.399 V |
最小输出电压 1 |
3.007 V |
2.425 V |
2.425 V |
2.7645 V |
3.201 V |
标称输出电压 1 |
3.1 V |
2.5 V |
2.5 V |
2.85 V |
3.3 V |
最大输出电压 2 |
3.193 V |
2.884 V |
2.884 V |
2.9355 V |
3.399 V |
最小输出电压 2 |
3.007 V |
2.716 V |
2.716 V |
2.7645 V |
3.201 V |
标称输出电压 2 |
3.1 V |
2.8 V |
2.8 V |
2.85 V |
3.3 V |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
调节器类型 |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
座面最大高度 |
0.995 mm |
0.6 mm |
0.995 mm |
0.995 mm |
0.995 mm |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
端子形式 |
BALL |
BALL |
BALL |
BALL |
BALL |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
40 |
40 |
宽度 |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
可调性 |
- |
FIXED |
FIXED |
FIXED |
FIXED |
标称回动电压 1 |
- |
0.06 V |
0.06 V |
0.06 V |
0.06 V |
最大绝对输入电压 |
- |
6.5 V |
6.5 V |
6.5 V |
6.5 V |
JESD-609代码 |
- |
e1 |
e0 |
e0 |
e0 |
最大电网调整率 |
- |
0.0096% |
0.0096% |
0.0096% |
0.0093% |
封装等效代码 |
- |
BGA8,3X3,20 |
BGA8,3X3,20 |
BGA8,3X3,20 |
BGA8,3X3,20 |
包装方法 |
- |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
端子面层 |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
最大电压容差 |
- |
3% |
3% |
3% |
3% |