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LP5522TM/NOPB

Single Channel Programmable LED Driver 6-DSBGA -30 to 85

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

器件标准:

敬请期待
器件参数
参数名称
属性值
Brand Name
Texas Instruments
是否无铅
不含铅
是否Rohs认证
符合
包装说明
VFBGA, BGA6,2X3,16
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
1 week
输入特性
STANDARD
接口集成电路类型
LED DISPLAY DRIVER
JESD-30 代码
R-XBGA-B6
JESD-609代码
e1
湿度敏感等级
1
复用显示功能
NO
功能数量
1
区段数
1
端子数量
6
最高工作温度
85 °C
最低工作温度
-30 °C
输出特性
CONSTANT-CURRENT
封装主体材料
UNSPECIFIED
封装代码
VFBGA
封装等效代码
BGA6,2X3,16
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
电源
3.6 V
认证状态
Not Qualified
座面最大高度
0.675 mm
最大压摆率
0.055 mA
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
3.6 V
表面贴装
YES
温度等级
OTHER
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
0.4 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
Base Number Matches
1
参数对比
与LP5522TM/NOPB相近的元器件有:LP5522TMX-NOPB、LP5522TM-NOPB、LP5522TMX/NOPB、LP5522、LP5522TM、LP5522TMX。描述及对比如下:
型号 LP5522TM/NOPB LP5522TMX-NOPB LP5522TM-NOPB LP5522TMX/NOPB LP5522 LP5522TM LP5522TMX
描述 Single Channel Programmable LED Driver 6-DSBGA -30 to 85 LED Lighting Drivers Single Channel Programmable LED Driver 6-DSBGA -30 to 85 LED Lighting Drivers Single Channel Programmable LED Driver 6-DSBGA -30 to 85 Single Channel Programmable LED Driver 6-DSBGA -30 to 85 LP5522 Single Channel Programmable LED Driver LED DISPLAY DRIVER, PBGA6, 1.215 X 0.815 MM, 0.60 MM HEIGHT, 0.40 MM PITCH, MICRO SMD-6 LED DISPLAY DRIVER, PBGA6, 1.215 X 0.815 MM, 0.60 MM HEIGHT, 0.40 MM PITCH, MICRO SMD-6
是否Rohs认证 符合 - - 符合 - 符合 符合
包装说明 VFBGA, BGA6,2X3,16 - - VFBGA, BGA6,2X3,16 - VFBGA, VFBGA,
Reach Compliance Code compliant - - compliant - compliant compliant
ECCN代码 EAR99 - - EAR99 - EAR99 EAR99
接口集成电路类型 LED DISPLAY DRIVER - - LED DISPLAY DRIVER - LED DISPLAY DRIVER LED DISPLAY DRIVER
JESD-30 代码 R-XBGA-B6 - - R-XBGA-B6 - R-PBGA-B6 R-PBGA-B6
JESD-609代码 e1 - - e1 - e1 e1
湿度敏感等级 1 - - 1 - 1 1
复用显示功能 NO - - NO - NO NO
功能数量 1 - - 1 - 1 1
区段数 1 - - 1 - 1 1
端子数量 6 - - 6 - 6 6
最高工作温度 85 °C - - 85 °C - 85 °C 85 °C
最低工作温度 -30 °C - - -30 °C - -30 °C -30 °C
封装主体材料 UNSPECIFIED - - UNSPECIFIED - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA - - VFBGA - VFBGA VFBGA
封装形状 RECTANGULAR - - RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH - - GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态 Not Qualified - - Not Qualified - Not Qualified Not Qualified
座面最大高度 0.675 mm - - 0.675 mm - 0.675 mm 0.675 mm
最大供电电压 5.5 V - - 5.5 V - 5.5 V 5.5 V
最小供电电压 2.7 V - - 2.7 V - 2.7 V 2.7 V
标称供电电压 3.6 V - - 3.6 V - 3.6 V 3.6 V
表面贴装 YES - - YES - YES YES
温度等级 OTHER - - OTHER - COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) - - Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL - - BALL - BALL BALL
端子节距 0.4 mm - - 0.4 mm - 0.4 mm 0.4 mm
端子位置 BOTTOM - - BOTTOM - BOTTOM BOTTOM
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