LTC4557
Dual SIM/Smart Card
Power Supply and Interface
FEATURES
s
s
s
s
s
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DESCRIPTIO
s
s
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Power Management and Signal Level Translators
for Two SIM Cards or Smart Cards
Independent 1.8V/3V V
CC
Control for Both Cards
Automatic Level Translation
ISO7816, ETSI and EMV Compatible
Dynamic Pull-Ups Deliver Fast Signal Rise Times*
Built-In Fault Protection Circuitry
Automatic Activation/Deactivation Sequencing
Circuitry
Low Operating/Shutdown Current
>10kV ESD on SIM Card Pins
Compatible with EMV Fault Tolerance Requirements
Available in 16-Lead (3mm
×
3mm) QFN Package
The LTC
®
4557 provides power conversion and signal level
translation needed for 2.5G and 3G cellular telephones to
interface with 1.8V or 3V subscriber identity modules
(SIMs). The part meets all requirements for 1.8V and 3V
SIMs. The part contains LDO regulators to power 1.8V or
3V SIM cards from a 2.7V to 5.5V input. The output
voltages can be set using the two voltage selection pins
and up to 50mA of load current can be supplied.
Internal level translators allow controllers operating with
supplies as low as 1.2V to interface with 1.8V or 3V smart
cards. Battery life is maximized by a low operating current
of less than 100µA and a shutdown current of less than
1µA. Board area is minimized by the low profile 3mm
×
3mm
×
0.75mm leadless QFN package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
*U.S. Patent No. 6,356,140
APPLICATIO S
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GSM and 3G Cellular Phones
Wireless P.O.S. Terminals
Multiple SAM Card Interface
TYPICAL APPLICATIO
DV
CC
0.1µF
DV
CC
CLKIN
RSTIN
DATA
µCONTROLLER
V
BATT
DV
CC
1.2V TO 4.4V 3V TO 6V
0.1µF
V
BATT
I/OA
RSTA
CLKA
V
CCA
LTC4557
GND
1µF
V
CCB
ENABLE
M0
M1
CLKB
RSTB
I/OB
C1
C3
C2
C7
V
CC
CLK 1.8V/3V
SMART
RST
CARD
I/O
GND
C5
4557 TA01
C7
C2
C3
C1
1µF
I/O
RST 1.8V/3V
SIM
CLK
CARD
V
CC
GND
C5
RSTX
5V/DIV
CLKX
5V/DIV
I/OX
5V/DIV
V
CCX
2V/DIV
C
VCCX
= 1µF
10µs/DIV
4557 G07
U
Deactivation Sequence
4557f
U
U
1
LTC4557
ABSOLUTE
(Note 1)
AXI U
RATI GS
PACKAGE/ORDER I FOR ATIO
TOP VIEW
CLKA
RSTA
I/OA
DATA
V
BATT
, DV
CC
, DATA, RSTIN, CLKIN,
ENABLE, M0, M1 to GND ............................ – 0.3V to 6V
I/OA, CLKA, RSTA ........................ – 0.3V to V
CCA
+ 0.3V
I/OB, CLKB, RSTB ........................ – 0.3V to V
CCB
+ 0.3V
I
CCA,B
(Note 4) ...................................................... 80mA
V
CCA,B
Short-Circuit Duration ......................... Indefinite
Operating Temperature Range (Note 3) .. – 40°C to 85°C
Storage Temperature Range ................... – 65°C to 125°
ENABLE
RSTB
CLKB
I/OB
ORDER PART
NUMBER
LTC4557EUD
12 M0
11 M1
10 CLKIN
9
RSTIN
16 15 14 13
V
CCB
1
DV
CC
2
V
BATT
3
V
CCA
4
5
6
7
8
17
UD PART MARKING
LAHP
UD PACKAGE
16-LEAD (3mm
×
3mm) PLASTIC QFN
T
JMAX
= 125°C,
θ
JA
= 68°C/W,
θ
JC
= 42°C/W
EXPOSED PAD (PIN 17) IS GND
(MUST BE SOLDERED TO PCB)
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
SYMBOL
PARAMETER
V
BATT
Operating Voltage
I
VBATT
Operating Current
DV
CC
Operating Voltage
I
DVCC
Operating Current
I
DVCC
Shutdown Current
I
VBATT
Shutdown Current
Input Power Supply
The
q
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
BATT
= 3.3V, DV
CC
= 1.8V, unless otherwise specified.
CONDITIONS
q
MIN
2.7
TYP
MAX
5.5
UNITS
V
µA
µA
V
µA
µA
µA
µA
V
V
ms
V
V
V
CCA
= 3V, V
CCB
= 0V, I
CCA
= I
CCB
= 0µA
V
CCA
= 1.8V, V
CCB
= 0V, I
CCA
= I
CCB
= 0µA
q
q
q
q
q
65
65
1.2
6
0.1
0.4
0.1
2.75
1.65
3.0
1.8
1.3
100
100
5.5
10
1
2.5
1.0
3.25
1.95
2.5
0.2
DV
CC
= 0V
SIM Card Supplies
V
CCA,B
Output Voltage
Channel Turn-On Time
CLKA, CLKB
V
OL
V
OH
Low Level Output Voltage
High Level Output Voltage
Rise, Fall Time
CLKA, CLKB Frequency
RSTA, RSTB
V
OL
V
OH
Low Level Output Voltage
High Level Output Voltage
Rise, Fall Time
Sink Current = –200µA (Note 2)
Source Current = 200µA (Note 2)
Loaded with 33pF (10% to 90%) (Note 2)
Sink Current = –200µA (Note 2)
Source Current = 200µA (Note 2)
Loaded with 33pF (10% to 90%) (Note 2)
(Note 2)
3V Mode, 0mA < I
CCA,B
< 50mA
1.8V Mode, 0mA < I
CCA,B
< 3OmA
I
CCA,B
= 0mA,
ENABLE to
I
OA/B
q
q
q
q
q
q
q
V
CCA,B
–
0.2
q
q
16
10
0.2
0.2
q
q
V
CCA,B
–
q
100
2
U
ns
MHz
V
V
ns
4557f
W
U
U
W W
W
LTC4557
ELECTRICAL CHARACTERISTICS
SYMBOL
I/OA, I/OB
V
OL
V
OH
Low Level Output Voltage
High Level Output Voltage
Rise Time
Short-Circuit Current
DATA
V
OL
V
OH
Low Level Output Voltage
High Level Output Voltage
Rise Time
RSTIN, CLKIN, ENABLE, M0, M1
V
IL
V
IH
Low Input Threshold
High Input Threshold
Input Current (I
IH
, I
IL
)
PARAMETER
The
q
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
BATT
= 3.3V, DV
CC
= 1.8V, unless otherwise specified.
CONDITIONS
Sink Current = –1mA (V
DATA
= 0V) (Note 2)
Source Current = 20µA (V
DATA
= V
DVCC
)
(Note 2)
Loaded with 33pF (10% to 90%) (Note 2)
V
DATA
= 0V (Note 2)
Sink Current = –500µA (V
I/OA,B
= 0V)
Source Current = 20µA (V
I/OA,B
= V
CCA,B
)
Loaded with 33pF (10% to 90%)
q
q
q
q
MIN
TYP
MAX
0.3
UNITS
V
V
0.85 •
V
CCA,B
200
5
500
10
0.3
0.8 •
DV
CC
200
500
0.15 •
DV
CC
0.85 •
DV
CC
–1
1
ns
mA
V
V
ns
V
V
µA
q
q
q
q
q
q
Note 1:
Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2:
This specification applies to both 1.8V and 3V smart cards.
Note 3:
The LTC4557E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the – 40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 4:
Based on long term current density limitations.
4557f
3
LTC4557
TYPICAL PERFOR A CE CHARACTERISTICS
No Load Supply Current vs V
BATT
80
T
A
= 25°C
I
CCA
= I
CCB
= 0µA
6.0
75
SHORT-CIRCUIT CURRENT (mA)
SUPPLY CURRENT (µA)
SUPPLY CURRENT (µA)
DROPOUT
70
V
CCX
= 3V
65
V
CCX
= 1.8V
60
55
2.7
3.1
3.5 3.9 4.3
4.7
SUPPLY VOLTAGE (V)
5.1
5.5
V
BATT
Shutdown Current
vs Supply Voltage
3.0
2.5
SUPPLY CURRENT (µA)
SUPPLY CURRENT (µA)
V
DVCC
= 1.8V
2.0
1.5
1.0
0.5
0
2.7
3.1
4.7
3.5 3.9 4.3
SUPPLY VOLTAGE (V)
Data – I/O Channel, C
L
= 40pF
I/0X
1V/DIV
RSTX
5V/DIV
CLKX
5V/DIV
DATA
1V/DIV
I/OX
5V/DIV
V
CCX
2V/DIV
C
L
= 40pF
200ns/DIV
4557 G06
4
U W
4557 G01
I/O X Short-Circuit Current
vs Temperature
140
V
DVCC
= V
BATT
= 5.5V
V
CCX
= 3V
V
BATT
Quiescent Current
(I
VBATT
– I
CC
) vs Load Current
120
100
80
60
40
20
T
A
= 25°C
V
BATT
= 3.1V
5.5
5.0
4.5
4.0
–40
0
–15
35
10
TEMPERATURE (°C)
60
85
4557 G02
10
100
1000
10000
LOAD CURRENT (µA)
100000
4557 G03
DV
CC
Shutdown Current
vs Supply Voltage
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6
SUPPLY VOLTAGE (V)
4557 G05
V
BATT
= 5.5V
T
A
= –40°C TO 85°C
T
A
= –40°C
T
A
= 25°C
T
A
= 85°C
5.1
5.5
4557 G04
Deactivation Sequence,
C
VCCX
= 1µF
C
VCCX
= 1µF
10µs/DIV
4557 G07
4557f
LTC4557
PI FU CTIO S
DV
CC
(Pin 2):
Power. Reference voltage for the control
logic.
V
BATT
(Pin 3):
Power. Supply voltage for the analog
sections of the LTC4557.
V
CCA
/V
CCB
(Pins 4, 1):
Card Socket. The V
CCA
/V
CCB
pins
should be connected to the V
CC
pins of the respective card
sockets. The activation of the V
CCA
/V
CCB
pins is controlled
by the M0, M1 and ENABLE inputs. They can be set to 0V,
1.8V or 3V. Only one of the two, either V
CCA
or V
CCB
, may
be active at a time.
CLKA/CLKB (Pins 5, 16):
Card Socket. The CLKA/CLKB
pins should be connected to the CLK pins of the respective
card sockets. The CLKA/CLKB signals are derived from the
CLKIN pin. They provide a level shifted CLKIN signal to the
selected card. The CLKA/CLKB pins are gated off until
V
CCA
/V
CCB
attain their correct values.
RSTA/RSTB (Pins 6, 15):
Card Socket. The RSTA/RSTB
pins should be connected to the RST pins of the respective
card sockets. The RSTA/RSTB signals are derived from
the RSTIN pin. When a card is selected, its RST pin follows
RSTIN. The RSTA/RSTB pins are gated off until V
CCA
/V
CCB
attain their correct values.
I/OA, I/OB (Pins 7, 14):
Card Socket. The I/OA, I/OB pins
connect to the I/O pins of the respective card sockets.
When a card is selected, its I/O pin transmits/receives data
to/from the DATA pin. The I/OA, I/OB pins are gated off
until V
CCA
/V
CCB
attain their correct values.
DATA (Pin 8):
Input/Output. Microcontroller side data I/O
pin. The DATA pin provides the bidirectional communica-
tion path to both cards. Only one of the cards may be
selected to communicate via the DATA pin. The pin pos-
sesses a dynamically activated pull-up current source,
allowing the controller to use an open-drain output. The
current source maintains a HIGH state. This pin is held
HIGH by a weak pull-up when the ENABLE pin is LOW.
RSTIN (Pin 9):
Input. The RSTIN pin supplies the reset
signal to the cards. It is level shifted and transmitted
directly to the RST pin of the selected card.
CLKIN (Pin 10):
Input. The CLKIN pin supplies the clock
signal to the cards. It is level shifted and transmitted
directly to the CLK pin of the selected card.
M0/M1 (Pins 12, 11):
Inputs. The M0 and M1 pins select
which set of SIM/smart card pins are active and at which
voltage level they operate. The truth table for these pins
follows:
M1
0
0
1
1
M0
0
1
0
1
SELECTED CARD/VOLTAGE
Card A/1.8V
Card A/3V
Card B/1.8V
Card B/3V
U
U
U
ENABLE (Pin 13):
Input. The ENABLE pin shuts down the
chip when LOW.
EXPOSED PAD (Pin 17):
Chip Ground. This ground pad
must be soldered directly to a PCB ground plane.
4557f
5
