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M25P32 Serial Flash Embedded Memory

Features

M25P32 32Mb 3V NOR Serial Flash

Embedded Memory

Features

•

SPI bus-compatible serial interface

32Mb Flash memory

75 MHz clock frequency (maximum)

2.7V to 3.6V single supply voltage

= 9V for FAST PROGRAM/ERASE mode (option-

al)

Page program (up to 256 bytes) in 0.64ms (TYP)

Erase capability

– Sector erase: 512Kb in 0.6s (TYP)

– Bulk erase: 23 s (TYP); 17s (TYP) with V

= 9V

Write protection

– Hardware write protection: protected area size

defined by nonvolatile bits BP0, BP1, BP2

Deep power-down: 1µA (TYP)

• Electronic signature

– JEDEC-standard 2-byte signature (2016h)

– Unique ID code (UID) and 16 bytes of common

Flash interface (CFI) data

– RES command, one-byte signature (15h) for

backward-compatibility

• More than 100,000 write cycles per sector

• More than 20 years of data retention

• Automotive-grade parts available

• Packages (RoHS-compliant)

– SO8W (MW) 208 mils

– SO16 (MF) 300 mils

– VFQFPN8 (MP) MLP8 6mm x 5mm

– VFDFPN8 (MP) MLP8 8mm x 6mm

PDF: 09005aef84566541

m25p32.pdf - Rev. P 05/14 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M25P32 Serial Flash Embedded Memory

Features

Contents

Functional Description ..................................................................................................................................... 6

Signal Descriptions ........................................................................................................................................... 8

SPI Modes ........................................................................................................................................................ 9

Operating Features ......................................................................................................................................... 11

Page Programming ..................................................................................................................................... 11

Sector Erase, Bulk Erase .............................................................................................................................. 11

Polling during a Write, Program, or Erase Cycle ............................................................................................ 11

Active Power, Standby Power, and Deep Power-Down .................................................................................. 11

Status Register ............................................................................................................................................ 12

Data Protection by Protocol ........................................................................................................................ 12

Software Data Protection ............................................................................................................................ 12

Hardware Data Protection .......................................................................................................................... 12

Hold Condition .......................................................................................................................................... 13

Configuration and Memory Map ..................................................................................................................... 14

Memory Configuration and Block Diagram .................................................................................................. 14

Memory Map – 32Mb Density ......................................................................................................................... 15

Command Set Overview ................................................................................................................................. 16

WRITE ENABLE .............................................................................................................................................. 18

WRITE DISABLE ............................................................................................................................................. 19

READ IDENTIFICATION ................................................................................................................................. 20

READ STATUS REGISTER ................................................................................................................................ 21

WIP Bit ...................................................................................................................................................... 22

WEL Bit ...................................................................................................................................................... 22

Block Protect Bits ....................................................................................................................................... 22

SRWD Bit ................................................................................................................................................... 22

WRITE STATUS REGISTER .............................................................................................................................. 23

READ DATA BYTES ......................................................................................................................................... 25

READ DATA BYTES at HIGHER SPEED ............................................................................................................ 26

PAGE PROGRAM ............................................................................................................................................ 27

SECTOR ERASE .............................................................................................................................................. 28

BULK ERASE .................................................................................................................................................. 29

DEEP POWER-DOWN ..................................................................................................................................... 30

RELEASE from DEEP POWER-DOWN .............................................................................................................. 31

READ ELECTRONIC SIGNATURE .................................................................................................................... 32

Power-Up/Down and Supply Line Decoupling ................................................................................................. 33

Power-Up Timing and Write Inhibit Voltage Threshold Specifications ............................................................... 35

Maximum Ratings and Operating Conditions .................................................................................................. 36

Electrical Characteristics ................................................................................................................................ 37

AC Characteristics .......................................................................................................................................... 38

Package Information ...................................................................................................................................... 43

Device Ordering Information .......................................................................................................................... 47

Standard Parts ............................................................................................................................................ 47

Automotive Parts ........................................................................................................................................ 47

Revision History ............................................................................................................................................. 49

Rev. P – 05/2014 .......................................................................................................................................... 49

Rev. O – 03/2013 ......................................................................................................................................... 49

Rev. N – 01/2012 ......................................................................................................................................... 49

Rev. M – 09/2011 ........................................................................................................................................ 49

Rev. 12.0 – 3/2010 ....................................................................................................................................... 49

PDF: 09005aef84566541

m25p32.pdf - Rev. P 05/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M25P32 Serial Flash Embedded Memory

Features

Rev. 11.0 – 10/2009 .....................................................................................................................................

Rev. 10.0 – 2/2009 .......................................................................................................................................

Rev. 9.0 – 12/2008 .......................................................................................................................................

Rev. 8.0 – 11/2008 .......................................................................................................................................

Rev. 7.0 – 6/2007 .........................................................................................................................................

Rev. 6.0 – 11/2006 .......................................................................................................................................

Rev. 5.0 – 2/2006 .........................................................................................................................................

Rev. 4.0 – 01/2006 .......................................................................................................................................

Rev. 3.0 – 8/2005 .........................................................................................................................................

Rev. 2.0 – 4/2005 .........................................................................................................................................

Rev. 1.0 – 10/2004 .......................................................................................................................................

PDF: 09005aef84566541

m25p32.pdf - Rev. P 05/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M25P32 Serial Flash Embedded Memory

Features

List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 6

Figure 2: Pin Connections: SO8, MLP8 ............................................................................................................. 7

Figure 3: Pin Connections: SO16 ...................................................................................................................... 7

Figure 4: SPI Modes Supported ........................................................................................................................ 9

Figure 5: Bus Master and Memory Devices on the SPI Bus ............................................................................... 10

Figure 6: Hold Condition Activation ............................................................................................................... 13

Figure 7: Block Diagram ................................................................................................................................ 14

Figure 8: WRITE ENABLE Command Sequence .............................................................................................. 18

Figure 9: WRITE DISABLE Command Sequence ............................................................................................. 19

Figure 10: READ IDENTIFICATION Command Sequence ................................................................................ 20

Figure 11: READ STATUS REGISTER Command Sequence .............................................................................. 21

Figure 12: Status Register Format ................................................................................................................... 21

Figure 13: WRITE STATUS REGISTER Command Sequence ............................................................................. 23

Figure 14: READ DATA BYTES Command Sequence ........................................................................................ 25

Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 26

Figure 16: PAGE PROGRAM Command Sequence ........................................................................................... 27

Figure 17: SECTOR ERASE Command Sequence ............................................................................................. 28

Figure 18: BULK ERASE Command Sequence ................................................................................................. 29

Figure 19: DEEP POWER-DOWN Command Sequence ................................................................................... 30

Figure 20: RELEASE from DEEP POWER-DOWN Command Sequence ............................................................. 31

Figure 21: READ ELECTRONIC SIGNATURE Command Sequence .................................................................. 32

Figure 22: Power-Up Timing .......................................................................................................................... 34

Figure 23: AC Measurement I/O Waveform ..................................................................................................... 38

Figure 24: Serial Input Timing ........................................................................................................................ 41

Figure 25: Write Protect Setup and Hold During WRSR When SRWD=1 Timing ................................................ 41

Figure 26: Hold Timing .................................................................................................................................. 42

Figure 27: Output Timing .............................................................................................................................. 42

Figure 28: SO8W 208 mils Body Width ............................................................................................................ 43

Figure 29: SO16W 300 mils Body Width .......................................................................................................... 44

Figure 30: VFQFPN8 (MLP8) 6mm x 5mm ...................................................................................................... 45

Figure 31: VFDFPN8 (MLP8) 8mm x 6mm ...................................................................................................... 46

PDF: 09005aef84566541

m25p32.pdf - Rev. P 05/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

M25P32 Serial Flash Embedded Memory

Features

List of Tables

Table 1: Signal Names ...................................................................................................................................... 6

Table 2: Signal Descriptions ............................................................................................................................. 8

Table 3: Protected Area Sizes .......................................................................................................................... 12

Table 4: Sectors 63:0 ...................................................................................................................................... 15

Table 5: Command Set Codes ........................................................................................................................ 17

Table 6: READ IDENTIFICATION Data Out Sequence ..................................................................................... 20

Table 7: Status Register Protection Modes ...................................................................................................... 24

Table 8: Power-Up Timing and V

Threshold ................................................................................................. 35

Table 9: Absolute Maximum Ratings .............................................................................................................. 36

Table 10: Operating Conditions ...................................................................................................................... 36

Table 11: Data Retention and Endurance ........................................................................................................ 36

Table 12: DC Current Specifications ............................................................................................................... 37

Table 13: DC Voltage Specifications ................................................................................................................ 37

Table 14: AC Measurement Conditions ........................................................................................................... 38

Table 15: Capacitance .................................................................................................................................... 38

Table 16: AC Specifications (75MHz, Device Grade 3 and 6, V

[min])=2.7V ..................................................... 39

Table 17: Instruction Times, Process Technology 110nm ................................................................................. 40

Table 18: Part Number Information Scheme ................................................................................................... 47

Table 19: Part Number Information Scheme ................................................................................................... 47

PDF: 09005aef84566541

m25p32.pdf - Rev. P 05/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

参数对比

与M25P32-VMF6TP相近的元器件有：M25P32-VMP6TG、M25P32-VME6TG、M25P32-VMW6G、M25P32-VMW6GBA、M25P32-VMF3TPB、M25P32-VMW6TG。描述及对比如下：

型号	M25P32-VMF6TP	M25P32-VMP6TG	M25P32-VME6TG	M25P32-VMW6G	M25P32-VMW6GBA	M25P32-VMF3TPB	M25P32-VMW6TG
描述	Flash, 4MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16	Flash, 4MX8, 6 X 5 MM, ROHS COMPLIANT, MLP-8	Flash, 4MX8, 8 X 6 MM, ROHS COMPLIANT, MLP-8	Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, SOP-8	Flash, 4MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16	Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
包装说明	0.300 INCH, ROHS COMPLIANT, SOP-16	HVSON, SOLCC8,.25	8 X 6 MM, ROHS COMPLIANT, MLP-8	SOP, SOP8,.3	SOP-8	SOP-16	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
针数	16	8	8	8	8	16	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
最大时钟频率 (fCLK)	75 MHz	50 MHz	50 MHz	50 MHz	75 MHz	75 MHz	50 MHz
数据保留时间-最小值	20	20	20	20	20	20	20
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G16	R-XDSO-N8	R-XDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G16	R-PDSO-G8
内存密度	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1
端子数量	16	8	8	8	8	16	8
字数	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8
封装主体材料	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	HVSON	HVSON	SOP	SOP	SOP	SOP
封装等效代码	SOP16,.4	SOLCC8,.25	SOLCC8,.24	SOP8,.3	SOP8,.3	SOP16,.4	SOP8,.31
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	260	260	260	260	NOT SPECIFIED	260
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
编程电压	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.65 mm	1 mm	1 mm	2.5 mm	2.5 mm	2.65 mm	2.5 mm
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI
最大待机电流	0.00001 A	0.00001 A	0.00005 A	0.00001 A	0.00001 A	0.00005 A	0.00005 A
最大压摆率	0.015 mA	0.015 mA	0.02 mA	0.015 mA	0.015 mA	0.02 mA	0.015 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL
端子形式	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	NOT SPECIFIED	30
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
厂商名称	Micron Technology	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
长度	10.3 mm	6 mm	8 mm	5.62 mm	-	10.3 mm	5.62 mm
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	-	-	3 V
宽度	7.5 mm	5 mm	6 mm	-	5.62 mm	7.5 mm	-