128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32
128K × 8 非易失性存储器模块, 70 ns, PDMA32
器件类别:存储
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
下载文档型号 | M48Z128V | M48Z128 | M48Z128V-70PM1 | M48Z128-120PM1 | M48Z128Y | M48Z128-85PM1 | M48Z128_10 | M48Z128V-120PM1 | M48Z128Y-120PM1 | M48Z128V-85PM1 |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 | 128K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDMA32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
组织 | 128K X 8 | 128K X 8 | 128KX8 | 128KX8 | 128K X 8 | 128KX8 | 128K X 8 | 128KX8 | 128KX8 | 128KX8 |
是否Rohs认证 | - | - | 符合 | 不符合 | - | 不符合 | - | 符合 | 不符合 | 符合 |
厂商名称 | - | - | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | - | - | MODULE | MODULE | - | MODULE | - | MODULE | MODULE | MODULE |
包装说明 | - | - | PMDIP-32 | PMDIP-32 | - | PMDIP-32 | - | PMDIP-32 | PMDIP-32 | PMDIP-32 |
针数 | - | - | 32 | 32 | - | 32 | - | 32 | 32 | 32 |
Reach Compliance Code | - | - | compli | _compli | - | _compli | - | compli | _compli | compli |
ECCN代码 | - | - | EAR99 | EAR99 | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
Is Samacsys | - | - | N | N | - | N | - | N | N | N |
最长访问时间 | - | - | 70 ns | 120 ns | - | 85 ns | - | 120 ns | 120 ns | 85 ns |
JESD-30 代码 | - | - | R-PDMA-P32 | R-PDMA-P32 | - | R-PDMA-P32 | - | R-PDMA-P32 | R-PDMA-P32 | R-PDMA-P32 |
JESD-609代码 | - | - | e3 | e0 | - | e0 | - | e3 | e0 | e3 |
长度 | - | - | 42.8 mm | 42.8 mm | - | 42.8 mm | - | 42.8 mm | 42.8 mm | 42.8 mm |
内存密度 | - | - | 1048576 bi | 1048576 bi | - | 1048576 bi | - | 1048576 bi | 1048576 bi | 1048576 bi |
内存集成电路类型 | - | - | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | - | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE |
字数 | - | - | 131072 words | 131072 words | - | 131072 words | - | 131072 words | 131072 words | 131072 words |
字数代码 | - | - | 128000 | 128000 | - | 128000 | - | 128000 | 128000 | 128000 |
工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | - | - | 70 °C | 70 °C | - | 70 °C | - | 70 °C | 70 °C | 70 °C |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | DIP | DIP | - | DIP | - | DIP | DIP | DIP |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | - | - | PARALLEL | PARALLEL | - | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | - | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 9.52 mm | 9.52 mm | - | 9.52 mm | - | 9.52 mm | 9.52 mm | 9.52 mm |
最大供电电压 (Vsup) | - | - | 3.6 V | 5.5 V | - | 5.5 V | - | 3.6 V | 5.5 V | 3.6 V |
最小供电电压 (Vsup) | - | - | 3 V | 4.75 V | - | 4.75 V | - | 3 V | 4.5 V | 3 V |
标称供电电压 (Vsup) | - | - | 3.3 V | 5 V | - | 5 V | - | 3.3 V | 5 V | 3.3 V |
表面贴装 | - | - | NO | NO | - | NO | - | NO | NO | NO |
技术 | - | - | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | CMOS |
端子面层 | - | - | MATTE TIN | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN |
端子节距 | - | - | 2.54 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | - | 15.24 mm | 15.24 mm | - | 15.24 mm | - | 15.24 mm | 15.24 mm | 15.24 mm |
Base Number Matches | - | - | 1 | 1 | - | 1 | - | 1 | 1 | 1 |