型号
- 型号
- 关键词
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, FRIT SEALED, CERAMIC, DIP-14
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
下载文档| 型号 | M54HC4066F1 | M74HC4066F1 | M74HC4066C1 | M74HC4066B1N | M74HC4066M1 |
|---|---|---|---|---|---|
| 描述 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PQCC20, PLASTIC, LCC-20 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, PLASTIC, DIP-14 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14, MICRO, PLASTIC, DIP-14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | QLCC | DIP | SOIC |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | PLASTIC, LCC-20 | DIP, DIP14,.3 | SOP, SOP14,.25 |
| 针数 | 14 | 14 | 20 | 14 | 14 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | S-PQCC-J20 | R-PDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 正常位置 | NO | NO | NO | NO | NO |
| 信道数量 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 20 | 14 | 14 |
| 通态电阻匹配规范 | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最大通态电阻 (Ron) | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | DIP | SOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | LDCC20,.4SQ | DIP14,.3 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5 mm | 5 mm | 4.57 mm | 5.1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 表面贴装 | NO | NO | YES | NO | YES |
| 最长断开时间 | 115 ns | 115 ns | 115 ns | 115 ns | 115 ns |
| 最长接通时间 | 115 ns | 115 ns | 115 ns | 115 ns | 115 ns |
| 切换 | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 8.9662 mm | 7.62 mm | 3.9 mm |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |