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M59PW016

16 Mbit (1Mb x16, Uniform Block)

3V Supply LightFlash™ Memory

FEATURES SUMMARY

■

MASK-ROM PIN-OUT COMPATIBLE

SUPPLY VOLTAGE

– V

= 2.7 to 3.6V for Read

– V

= 11.4 to 12.6V for Program

ACCESS TIME

– 80ns at V

= 3.0 to 3.6V

– 100, 110ns at V

= 2.7 to 3.6V

PROGRAMMING TIME

– 9µs per Word typical

– Multiple Word Programming Option

(2s typical Chip Program)

SUITABLE FOR ON-BOARD

PROGRAMMING

ERASE TIME

– 11s typical Chip Erase

UNIFORM BLOCKS

– 8 blocks of 2 Mbits

PROGRAM/ERASE CONTROLLER

– Embedded Word Program algorithms

10,000 PROGRAM/ERASE CYCLES per

BLOCK

ELECTRONIC SIGNATURE

– Manufacturer Code: 0020h

– Device Code: 88ADh

Figure 1. Packages

SO44 (M)

TSOP48 (N)

12 x 20mm

PDIP42 (B)

SDIP42 (S)

March 2005

1/26

M59PW016

TABLE OF CONTENTS

FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 2.

Table 1.

Figure 3.

Figure 4.

Figure 5.

Table 2.

Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

PDIP and SDIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

SO Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Address Inputs (A0-A19). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Data Inputs/Outputs (DQ8-DQ15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Program Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Vss Ground.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 3. Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Read/Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Word Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Multiple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Setup Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Program Phase.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Verify Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Exit Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Block Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 4. Standard Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 5. Multiple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2/26

M59PW016

Table 6. Program, Erase Times and Program, Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . 11

Figure 6. Multiple Word Program Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Status Bit (DQ4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Multiple Word Program Bit (DQ0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Status Register Bit DQ1 is reserved. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 7. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7. Data Polling Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. Data Toggle Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 8. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 9. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 9. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 10.AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 10. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 11. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 11.Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 12. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 12.Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 13. Chip Enable Controlled, Write AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 13.SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Outline . . . . . . . . 20

Table 14. SO44 - 44 lead Plastic Small Outline, 500 mils body width, Package Mechanical Data . 20

Figure 14.TSOP48 - 48 lead Plastic Thin Small Outline, 12x20mm, Package Outline . . . . . . . . . . 21

Table 15. TSOP48 - 48 lead Plastic Thin Small Outline, 12x20mm, Package Mechanical Data . . 21

Figure 15.PDIP42 - 42 pin Plastic DIP, 600 mils width, Bottom View Package Outline . . . . . . . . . 22

Table 16. PDIP42 - 42 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . 22

Figure 16.SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Outline . . . . . . . . . . . . . . 23

Table 17. SDIP42 - 42 pin Shrink Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . 23

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 18. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 19. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3/26

M59PW016

SUMMARY DESCRIPTION

The M59PW016 is a 16Mbit (1Mbx16), Mask-

ROM pin-out compatible, non-volatile LightFlash

memory, that can be read, erased and

reprogrammed. Read operations can be

performed using a single low voltage (2.7 to 3.6V)

supply. Program and Erase operations require an

additional V

(11.4 to 12.6V) power supply. On

power-up the memory defaults to its Read mode

where it can be read in the same way as a ROM or

EPROM.

The memory is divided into 8 uniform blocks that

can be erased independently so it is possible to

preserve valid data while old data is erased (see

Table 2., Block Addresses).

Program and Erase

commands are written to the Command Interface

of the memory. An on-chip Program/Erase Con-

troller (P/E.C.) simplifies the process of program-

ming or erasing the memory by taking care of all of

the special operations that are required to update

the memory contents.

The M59PW016 features an innovative command,

Multiple Word Program, that is used to program

large streams of data. It greatly reduces the total

programming time when a large number of Words

are written to the memory at any one time. Using

this command the entire memory can be pro-

grammed in 2s, compared to 9s using the stan-

dard Word Program.

The end of a program or erase operation can be

detected and any error conditions identified. The

command set required to control the memory is

consistent with JEDEC standards.

Chip Enable and Output Enable signals control the

bus operation of the memory. They allow simple

connection to most microprocessors, often without

additional logic.

The memory is offered in SO44, TSOP48

(12x20mm), PDIP42 and SDIP42 packages. The

memory is supplied with all the bits erased (set to

’1’).

Figure 2. Logic Diagram

Table 1. Signal Names

A0-A19

DQ0-DQ15

Address Inputs

Data Inputs/Outputs

Chip Enable

Output Enable

Supply Voltage read

Supply Voltage program erase

Ground

Not Connected Internally

VCC

VPP

A0-A19

DQ0-DQ15

M59PW016

VSS

AI05806

4/26

M59PW016

Figure 3. PDIP and SDIP Connections

Figure 4. SO Connections

A18

A17

VSS

DQ0

DQ8

DQ1

DQ9

DQ2

DQ10

DQ3

DQ11

M59PW016

A19

A10

A11

A12

A13

A14

A15

A16

VPP

VSS

DQ15

DQ7

DQ14

DQ6

DQ13

DQ5

DQ12

DQ4

VCC

AI05807

A18

A17

VSS

DQ0

DQ8

DQ1

DQ9

DQ2

DQ10

DQ3

DQ11

11 M59PW016 34

A19

A10

A11

A12

A13

A14

A15

A16

VPP

VSS

DQ15

DQ7

DQ14

DQ6

DQ13

DQ5

DQ12

DQ4

VCC

AI05809

5/26

参数对比

与M59PW016100M1T相近的元器件有：M59PW016100B1、M59PW016100M1、M59PW016110M1T、M59PW016110B1、M59PW016110N1、M59PW016110N1T、M59PW016110S1、M59PW016110M1、M59PW016100S1。描述及对比如下：

型号	M59PW016100M1T	M59PW016100B1	M59PW016100M1	M59PW016110M1T	M59PW016110B1	M59PW016110N1	M59PW016110N1T	M59PW016110S1	M59PW016110M1	M59PW016100S1
描述	1MX16 FLASH 12V PROM, 100ns, PDSO44, 0.500 INCH, PLASTIC, SO-44	1MX16 FLASH 12V PROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42	1MX16 FLASH 12V PROM, 100ns, PDSO44, 0.500 INCH, PLASTIC, SO-44	1MX16 FLASH 12V PROM, 110ns, PDSO44, 0.500 INCH, PLASTIC, SO-44	1MX16 FLASH 12V PROM, 110ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42	1MX16 FLASH 12V PROM, 110ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48	1MX16 FLASH 12V PROM, 110ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48	1MX16 FLASH 12V PROM, 110ns, PDIP42, 0.600 INCH, PLASTIC, SDIP-42	1MX16 FLASH 12V PROM, 110ns, PDSO44, 0.500 INCH, PLASTIC, SO-44	1MX16 FLASH 12V PROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, SDIP-42
零件包装代码	SOIC	DIP	SOIC	SOIC	DIP	TSOP	TSOP	DIP	SOIC	DIP
包装说明	0.500 INCH, PLASTIC, SO-44	0.600 INCH, PLASTIC, DIP-42	0.500 INCH, PLASTIC, SO-44	0.500 INCH, PLASTIC, SO-44	0.600 INCH, PLASTIC, DIP-42	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP48,.8,20	SDIP, SDIP42,.6	0.500 INCH, PLASTIC, SO-44	SDIP, SDIP42,.6
针数	44	42	44	44	42	48	48	42	44	42
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	unknown	unknown	unknown	compliant	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	100 ns	100 ns	100 ns	110 ns	110 ns	110 ns	110 ns	110 ns	110 ns	100 ns
命令用户界面	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
数据轮询	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	R-PDSO-G44	R-PDIP-T42	R-PDSO-G44	R-PDSO-G44	R-PDIP-T42	R-PDSO-G48	R-PDSO-G48	R-PDIP-T42	R-PDSO-G44	R-PDIP-T42
长度	28.5 mm	52.455 mm	28.5 mm	28.5 mm	52.455 mm	18.4 mm	18.4 mm	36.83 mm	28.5 mm	36.83 mm
内存密度	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
部门数/规模	8	8	8	8	8	8	8	8	8	8
端子数量	44	42	44	44	42	48	48	42	44	42
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	SOP	SOP	DIP	TSOP1	TSOP1	SDIP	SOP	SDIP
封装等效代码	SOP44,.63	DIP42,.6	SOP44,.63	SOP44,.63	DIP42,.6	TSSOP48,.8,20	TSSOP48,.8,20	SDIP42,.6	SOP44,.63	SDIP42,.6
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE, SHRINK PITCH	SMALL OUTLINE	IN-LINE, SHRINK PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
编程电压	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3 mm	5.08 mm	3 mm	3 mm	5.08 mm	1.2 mm	1.2 mm	5.08 mm	3 mm	5.08 mm
部门规模	128K	128K	128K	128K	128K	128K	128K	128K	128K	128K
最大待机电流	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
最大压摆率	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	NO	YES	YES	NO	YES	YES	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	0.5 mm	0.5 mm	1.778 mm	1.27 mm	1.778 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
切换位	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	12.6 mm	15.24 mm	12.6 mm	12.6 mm	15.24 mm	12 mm	12 mm	15.24 mm	12.6 mm	15.24 mm
是否Rohs认证	符合	符合	符合	符合	符合	-	-	-	符合	-
厂商名称	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	-	-	-	-	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
JESD-609代码	e3	e3	e3	e3	e3	-	-	-	e3	-
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	NOT SPECIFIED	-
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	-	-	Matte Tin (Sn)	-
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	NOT SPECIFIED	-
Base Number Matches	1	1	1	1	1	1	1	-	-	-