型号
- 型号
- 关键词
EE PLD, 20ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240
厂商名称：AMD(超微)
厂商官网：http://www.amd.com
下载文档| 型号 | M5LV-384/184-15HC | M5LV-384/192-10AC | M5LV-384/192-7AC | M5LV-384/192-15AC | M5LV-384/192-12AC | M5LV-384/184-12HC | M5LV-384/184-10HC | M5LV-384/184-7HC |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 20ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 | EE PLD, 16ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 14ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 20ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 18ns, 384-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 18ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 | EE PLD, 16ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 | EE PLD, 14ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | QFP | BGA | BGA | BGA | BGA | QFP | QFP | QFP |
| 包装说明 | HFQFP, HQFP240,1.37SQ,20 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | LBGA, BGA256,20X20,50 | HFQFP, HQFP240,1.37SQ,20 | HFQFP, HQFP240,1.37SQ,20 | HFQFP, HQFP240,1.37SQ,20 |
| 针数 | 240 | 256 | 256 | 256 | 256 | 240 | 240 | 240 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE | PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE |
| 最大时钟频率 | 42 MHz | 58 MHz | 71 MHz | 42 MHz | 47.6 MHz | 47.6 MHz | 58 MHz | 71 MHz |
| 系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G240 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PQFP-G240 | S-PQFP-G240 | S-PQFP-G240 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES |
| 长度 | 32 mm | 27 mm | 27 mm | 27 mm | 27 mm | 32 mm | 32 mm | 32 mm |
| I/O 线路数量 | 184 | 192 | 192 | 192 | 192 | 184 | 184 | 184 |
| 宏单元数 | 384 | 384 | 384 | 384 | 384 | 384 | 384 | 384 |
| 端子数量 | 240 | 256 | 256 | 256 | 256 | 240 | 240 | 240 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 0 DEDICATED INPUTS, 184 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 184 I/O | 0 DEDICATED INPUTS, 184 I/O | 0 DEDICATED INPUTS, 184 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HFQFP | LBGA | LBGA | LBGA | LBGA | HFQFP | HFQFP | HFQFP |
| 封装等效代码 | HQFP240,1.37SQ,20 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | BGA256,20X20,50 | HQFP240,1.37SQ,20 | HQFP240,1.37SQ,20 | HQFP240,1.37SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 20 ns | 16 ns | 14 ns | 20 ns | 18 ns | 18 ns | 16 ns | 14 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.1 mm | 1.65 mm | 1.65 mm | 1.65 mm | 1.65 mm | 4.1 mm | 4.1 mm | 4.1 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | BALL | BALL | BALL | BALL | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 32 mm | 27 mm | 27 mm | 27 mm | 27 mm | 32 mm | 32 mm | 32 mm |
