型号
- 型号
- 关键词
Nibble Mode DRAM, 4MX1, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20
厂商名称：Mitsubishi(日本三菱)
厂商官网：http://www.mitsubishielectric.com/semiconductors/
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| 型号 | M5M44101L-8 | M5M44101J-8 | M5M44101J-10 | M5M44101L-10 |
|---|---|---|---|---|
| 描述 | Nibble Mode DRAM, 4MX1, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 | Nibble Mode DRAM, 4MX1, 80ns, CMOS, PDSO20, 0.350 INCH, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 4MX1, 100ns, CMOS, PDSO20, 0.350 INCH, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 4MX1, 100ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 零件包装代码 | ZIP | SOJ | SOJ | ZIP |
| 包装说明 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.4 | SOJ, SOJ20/26,.4 | ZIP, ZIP20,.1 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | NIBBLE | NIBBLE | NIBBLE | NIBBLE |
| 最长访问时间 | 80 ns | 80 ns | 100 ns | 100 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PZIP-T20 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | ZIP | SOJ | SOJ | ZIP |
| 封装等效代码 | ZIP20,.1 | SOJ20/26,.4 | SOJ20/26,.4 | ZIP20,.1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 10.16 mm | 3.65 mm | 3.65 mm | 10.16 mm |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.095 mA | 0.095 mA | 0.085 mA | 0.085 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2.8 mm | 8.9 mm | 8.9 mm | 2.8 mm |
