型号
- 型号
- 关键词
Standard SRAM, 1MX1, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
厂商名称：Mitsubishi(日本三菱)
厂商官网：http://www.mitsubishielectric.com/semiconductors/
下载文档| 型号 | M5M5V1001BP-20 | M5M5V1001BJ-25 | M5M5V1001BJ-25T | M5M5V1001BP-25 | M5M5V1001BJ-20 | M5M5V1001BJ-20T | M5M5V1001BJ-30 | M5M5V1001BJ-30T | M5M5V1001BP-30 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 1MX1, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 1MX1, 20ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 20ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 |
| 零件包装代码 | DIP | SOJ | SOJ | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
| 包装说明 | DIP, DIP28,.4 | SOJ, SOJ28,.44 | SOJ, | DIP, DIP28,.4 | SOJ, SOJ28,.44 | SOJ, | SOJ, SOJ28,.44 | SOJ, | DIP, DIP28,.4 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| ECCN代码 | 3A991.B.2.B | EAR99 | EAR99 | EAR99 | 3A991.B.2.B | 3A991.B.2.B | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 20 ns | 25 ns | 25 ns | 25 ns | 20 ns | 20 ns | 30 ns | 30 ns | 30 ns |
| 备用内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 |
| 内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOJ | SOJ | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | - | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) | - | - | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| I/O 类型 | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | - | SEPARATE | - | SEPARATE |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | - | e0 | - | e0 |
| 封装等效代码 | DIP28,.4 | SOJ28,.44 | - | DIP28,.4 | SOJ28,.44 | - | SOJ28,.44 | - | DIP28,.4 |
| 电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
| 最大待机电流 | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | - | 0.001 A | - | 0.001 A |
| 最小待机电流 | 3 V | 3 V | - | 3 V | 3 V | - | 3 V | - | 3 V |
| 最大压摆率 | 0.1 mA | 0.09 mA | - | 0.09 mA | 0.1 mA | - | 0.08 mA | - | 0.08 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | - | 1.27 mm | - | 2.54 mm |
