PICTURE-IN-PICTURE SIGNAL PROCESSING
器件类别:其他集成电路(IC) 消费电路
厂商名称:Mitsubishi(日本三菱)
厂商官网:http://www.mitsubishielectric.com/semiconductors/
下载文档型号 | M65665SP | M65665 | M65665FP |
---|---|---|---|
描述 | PICTURE-IN-PICTURE SIGNAL PROCESSING | PICTURE-IN-PICTURE SIGNAL PROCESSING | PICTURE-IN-PICTURE SIGNAL PROCESSING |
是否Rohs认证 | 不符合 | - | 不符合 |
厂商名称 | Mitsubishi(日本三菱) | - | Mitsubishi(日本三菱) |
零件包装代码 | DIP | - | SSOP |
包装说明 | SDIP, SDIP42,.6 | - | SSOP, SOP42,.5,32 |
针数 | 42 | - | 42 |
Reach Compliance Code | unknow | - | unknow |
应用 | TV | - | TV |
商用集成电路类型 | PICTURE-IN-PICTURE IC | - | PICTURE-IN-PICTURE IC |
锁定直播画面 | YES | - | YES |
JESD-30 代码 | R-PDIP-T42 | - | R-PDSO-G42 |
JESD-609代码 | e0 | - | e0 |
长度 | 36.7 mm | - | 17.5 mm |
功能数量 | 1 | - | 1 |
端子数量 | 42 | - | 42 |
最高工作温度 | 70 °C | - | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | SDIP | - | SSOP |
封装等效代码 | SDIP42,.6 | - | SOP42,.5,32 |
封装形状 | RECTANGULAR | - | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH |
电源 | 3.3 V | - | 3.3 V |
认证状态 | Not Qualified | - | Not Qualified |
座面最大高度 | 5.5 mm | - | 2.4 mm |
最大供电电压 (Vsup) | 3.5 V | - | 3.5 V |
最小供电电压 (Vsup) | 3.2 V | - | 3.2 V |
表面贴装 | NO | - | YES |
温度等级 | COMMERCIAL | - | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | GULL WING |
端子节距 | 1.778 mm | - | 0.8 mm |
端子位置 | DUAL | - | DUAL |
视频标准 | PAL; NTSC | - | PAL; NTSC |
宽度 | 15.24 mm | - | 8.4 mm |