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M74HCT368

HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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参数对比
与M74HCT368相近的元器件有:M74HCT368M1R、M74HCT368C1R、M74HCT368B1R、M74HCT367C1R、M54HCT368、M54HCT368F1R、M54HCT367F1R、M54HCT367。描述及对比如下:
型号 M74HCT368 M74HCT368M1R M74HCT368C1R M74HCT368B1R M74HCT367C1R M54HCT368 M54HCT368F1R M54HCT367F1R M54HCT367
描述 HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING HEX BUS BUFFER 3-STATE HCT367 NONINVERTING, HCT368 INVERTING
是否Rohs认证 - 符合 - 符合 符合 - 不符合 不符合 -
零件包装代码 - SOIC - DIP QFN - DIP DIP -
包装说明 - SOP, SOP16,.25 - DIP, DIP16,.3 QCCJ, LDCC20,.4SQ - DIP, DIP16,.3 DIP, DIP16,.3 -
针数 - 16 - 16 20 - 16 16 -
Reach Compliance Code - compli - compli compli - _compli _compli -
其他特性 - ONE FUNCTION WITH TWO BITS - ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS - ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS -
控制类型 - ENABLE LOW - ENABLE LOW ENABLE LOW - ENABLE LOW ENABLE LOW -
系列 - HCT - HCT HCT - HCT HCT -
JESD-30 代码 - R-PDSO-G16 - R-PDIP-T16 S-PQCC-J20 - R-GDIP-T16 R-GDIP-T16 -
JESD-609代码 - e4 - e3 e3 - e0 e0 -
负载电容(CL) - 150 pF - 150 pF 150 pF - 150 pF 150 pF -
逻辑集成电路类型 - BUS DRIVER - BUS DRIVER BUS DRIVER - BUS DRIVER BUS DRIVER -
最大I(ol) - 0.006 A - 0.006 A 0.006 A - 0.006 A 0.006 A -
位数 - 6 - 6 6 - 6 6 -
功能数量 - 1 - 1 1 - 1 1 -
端口数量 - 2 - 2 2 - 2 2 -
端子数量 - 16 - 16 20 - 16 16 -
最高工作温度 - 125 °C - 125 °C 85 °C - 125 °C 125 °C -
最低工作温度 - -55 °C - -55 °C -40 °C - -55 °C -55 °C -
输出特性 - 3-STATE - 3-STATE 3-STATE - 3-STATE 3-STATE -
输出极性 - INVERTED - INVERTED TRUE - INVERTED TRUE -
封装主体材料 - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED -
封装代码 - SOP - DIP QCCJ - DIP DIP -
封装等效代码 - SOP16,.25 - DIP16,.3 LDCC20,.4SQ - DIP16,.3 DIP16,.3 -
封装形状 - RECTANGULAR - RECTANGULAR SQUARE - RECTANGULAR RECTANGULAR -
封装形式 - SMALL OUTLINE - IN-LINE CHIP CARRIER - IN-LINE IN-LINE -
峰值回流温度(摄氏度) - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
电源 - 5 V - 5 V 5 V - 5 V 5 V -
Prop。Delay @ Nom-Su - 36 ns - 36 ns 28 ns - 36 ns 33 ns -
传播延迟(tpd) - 45 ns - 45 ns 35 ns - 45 ns 42 ns -
认证状态 - Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified -
座面最大高度 - 1.75 mm - 5.1 mm 4.57 mm - 5.08 mm 5.08 mm -
最大供电电压 (Vsup) - 5.5 V - 5.5 V 5.5 V - 5.5 V 5.5 V -
最小供电电压 (Vsup) - 4.5 V - 4.5 V 4.5 V - 4.5 V 4.5 V -
标称供电电压 (Vsup) - 5 V - 5 V 5 V - 5 V 5 V -
表面贴装 - YES - NO YES - NO NO -
技术 - CMOS - CMOS CMOS - CMOS CMOS -
温度等级 - MILITARY - MILITARY INDUSTRIAL - MILITARY MILITARY -
端子面层 - Nickel/Palladium/Gold (Ni/Pd/Au) - Matte Tin (Sn) Matte Tin (Sn) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子形式 - GULL WING - THROUGH-HOLE J BEND - THROUGH-HOLE THROUGH-HOLE -
端子节距 - 1.27 mm - 2.54 mm 1.27 mm - 2.54 mm 2.54 mm -
端子位置 - DUAL - DUAL QUAD - DUAL DUAL -
处于峰值回流温度下的最长时间 - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
宽度 - 3.9 mm - 7.62 mm 8.9662 mm - 7.62 mm 7.62 mm -
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