型号
- 型号
- 关键词
16KX8 SPI BUS SERIAL EEPROM, PDSO14, 0.169 INCH, TSSOP-14
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
下载文档| 型号 | M95128-WDL3 | M95128-SMN6T | M95128-SBN6 | M95128-SDL6T | M95128-SDL6 |
|---|---|---|---|---|---|
| 描述 | 16KX8 SPI BUS SERIAL EEPROM, PDSO14, 0.169 INCH, TSSOP-14 | 16KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 16KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, PLASTIC, DIP-8 | 16KX8 SPI BUS SERIAL EEPROM, PDSO14, 0.169 INCH, TSSOP-14 | 16KX8 SPI BUS SERIAL EEPROM, PDSO14, 0.169 INCH, TSSOP-14 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | TSSOP | SOIC | DIP | TSSOP | TSSOP |
| 包装说明 | 0.169 INCH, TSSOP-14 | 0.150 INCH, PLASTIC, SO-8 | 0.25 MM LEAD FRAME, PLASTIC, DIP-8 | 0.169 INCH, TSSOP-14 | 0.169 INCH, TSSOP-14 |
| 针数 | 14 | 8 | 8 | 14 | 14 |
| Reach Compliance Code | not_compliant | compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| 数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e4 | e3 | e0 | e0 |
| 长度 | 5 mm | 4.9 mm | 9.27 mm | 5 mm | 5 mm |
| 内存密度 | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 8 | 8 | 14 | 14 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | DIP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP14,.25 | SOP8,.25 | DIP8,.3 | TSSOP14,.25 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/5 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | 5.33 mm | 1.2 mm | 1.2 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000002 A | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A |
| 最大压摆率 | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 3.3 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 2.54 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | 7.62 mm | 4.4 mm | 4.4 mm |
| 最长写入周期时间 (tWC) | 5 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 厂商名称 | ST(意法半导体) | - | - | ST(意法半导体) | ST(意法半导体) |