型号
- 型号
- 关键词
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
器件类别：电信电路
厂商官网：https://www.rocelec.com/
器件标准： 
| 型号 | MAX2363ETM+T | MAX2365ETM+ |
|---|---|---|
| 描述 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
| 是否无铅 | 不含铅 | 含铅 |
| 厂商名称 | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFN | QFN |
| 包装说明 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
| 针数 | 48 | 48 |
| Reach Compliance Code | unknown | unknown |
| Is Samacsys | N | N |
| JESD-30 代码 | S-XQCC-N48 | S-XQCC-N48 |
| JESD-609代码 | e3 | e3 |
| 长度 | 7 mm | 7 mm |
| 湿度敏感等级 | 1 | 1 |
| 功能数量 | 1 | 1 |
| 端子数量 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 |
| 认证状态 | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 0.8 mm | 0.8 mm |
| 标称供电电压 | 2.8 V | 2.8 V |
| 表面贴装 | YES | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN | TIN |
| 端子形式 | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm |
| Base Number Matches | 1 | 1 |