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MAX3023EUD+T

Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Maxim(美信半导体)
零件包装代码
TSSOP
包装说明
TSSOP, TSSOP14,.25
针数
14
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
10 weeks
接口集成电路类型
INTERFACE CIRCUIT
JESD-30 代码
R-PDSO-G14
JESD-609代码
e3
长度
5 mm
湿度敏感等级
1
功能数量
4
端子数量
14
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP14,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
1.8/3.3 V
认证状态
Not Qualified
座面最大高度
1.1 mm
最大供电电压
3.6 V
最小供电电压
1.65 V
标称供电电压
2.5 V
电源电压1-最大
3.2 V
电源电压1-分钟
1.2 V
电源电压1-Nom
1.8 V
表面贴装
YES
技术
BICMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
4.4 mm
文档预览
19-3266; Rev 2; 12/04
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
General Description
The MAX13013/MAX13014/MAX3023 single-/dual-/quad-
level translators provide the level shifting necessary to
allow 100Mbps data transfer in a multivoltage system.
Externally applied voltages, V
CC
and V
L
, set the logic
levels on either side of the device. Logic signals present
on the V
L
side of the device appear as a higher voltage
logic signal on the V
CC
side of the device, and vice-
versa.
The MAX13013 single-, the MAX13014 dual-, and the
MAX3023 (UCSP™ package) quad-level translators fea-
ture an enable (EN) input. The MAX3023 (TSSOP pack-
age) quad-level translator features EN and
EN
inputs.
When disabled, each device places all inputs/outputs
on both sides in tri-state and reduces the V
CC
supply
current to 0.03µA, and the V
L
supply current to 0.1µA.
These devices operate at a guaranteed 100Mbps data
rate for V
L
> 1.8V.
The MAX13013/MAX13014/MAX3023 accept a +1.65V
to +3.6V V
CC
voltage and a +1.2V to (V
CC
- 0.4V) V
L
voltage, making them ideal for data transfer between
low-voltage ASICs/programmable logic devices (PLDs)
and higher voltage systems. The MAX13013 is avail-
able in 3 x 2 UCSP and 6-pin SC70 packages. The
MAX13014 is available in 3 x 3 UCSP and 8-pin SOT23
packages. The MAX3023 is available in 4 x 3 UCSP
and 14-pin TSSOP packages. All devices operate over
the extended -40°C to +85°C temperature range.
Features
100Mbps Guaranteed Data Rate
Bidirectional Level Translation
MAX13013 (Single)
MAX13014 (Dual)
MAX3023 (Quad)
V
L
Operation Down to +1.2V
Ultra-Low 0.1µA Supply Current When Disabled
Low-Quiescent Current (0.1µA)
UCSP, SC70, SOT23, and TSSOP Packages
MAX13013/MAX13014/MAX3023
Pin Configurations
TOP VIEW
V
CC
1
6
EN
A
V
CC
GND 2
I/O V
CC
1
GND
1
2
3
MAX13013
5
V
L
B
MAX13013
V
L
I/O V
L
1
EN
I/O V
CC
1 3
4
I/O V
L
1
SC70
3 x 2 UCSP
TOP VIEW
(BUMPS ON BOTTOM OF DIE)
Typical Operating Circuit
+1.8V
0.1µF
0.1µF
+3.3V
Applications
CMOS Logic-Level Translation
Low-Voltage ASIC Level Translation
Cell Phones
SPI™, MICROWIRE™ Level Translation
Portable POS Systems
Portable Communication Devices
GPS
Telecommunications Equipment
+1.8V
SYSTEM
CONTROLLER
CLK
DATA
GND
V
L
V
CC
+3.3V
SYSTEM
MAX13014
I/O V
L
1
I/O V
L
2
I/O V
CC
1
I/O V
CC
2
GND
CLK
DATA
GND
Ordering Information/Selector Guide
PART
MAX13013EXT
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
6 SC70
PACKAGE
CODE
TOP
MARK
ACD
NUMBER OF
V
L
V
CC
TRANSLATORS
1
Number of
V
CC
V
L
TRANSLATORS
1
EN
EN
MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet.
Ordering Information/Selector Guide continued at end of
data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
MAX13013/MAX13014/MAX3023
ABSOLUTE MAXIMUM RATINGS
All voltages are referenced to GND.
V
CC
...........................................................................-0.3V to +4V
V
L...........................................................................................
-0.3V to +4V
I/O V
CC_
......................................................-0.3V to (V
CC
+ 0.3V)
I/O V
L_
...........................................................-0.3V to (V
L
+ 0.3V)
EN,
EN...........................................................-0.3V
to (V
L
+ 0.3V)
Short-Circuit Duration I/O V
L_
,
I/O V
CC_
to GND ....................................................Continuous
Continuous Power Dissipation (T
A
= +70°C)
6-Pin SC70 (derate 3.1mW/°C above +70°C) ..............245mW
6-Bump UCSP (derate 3.9mW/°C above +70°C).........308mW
8-Bump UCSP (derate 4.7mW/°C above +70°C).........379mW
8-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW
12-Bump UCSP (derate 6.5mW/°C above +70°C) ...518.8mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +1.65V to +3.6V, V
L
= +1.2V to (V
CC
- 0.4V), EN = V
L
,
EN
= open (MAX3023 TSSOP package only), C
IOVL
15pF, C
IOVCC
40pF,
T
A
= T
MIN
to T
MAX
. Typical values are at T
A
= +25°C.) (Notes 1, 2)
PARAMETER
POWER SUPPLY
V
L
Supply Range
V
CC
Supply Range
Supply Current from V
CC
V
L
V
CC
IQV
CC
I/O V
CC
_ = 0, I/O V
L
_ = 0
or I/O V
CC
_ = V
CC
, I/O V
L
_ = V
L
I/O V
CC
_ = 0, I/O V
L
_ = 0
or I/O V
CC
_ = V
CC
, I/O V
L
_ = V
L
Supply Current from V
L
IQV
L
I/O V
CC
_ = 0, I/O V
L
_ = 0
or I/O V
CC
_ = V
CC
, I/O V
L
_ = V
L
,
V
L
< V
CC
- 0.2V
T
A
= +25°C, EN = 0
T
A
= +25°C, EN = 0
T
A
= +25°C, EN = 0, V
L
= V
CC
- 0.2V
T
A
= +25°C, EN = 0
I
TS-VL
T
A
= +25°C, EN = 0, V
L
= V
CC
- 0.2V
T
A
= +25°C, EN = 0
T
A
= +25°C, EN = 0, V
L
= V
CC
- 0.2V
55
74
0.15
20
µA
1.2
1.65
0.1
0.2
V
CC
- 0.4
3.60
1
2
µA
10
100
V
V
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
CC
Tri-state Output-Mode
Supply Current
V
L
Tri-state Output-Mode Supply
Current (MAX13013/MAX13014)
V
L
Tri-state Output-Mode Supply
Current (MAX3023 TSSOP
Package Only)
I/O Tri-state Output-Mode
Leakage Current
I
TS-VCC
I
TS-VL
0.03
0.1
1
50
1
0.2
2
70
µA
µA
µA
2
_______________________________________________________________________________________
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +1.65V to +3.6V, V
L
= +1.2V to (V
CC
- 0.4V), EN = V
L
,
EN
= open (MAX3023 TSSOP package only), C
IOVL
15pF, C
IOVCC
40pF,
T
A
= T
MIN
to T
MAX
. Typical values are at T
A
= +25°C.) (Notes 1, 2)
PARAMETER
LOGIC-LEVEL THRESHOLDS
I/O V
L
_ Input-Voltage High
I/O V
L
_ Input-Voltage Low
Pullup Resistance on I/O V
L
_
Pulldown Resistance on I/O V
L
_
I/O V
CC
_ Input-Voltage High
I/O V
CC
_ Input-Voltage Low
Pullup Resistance on I/O V
CC
_
Pulldown Resistance on I/O V
CC
_
EN,
EN
Input-Voltage High
EN,
EN
Input-Voltage Low
EN Input Current
Pullup Resistance on EN
Pulldown Resistance on
EN
I/O V
L
_ Output-Voltage High
I/O V
L
_ Output-Voltage Low
I/O V
CC
_ Output-Voltage High
I/O V
CC
_ Output-Voltage Low
V
OHL
V
OLL
V
OHC
V
OLC
V
IH
V
IL
MAX13013/MAX13014
MAX3023
MAX3023, TSSOP package only
I/O V
L
source current = 20µA
I/O V
L
sink current = 20µA
I/O V
CC
source current = 20µA
I/O V
CC
sink current = 20µA
2/3 x V
CC
1/3 x V
CC
-5
46
46
2/3 x V
L
1/3 x V
L
62
62
V
IHC
V
ILC
2.5
2.5
2/3 x V
L
1/3 x V
L
+5
81
81
V
IHL
V
ILL
120
75
2/3 x V
CC
1/3 x V
CC
2/3 x V
L
1/3 x V
L
V
V
V
V
kΩ
kΩ
V
V
µA
kΩ
kΩ
V
V
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX13013/MAX13014/MAX3023
_______________________________________________________________________________________
3
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
MAX13013/MAX13014/MAX3023
TIMING CHARACTERISTICS
(V
CC
= +1.65V to +3.6V, V
L
= +1.2V to (V
CC
- 0.4V), EN = V
L
,
EN
= open (MAX3023 TSSOP package only), C
IOVL
15pF, C
IOVCC
40pF, T
A
= T
MIN
to T
MAX
. Typical values are at T
A
= +25°C.) (Notes 1, 2)
PARAMETER
I/O V
CC
_ Rise Time
SYMBOL
t
RVCC
CONDITIONS
C
IOVCC
= 15pF, Figure 1
C
IOVCC
= 20pF, Figure 1
C
IOVCC
= 40pF, Figure 1
C
IOVCC
= 15pF, Figure 1
I/O V
CC
_ Fall Time
I/O V
CC
_ One-Shot Output Impedance
I/O V
L
_ Rise Time
I/O V
L
_ Fall Time
I/O V
L
_ One-Shot Output Impedance
Propagation Delay, Driving I/O V
L
_
Propagation Delay, Driving I/O V
CC
_
Part-to-Part Skew (Note 3)
Propagation Delay from
I/O V
L
_ to I/O V
CC
_ after Enable
Propagation Delay from
I/O V
CC
_ to I/O V
L
_ after Enable
Maximum Data Rate
I/O
VL-VCC
C
IOVCC
= 15pF, Figure 1
I/O
VCC-VL
C
IOVL
= 15pF, Figure 2
t
PPSKEW
t
EN-VCC
t
EN-VL
C
IOVCC
= 15pF, C
IOVL
= 15pF,
V
CC
= 2.5V, V
L
= 1.8V
C
IOVCC
= 15pF, Figure 3
C
IOVL
= 15pF, Figure 4
C
IOVCC
= 15pF, C
IOVL
= 15pF, V
L
> 1.8V
C
IOVCC
= 15pF, C
IOVL
= 15pF, V
L
> 1.2V
100
80
t
RVL
t
FVL
C
IOVL
= 15pF, Figure 2
C
IOVL
= 15pF, Figure 2
t
FVCC
C
IOVCC
= 20pF, Figure 1
C
IOVCC
= 40pF, Figure 1
MIN
TYP
MAX
2.5
3
4
2.5
3
4
18.5
2.5
2.5
12.5
6.5
6
4
1000
1000
ns
ns
ns
ns
ns
ns
ns
Mbps
ns
ns
UNITS
Note 1:
V
L
must be less than or equal to V
CC
- 0.4V during normal operation. However, V
L
can be greater than V
CC
during startup
and shutdown conditions.
Note 2:
All units are 100% production tested at T
A
= +25°C. Limits over the operating temperature range are guaranteed by design
and not production tested.
Note 3:
Not production tested. Guaranteed by design.
4
_______________________________________________________________________________________
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
Typical Operating Characteristics
(Data rate = 100Mbps, V
CC
= 3.3V, V
L
= 1.8V, T
A
= +25°C, unless otherwise noted.)
MAX13013/MAX13014/MAX3023
V
L
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX13013 toc01
V
L
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX13013 toc02
V
CC
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX13013 toc03
1.0
0.6
0.5
V
L
SUPPLY CURRENT (mA)
0.4
0.3
0.2
0.1
0
DRIVING I/O V
L_
V
L
= 1.2V
C
IOVCC
= 15pF
1.5
2.0
2.5
3.0
3.5
25
V
CC
SUPPLY CURRENT (mA)
V
L
SUPPLY CURRENT (mA)
0.8
20
0.6
15
0.4
DRIVING I/O V
L_
V
L
= 1.8V
C
IOVCC
= 15pF
2.0
2.5
3.0
3.5
4.0
10
DRIVING I/O V
L_
V
L
= 1.8V
C
IOVCC
= 15pF
2.0
2.5
3.0
3.5
4.0
0.2
5
0
V
CC
SUPPLY VOLTAGE (V)
0
4.0
V
CC
SUPPLY VOLTAGE (V)
V
CC
SUPPLY VOLTAGE (V)
V
CC
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX13013 toc04
V
L
SUPPLY CURRENT
vs. TEMPERATURE
MAX13013 toc05
V
CC
SUPPLY CURRENT
vs. TEMPERATURE
DRIVING I/O V
CC_
C
IOVL
= 15pF
MAX13013 toc06
25
4.0
16
15
V
CC
SUPPLY CURRENT (mA)
14
13
12
11
10
V
CC
SUPPLY CURRENT (mA)
15
V
L
SUPPLY CURRENT (mA)
20
3.6
3.2
10
DRIVING I/O V
L_
V
L
= 1.2V
C
IOVCC
= 15pF
1.5
2.0
2.5
3.0
3.5
4.0
2.8
5
2.4
DRIVING I/O V
CC_
C
IOVL
= 15pF
-40
-15
10
35
60
85
0
V
CC
SUPPLY VOLTAGE (V)
2.0
TEMPERATURE (°C)
-40
-15
10
35
60
85
TEMPERATURE (°C)
V
L
SUPPLY CURRENT
vs. CAPACITIVE LOAD ON I/O V
CC_
MAX13013 toc07
V
CC
SUPPLY CURRENT
vs. CAPACITIVE LOAD ON I/O V
CC_
MAX13013 toc08
RISE/FALL TIME
vs. CAPACITIVE LOAD ON I/O V
CC_
MAX13013 toc09
1.0
25
1.5
V
CC
SUPPLY CURRENT (mA)
V
L
SUPPLY CURRENT (mA)
0.8
22
1.2
RISE/FALL TIME (ns)
t
RISE
0.9
0.6
19
0.4
16
0.6
t
FALL
0.2
DRIVING I/O V
L_
0
0
10
20
30
40
CAPACITIVE LOAD (pF)
13
DRIVING I/O V
L_
10
0
10
20
30
40
CAPACITIVE LOAD (pF)
0.3
DRIVING I/O V
L_
0
0
10
20
30
40
CAPACITIVE LOAD (pF)
_______________________________________________________________________________________
5
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参数对比
与MAX3023EUD+T相近的元器件有:MAX3023EBC-TG47、MAX13014EKA-T、MAX13014EBL-T、MAX3023EBC+T、MAX13013EBT+T、MAX13013EXT+T。描述及对比如下:
型号 MAX3023EUD+T MAX3023EBC-TG47 MAX13014EKA-T MAX13014EBL-T MAX3023EBC+T MAX13013EBT+T MAX13013EXT+T
描述 Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps Translation - Voltage Levels +1.2V to +3.6V, 0.1 A, 100Mbps, Single-/Dual-/Quad-Level Translators Translation - Voltage Levels Single 100Mbps
是否无铅 不含铅 - 含铅 含铅 不含铅 - 不含铅
是否Rohs认证 符合 - 不符合 不符合 符合 符合 符合
厂商名称 Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) -
零件包装代码 TSSOP - SOIC BGA BGA - SOIC
包装说明 TSSOP, TSSOP14,.25 - MO-178, SOT-23, 8 PIN UCSP-9 VFBGA, BGA12,3X4,20 - TSSOP, TSSOP6,.08
针数 14 - 8 9 12 - 6
Reach Compliance Code compliant - not_compliant not_compliant compliant compliant compliant
接口集成电路类型 INTERFACE CIRCUIT - INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT - INTERFACE CIRCUIT
JESD-30 代码 R-PDSO-G14 - R-PDSO-G8 S-PBGA-B9 R-PBGA-B12 R-PBGA-B6 R-PDSO-G6
JESD-609代码 e3 - e0 e0 e3 - e4
长度 5 mm - 2.9 mm 1.52 mm 2.02 mm - 2 mm
湿度敏感等级 1 - 1 1 1 - 1
功能数量 4 - 2 2 4 - 1
端子数量 14 - 8 9 12 6 6
最高工作温度 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP - LSSOP VFBGA VFBGA FBGA TSSOP
封装等效代码 TSSOP14,.25 - TSSOP8,.1 BGA9,3X3,20 BGA12,3X4,20 BGA6,2X3,20 TSSOP6,.08
封装形状 RECTANGULAR - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 - 240 240 260 - 260
电源 1.8/3.3 V - 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm - 1.45 mm 0.67 mm 0.67 mm - 1.1 mm
最大供电电压 3.6 V - 3.6 V 3.6 V 3.6 V - 3.6 V
最小供电电压 1.65 V - 1.65 V 1.65 V 1.65 V - 1.65 V
标称供电电压 2.5 V - 2.5 V 2.5 V 2.5 V - 2.5 V
电源电压1-最大 3.2 V - 3.2 V 3.2 V 3.2 V - 3.2 V
电源电压1-分钟 1.2 V - 1.2 V 1.2 V 1.2 V - 1.2 V
电源电压1-Nom 1.8 V - 1.8 V 1.8 V 1.8 V - 1.8 V
表面贴装 YES - YES YES YES YES YES
技术 BICMOS - BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Matte Tin (Sn) - Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING - GULL WING BALL BALL BALL GULL WING
端子节距 0.65 mm - 0.65 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm
端子位置 DUAL - DUAL BOTTOM BOTTOM BOTTOM DUAL
处于峰值回流温度下的最长时间 30 - 20 20 30 - 30
宽度 4.4 mm - 1.625 mm 1.52 mm 1.54 mm - 1.25 mm
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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