ESD Protection (All Pins, Human Body Model) (Note 1)....
Q4000V
Operating Temperature Range ........................ -55NC to +150NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) .....................................+260NC
Note 1:
Human Body Model, 100pF discharged through a 1.5kI resistor.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........41°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................8°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS
(T
A
= -55
N
C to +150
N
C, unless otherwise noted.) (Notes 3, 4)
PARAMETER
Operating Supply Voltage
Input High Voltage
Input Low Voltage
SYMBOL
V
DD
V
IH
V
IL
CONDITIONS
MIN
2.5
V
DD
x 0.7
V
DD
x 0.3
TYP
3.3
MAX
3.7
UNITS
V
V
V
ELECTRICAL CHARACTERISTICS
(V
DD
= 2.5V to 3.7V, T
A
= -55
N
C to +150
N
C, unless otherwise noted. Typical values are V
DD
= 3.3V, T
A
= +25NC.) (Note 3)
PARAMETER
Accuracy (Note 5)
Temperature Conversion Noise
Temperature Data Resolution
Conversion Time
First Conversion Completed
Data ready after POR
I
2
C inactive, T
A
=
-40NC to +125NC
Shutdown mode, I
2
C inactive, T
A
=
-40NC to +125NC
I
2
C inactive, T
A
=
+150NC
Shutdown mode, I
2
C inactive,
T
A
=
+150NC
600
2.5
800
4.2
2
SYMBOL
CONDITIONS
2.5V
P
+ V
DD
P
3.7V, -40NC
P
T
A
P
+105NC
2.5V
P
+ V
DD
P
3.7V, -55NC
P
T
A
P
+150NC
MIN
-0.5
-0.7
TYP
±0.1
0.0625
MAX
+0.5
+0.7
16
UNITS
NC
NC
Bits
ms
ms
16
44
50
50
925
3.5
Quiescent Supply Current
I
DD
FA
Maxim Integrated
MAX31725/MAX31726
±0.5°C Local Temperature Sensors
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 2.5V to 3.7V, T
A
= -55
N
C to +150
N
C, unless otherwise noted. Typical values are V
DD
= 3.3V, T
A
= +25NC.) (Note 3)
PARAMETER
OS Delay
T
OS
Default Temperature
T
HYST
Default Temperature
POR Voltage Threshold
POR Hysteresis
Input-High Leakage Current
Input-Low Leakage Current
Input Capacitance
Output-High Leakage Current
OS Output Saturation Voltage
Output Low Voltage
I
IH
I
IL
V
IN
= 3.3V (all digital inputs)
V
IN
= 0V (all digital inputs )
All digital inputs
V
IN
= 3.3V (SDA and OS)
I
OUT
= 4.0mA
I
OL
= 3mA (SDA)
SYMBOL
CONDITIONS
Depends on fault queue setting
Factory default setting
Factory default setting
MIN
1
80
75
80
75
2.26
130
0.005
0.005
5
1
0.8
0.4
1
1
TYP
MAX
6
80
75
UNITS
Conversions
NC
NC
V
mV
FA
FA
pF
FA
V
V
I
2
C AC ELECTRICAL CHARACTERISTICS
(V
DD
= 2.5V to 3.7V, T
A
= -55
N
C to +150NC, unless otherwise noted. Typical values are V
DD
= 3.3V, T
A
= +25
N
C.) (Notes 3, 6) (Figure
1)
PARAMETER
Serial Clock Frequency
Minimum
RESET
Pulse Width
Bus Free Time Between STOP
and START Conditions
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
START Condition Setup Time
Data Setup Time
Data Out Hold Time
Data In Hold Time
Maximum Receive SCL/SDA Rise
Time
Minimum Receive SCL/SDA Rise
Time
Maximum Receive SCL/SDA Fall
Time
Minimum Receive SCL/SDA Fall
Time
Transmit SDA Fall Time
SYMBOL
f
SCL
t
RESET
t
BUF
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:STA
t
SU:DAT
t
DH
t
HD:DAT
t
R
t
R
t
F
t
F
t
F
90% of SCL to 90% of SDA
10% of SDA to 10% of SCL
(Note 8)
10% of SCL to 10% of SDA (Note 8)
(Note 9)
(Note 9)
(Note 9)
(Note 9)
(Note 9)
20 +
0.1C
B
90% of SCL to 10% of SDA
(Note 7)
MAX31726 only
CONDITIONS
MIN
DC
100
1.3
0.6
600
1.3
0.6
100
100
100
0
300
20 +
0.1C
B
300
20 +
0.1C
B
250
0.9
TYP
MAX
400
UNITS
kHz
ns
Fs
Fs
ns
Fs
Fs
ns
ns
ns
Fs
ns
ns
ns
ns
ns
Maxim Integrated
3
MAX31725/MAX31726
±0.5°C Local Temperature Sensors
I
2
C AC ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 2.5V to 3.7V, T
A
= -55
N
C to +150NC, unless otherwise noted. Typical values are V
DD
= 3.3V, T
A
= +25
N
C.) (Notes 3, 6) (Figure
1)
PARAMETER
Pulse Width of Suppressed Spike
SDA Time Low for Reset of Serial
Interface
SYMBOL
t
SP
t
TIMEOUT
(Note 10)
(Note 7)
CONDITIONS
MIN
0
45
50
TYP
MAX
50
55
UNITS
ns
ms
Note 3:
Limits are 100% production tested at T
A
= +25NC and/or T
A
= +85NC. Limits over the operating temperature range and
relevant supply voltage range are guaranteed by design and characterization. Typical values are not guaranteed.
Note 4:
All voltages are referenced to ground. Currents entering the IC are specified positive.
Note 5:
These limits represent a 3-sigma distribution.
Note 6:
All timing specifications are guaranteed by design.
Note 7:
Holding the SDA line low for a time greater than t
TIMEOUT
causes the devices to reset SDA to the idle state of the serial
bus communication (SDA released).
Note 8:
A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s fall-
ing edge.
Note 9:
C
B
= total capacitance of one bus line in pF. Tested with C
B
= 400pF.
Note 10:
Input filters on SDA and SCL suppress noise spikes less than 50ns.
