型号
- 型号
- 关键词
35OHM, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
下载文档| 型号 | MAX4697EBT | MAX4696 | MAX4696EBT | MAX4698EBT |
|---|---|---|---|---|
| 描述 | 35OHM, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | 35OHM, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | 35OHM, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package | 35OHM, Low-Voltage, SPST/SPDT Analog Switches in UCSP Package |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | BGA | - | BGA | BGA |
| 包装说明 | 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 | - | 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 | 1.50 X 1.02 MM, 0.50 MM PITCH, BUMP, UCSP-6 |
| 针数 | 6 | - | 6 | 6 |
| Reach Compliance Code | _compli | - | _compli | _compli |
| 模拟集成电路 - 其他类型 | SPST | - | SPST | SPDT |
| JESD-30 代码 | R-PBGA-B6 | - | R-PBGA-B6 | R-PBGA-B6 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 长度 | 1.98 mm | - | 1.98 mm | 1.98 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 |
| 端子数量 | 6 | - | 6 | 6 |
| 标称断态隔离度 | 75 dB | - | 75 dB | 75 dB |
| 最大通态电阻 (Ron) | 35 Ω | - | 35 Ω | 35 Ω |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | VFBGA | VFBGA |
| 封装等效代码 | BGA6,2X3,20 | - | BGA6,2X3,20 | BGA6,2X3,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 | - | 240 | 240 |
| 电源 | 3/5 V | - | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.67 mm | - | 0.67 mm | 0.67 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | - | YES | YES |
| 最长断开时间 | 25 ns | - | 25 ns | 25 ns |
| 最长接通时间 | 80 ns | - | 80 ns | 80 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NOT SPECIFIED | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL | - | BALL | BALL |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 20 |
| 宽度 | 1.75 mm | - | 1.75 mm | 1.75 mm |
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