型号
- 型号
- 关键词
analog switch ics 50ohm dual spst analog switch
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
器件标准：
| 型号 | MAX4732EUA+T | MAX4731EUA+T | MAX4731ETA+T | MAX4731EBL+T | MAX4733EUA+ |
|---|---|---|---|---|---|
| 描述 | analog switch ics 50ohm dual spst analog switch | analog switch ics 50ohm dual spst analog switch | analog switch ics 50ohm dual spst analog switch | analog switch ics 50ohm dual spst analog switch | analog switch ics 50ohm dual spst analog switch |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | TSSOP, | TSSOP, TSSOP8,.19 | , | 1.52 X 1.52 MM, UCSP-9 | TSSOP, TSSOP8,.19 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 零件包装代码 | TSSOP | TSSOP | - | BGA | TSSOP |
| 针数 | 8 | 8 | - | 9 | 8 |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | - | S-XBGA-B9 | S-PDSO-G8 |
| JESD-609代码 | e3 | e3 | - | e1 | e3 |
| 长度 | 3 mm | 3 mm | - | 1.52 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 |
| 信道数量 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 8 | 8 | - | 9 | 8 |
| 标称断态隔离度 | 72 dB | 72 dB | - | 72 dB | 72 dB |
| 通态电阻匹配规范 | 0.8 Ω | 0.8 Ω | - | 0.8 Ω | 0.8 Ω |
| 最大通态电阻 (Ron) | 50 Ω | 50 Ω | - | 50 Ω | 50 Ω |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | - | VFBGA | TSSOP |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | - | 0.69 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 11 V | 11 V | - | 11 V | 11 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | YES | - | YES | YES |
| 最长断开时间 | 60 ns | 60 ns | - | 60 ns | 60 ns |
| 最长接通时间 | 150 ns | 150 ns | - | 150 ns | 150 ns |
| 技术 | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | - | BALL | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | - | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | - | BOTTOM | DUAL |
| 宽度 | 3 mm | 3 mm | - | 1.52 mm | 3 mm |
| Factory Lead Time | - | 6 weeks | 12 weeks | - | 6 weeks |
| 正常位置 | - | NO | - | NO | NO/NC |
| 输出 | - | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装等效代码 | - | TSSOP8,.19 | - | BGA9,3X3,20 | TSSOP8,.19 |
| 电源 | - | 3/5 V | - | 3/5 V | 3/5 V |
| 切换 | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |