型号
- 型号
- 关键词
监控电路 uPower Supervisor
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
器件标准：
| 型号 | MAX6400BS27+T | MAX6400BS31+T | MAX6402BS24-T | MAX6400BS27-T | MAX6400BS22+T | MAX6400BS28+T |
|---|---|---|---|---|---|---|
| 描述 | 监控电路 uPower Supervisor | 监控电路 uPower Supervisor | 监控电路 uP Supervisory Circuit in 4-Bump 2x2 Chip-Scale Package | 监控电路 uP Supervisory Circuit in 4-Bump 2x2 Chip-Scale Package | 监控电路 uPower Supervisor | 监控电路 uPower Supervisor |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BUMP, UCSP-4 | BUMP, UCSP-4 | BUMP, UCSP-4 | BUMP, UCSP-4 | VFBGA, BGA4,2X2,20 | BUMP, UCSP-4 |
| 针数 | 4 | 4 | 4 | 4 | 4 | 4 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PBGA-B4 | S-PBGA-B4 | S-PBGA-B4 | S-PBGA-B4 | S-PBGA-B4 | S-PBGA-B4 |
| 长度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 245 | 245 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.67 mm | 0.67 mm | 0.67 mm | 0.67 mm | 0.67 mm | 0.67 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 封装等效代码 | - | BGA4,2X2,20 | BGA4,2X2,20 | BGA4,2X2,20 | BGA4,2X2,20 | - |
| 电源 | - | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | - |
| 最大供电电流 (Isup) | - | 0.00175 mA | 0.00175 mA | 0.00175 mA | 0.00175 mA | - |
| 阈值电压标称 | - | +3.1V | +2.4V | +2.7V | +2.2V | - |
嵌入式系统
FPGA/CPLD
单片机
stm32/stm8
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嵌入式系统