Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
ESD Rating (Human Body Model)......................................2000V
Lead Temperature .............................................................Note 1
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(+3V
≤
V
S
≤
+5.5V, T
A =
-55°C to +125°C, unless otherwise noted.)
PARAMETER
Power-Supply Voltage
Quiescent Current
SYMBOL
V
S
I
2
C-compatible active
I
C
I
2
C-compatible inactive
Shutdown mode
ADC Resolution
Temperature Resolution
MAX6625
MAX6626
MAX6625
MAX6626
T
A
= +25°C, V
S
= +3V to +3.6V
0°C = T
A
≤
+50°C, V
S
= +3.0V to +3.6V
0°C = T
A
≤
+70°C, V
S
= +3.0V to +3.6V
Power-Supply Sensitivity
Conversion Time
OT Pullup Resistor
OT Saturation Voltage (Note 4)
OT Delay
T
HIGH
Default Temperature
T
LOW
Default Temperature
T
HIGH
T
LOW
V
S
< +3.6V
V
S
> +3.6V
2
3
0.8
0.2
t
C
R
P
V
L
MAX6625R, MAX6626R only
I
OUT
= 4mA (Note 4)
(Programmable through fault queue)
1
×
t
C
80
75
25
V
S
= +3V to +5.5V
1
133
50
0.8
6
×
t
C
250
1
9
12
0.5
0.0625
±1
±1.5
±2.0
°C/V
ms
kΩ
V
ms
°C
°C
°C
CONDITIONS
MIN
3.0
TYP
MAX
5.5
1
UNITS
V
mA
µA
µA
Bits
°C/LSB
Accuracy (Notes 2, 3)
I
2
C-COMPATIBLE I/O: SCL, SDA, ADD
Input High Voltage
Input Low Voltage
Input Hysteresis
V
IH
V
IL
V
V
V
2
Maxim Integrated
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
ELECTRICAL CHARACTERISTICS (continued)
(+3V
≤
V
S
≤
+5.5V, T
A =
-55°C to +125°C, unless otherwise noted.)
PARAMETER
Input High Leakage Current
Input Low Leakage Current
Input Capacitance
Output Low Voltage
Output High Current
I
2
C-COMPATIBLE TIMING
Serial Clock Frequency
Bus Free Time Between STOP
and START Conditions
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data Setup Time
Data Hold Time
Maximum Receive SCL/SDA
Rise Time
Minimum Receive SCL/SDA
Rise Time
Maximum Receive SCL/SDA
Fall Time
Minimum Receive SCL/SDA
Fall Time
Transmit SDA Fall Time
Pulse Width of Suppressed
Spike
f
SCL
t
BUF
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:DAT
t
HD:DAT
t
R
t
R
t
F
t
F
t
F
t
SP
(Note 5)
(Note 6)
(Note 6)
(Note 6)
(Note 6)
C
B
= 400pF, I
O
= 3mA (Note 6)
(Note 7)
20 +
0.1C
B
50
DC
1.3
0.6
0.6
1.3
0.6
100
0
300
20 +
0.1C
B
300
20 +
0.1C
B
250
0.9
400
kHz
µs
µs
µs
µs
µs
ns
µs
ns
ns
ns
ns
ns
ns
SYMBOL
I
IH
I
IL
C
IN
V
OL
I
OH
I
OL
= 3mA
V
OH
= 5V
V
IN
= +5V
V
IN
= 0
10
0.4
1
CONDITIONS
MIN
TYP
MAX
±1
±1
UNITS
µA
µA
pF
V
µA
Note 2:
Guaranteed by design and characterization to ±5 sigma.
Note 3:
Quantization error not included in specifications for temperature accuracy.
Note 4:
Output current should be minimized for best temperature accuracy. Power dissipation within the MAX6625/MAX6626 causes
self-heating and temperature drift; see the
Thermal Considerations
section.
Note 5:
A master device must provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of
SCL’s falling edge.
Note 6:
C
B
= total capacitance of one bus line in pF. Tested with C
B
= 400pF.
Note 7:
Input filters on SDA, SCL, and ADD suppress noise spikes less than 50ns.
SCL
t
F
t
LOW
t
R
t
HIGH
t
HD:STA
SDA
t
BUF
t
SU:DAT
t
HD:DAT
t
SU:STO
Figure 1. Serial Bus Timing
Maxim Integrated
3
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
Typical Operating Characteristics
(V
S
= +3.3V, T
A
= +25°C, unless otherwise noted.)
RESPONSE TO THERMAL SHOCK
TEMPERATURE vs. TIME
MAX6625 toc01
STATIC QUIESCENT SUPPLY CURRENT
vs. TEMPERATURE
MAX6625 toc02
100
200
180
INPUT CURRENT (µA)
160
140
120
100
80
OUTPUT TEMPERATURE (°C)
80
60
40
20
DEVICE IMMERSED IN +85°C
FLUORINERT BATH
0
-5
0
5
10
TIME (s)
15
20
-55
-25
5
35
65
95
125
TEMPERATURE (°C)
DYNAMIC QUIESCENT SUPPLY CURRENT
vs. TEMPERATURE
MAX6625 toc03
TEMPERATURE ERROR
vs. TEMPERATURE
4
TEMPERATURE ERROR (°C)
3
2
1
0
-1
-2
-3
-4
MINIMUM LIMIT
±5
SIGMA RANGE
MAX6625 toc04
200
180
INPUT CURRENT (µA)
160
140
120
100
80
-55
-25
5
35
65
95
5
MAXIMUM LIMIT
-5
125
-50
-25
0
25
50
75
100
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Pin Description
PIN
1
2
3
4
5
6
—
NAME
SDA
GND
SCL
OT
ADD
V
S
EP
I
2
C-Compatible Serial Bidirectional Data Line
Power-Supply Ground
I
2
C-Compatible Clock Input
Temperature Alarm Output
I
2
C-Compatible Address Set Pin: Ground (0), V
S
(1), SDA (2), SCL (3); see Table 1.
Power-Supply Input, +3V to +5.5V. Bypass V
S
to GND with a 0.1µF capacitor.
Exposed Paddle. Internally connected to GND. Connect to a large ground plane for maximum thermal
dissipation.
FUNCTION
4
Maxim Integrated
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
Detailed Description
The MAX6625/MAX6626 continuously convert their die
temperatures into digital values using their self-con-
tained delta-sigma ADCs. The resulting data is read-
able at any time through the I
2
C-compatible serial
interface. A dedicated alarm output asserts if the result
exceeds the value in the programmable high-tempera-
ture register. A programmable fault queue sets the
number of faults that must occur before the alarm
asserts, preventing spurious alarms in noisy environ-
ments. The alarm output polarity is selectable and
deasserts based on either of two operating modes,
comparator or interrupt. In comparator mode, the OT
output deasserts if the temperature conversion result
falls below the programmable low-temperature register
value (subject to the fault queue conditions) providing
adjustable hysteresis. In interrupt mode, the OT output
deasserts when any register is read through the serial
interface. Each conversion cycle takes about 130ms. At
power-up, the temperature register is set to 8000h until
the first conversion is completed.
The MAX6625/MAX6626 feature a shutdown mode,
accessible through the serial interface, that saves power
by turning off everything but the power-on reset and the
I
2
C-compatible interface. While in shutdown mode, the
temperature register is set to 8000h. The device func-
tions as a slave on the I
2
C-compatible bus supporting
Write Byte, Write Word, Read Byte, and Read Word com-
mands. Four separate addresses can be configured with
the ADD pin, allowing up to four MAX6625/MAX6626
devices to be placed on the same bus. Figure 2 shows
the functional diagram of the MAX6625/MAX6626.
Serial interface
I
2
C-Compatible Operation
The MAX6625/MAX6626 are readable and programma-
ble through their I
2
C-compatible serial interface.
Figures 3 and 4 show the timing details of the clock
(SCL) and data (SDA) signals. The device functions as
a slave on the I
2
C-compatible bus and supports Write
Byte, Write Word, Read Byte, and Read Word com-
mands.
Addressing
Four separate addresses can be configured with the
ADD pin, allowing up to four MAX6625/MAX6626s to be
placed on the same bus. The address is selected by
connecting the ADD pin to either of four places: GND
