型号
- 型号
- 关键词
Power Management Specialized - PMIC Dual Step-Down PMIC for Portable Devices
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
器件标准：
| 型号 | MAX8621ZETG+T | MAX8621ZETG+ | MAX8621YETG | MAX8621ZETG | MAX8621YETG+ |
|---|---|---|---|---|---|
| 描述 | Power Management Specialized - PMIC Dual Step-Down PMIC for Portable Devices | Power Management Specialized - PMIC Dual Step-Down PMIC for Portable Devices | Power Management Specialized - PMIC | Power Management Specialized - PMIC Dual Step-Down PMIC for Portable Devices | Power Management Specialized - PMIC Dual Step-Down PMIC for Portable Devices |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | unknown | not_compliant | not_compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 |
| JESD-609代码 | e3 | e3 | e0 | e0 | e3 |
| 长度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 245 | 245 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| 标称供电电压 (Vsup) | 3.7 V | 3.7 V | 3.7 V | 3.7 V | 3.7 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 控制模式 | - | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
| 封装等效代码 | - | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 |
| 最大切换频率 | - | 4000 kHz | 4000 kHz | 4000 kHz | 4000 kHz |