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MAX9750AETI-

Audio Amplifiers Integrated Circuits (ICs)

器件类别:半导体    模拟混合信号IC   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件:MAX9750AETI-

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器件参数
参数名称
属性值
产品种类
Product Category
Audio Amplifiers
制造商
Manufacturer
Maxim(美信半导体)
RoHS
Details
产品
Product
Audio Amplifiers

Class
Class-AB
Output Power
2.6 W
Audio - Load Impedance
32 Ohms
THD plus Noise
0.02 %
最大工作温度
Maximum Operating Temperature
+ 85 C
最小工作温度
Minimum Operating Temperature
- 40 C
Description/Function
Headphone/Speaker
Dual Supply Voltage
5 V
Input Type
Single
Maximum Dual Supply Voltage
5.5 V
Minimum Dual Supply Voltage
3 V, 4.5 V
Output Current
1.7 A
Output Signal Type
Differential, Single
输出类型
Output Type
2-Channel Stereo
Pd-功率耗散
Pd - Power Dissipation
1.9 W
PSRR - Power Supply Rejection Ratio
90 dB
工厂包装数量
Factory Pack Quantity
60
Supply Type
Triple
参数对比
与MAX9750AETI-相近的元器件有:MAX9755ETI-T、MAX9750BETI-、MAX9755ETI-、MAX9750BETI、MAX9751ETI-T、MAX9750AETI-T、MAX9750BETI-T。描述及对比如下:
型号 MAX9750AETI- MAX9755ETI-T MAX9750BETI- MAX9755ETI- MAX9750BETI MAX9751ETI-T MAX9750AETI-T MAX9750BETI-T
描述 Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers Integrated Circuits (ICs) Audio Amplifiers
是否Rohs认证 - 不符合 - - 不符合 不符合 不符合 不符合
零件包装代码 - QFN - - QFN QFN QFN QFN
包装说明 - HVQCCN, LCC28,.2SQ,20 - - HVQCCN, LCC28,.2SQ,20 HVQCCN, LCC28,.2SQ,20 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 HVQCCN, LCC28,.2SQ,20
针数 - 28 - - 28 28 28 28
Reach Compliance Code - not_compliant - - not_compliant not_compliant not_compliant not_compliant
商用集成电路类型 - AUDIO AMPLIFIER - - VOLUME CONTROL CIRCUIT AUDIO AMPLIFIER VOLUME CONTROL CIRCUIT VOLUME CONTROL CIRCUIT
JESD-30 代码 - S-XQCC-N28 - - S-XQCC-N28 S-XQCC-N28 S-XQCC-N28 S-XQCC-N28
JESD-609代码 - e0 - - e0 e0 e0 e0
长度 - 5 mm - - 5 mm 5 mm 5 mm 5 mm
功能数量 - 1 - - 1 1 1 1
端子数量 - 28 - - 28 28 28 28
最高工作温度 - 85 °C - - 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C - - -40 °C -40 °C -40 °C -40 °C
封装主体材料 - UNSPECIFIED - - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 - HVQCCN - - HVQCCN HVQCCN HVQCCN HVQCCN
封装形状 - SQUARE - - SQUARE SQUARE SQUARE SQUARE
封装形式 - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) - 245 - - 240 NOT SPECIFIED 245 240
认证状态 - Not Qualified - - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 0.8 mm - - 0.8 mm 0.8 mm 0.8 mm 0.8 mm
最大供电电压 (Vsup) - 5.5 V - - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 4.5 V - - 4.5 V 4.5 V 4.5 V 4.5 V
表面贴装 - YES - - YES YES YES YES
技术 - BICMOS - - BICMOS BICMOS BICMOS BICMOS
温度等级 - INDUSTRIAL - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - NO LEAD - - NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 - 0.5 mm - - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 - QUAD - - QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 - NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 - 5 mm - - 5 mm 5 mm 5 mm 5 mm
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