This product complies with RoHS Directive (EU 2002/95/EC).
Zener Diodes
MAZPxxxH Series
Silicon planar type
For surge absorption circuits
Features
0.60
±0.05
Unit: mm
Total power dissipation
*
Junction temperature
Storage temperature
P
T
T
j
200
mW
°C
°C
0.25
±0.05
0.25
±0.05
1
T
stg
–55 to +150
0.50
±0.05
150
3
Note) *: P
T
= 200 mW achieved with a printed circuit board. (2-chips total)
0.65
±0.01
2
0.05
±0.03
1: Cathode 1
2: Cathode 2
3: Anode 1, 2
ML3-N2 Package
Internal Connection
3
1
2
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Zener voltage
*
V
Z
R
Z
I
R
Symbol
R
ZK
Conditions
Min
Typ
Max
I
Z
I
Z
I
Z
Specified value
Specified value
Specified value
Specified value
Zener rise operating resistance
Zener operating resistance
Reverse current
ue
Pl
e
Electrical Characteristics within Part Numbers
T
a
= 25°C±3°C
M
ai
nt
Test method: IEC1000-4-2 (C = 150 pF, R = 330
W,
Contact discharge: 10 times)
3. The temperature must be controlled 25°C for V
Z
mesurement.
V
Z
value measured at other temperature must be adjusted to V
Z
(25°C)
4. *: V
Z
guaranted 20 ms after current flow.
en
an
ce
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Electrostatic breakdown voltage:
±10
kV
/D
is
co
V
R
Refer to the list of the
electrical characteristics
within part numbers
nt
in
Part number
I
Z
(mA)
MAZP068H
MAZP082H
5
5
Zener voltage
V
Z
(V)
Zener rise
operating
resistance
R
ZK
(W)
I
Z
(mA)
0.5
0.5
Max
60
60
Zener
operating
resistance
R
Z
(W)
I
Z
(mA)
5
5
Max
30
30
Reverse
current
I
R
(
mA)
V
R
(V)
4.0
5.0
Max
0.1
0.1
Marking
symbol
Min
6.40
7.70
Typ
6.80
8.20
Max
7.20
8.70
B6
6
0.15
±0.05
0.05
±0.03
0.35
±0.01
Parameter
Symbol
pl d in
as
an c
e
ed lud
pl
vi
an m m es
si
tf
ed ain ai fo
ol
lo dis dis ten nte llow
ht w c
tp in o co an nan in
:// g nt n ce c g
pa U in tin t e fo
na RL ue ue ype typ ur
so a d t d
e Pr
od
ni bo yp typ
c. u e e
uc
ne t l
d
tl
at
ife
t/s e
cy
c/ st
en in
cl
e
fo
st
rm
ag
at
e.
io
n.
Rating
Unit
1.00
±0.05
0.39
+0.01
−0.03
M
Di ain
sc te
on na
tin nc
ue e/
d
3
Two elements are contained in one package, optimum for high-density
mounting
0.01
±0.005
2
Absolute Maximum Ratings
T
a
= 25°C
1
Unit
V
W
W
mA
Publication date: February 2007
SKE00029AED
1
This product complies with RoHS Directive (EU 2002/95/EC).
MAZPxxxH Series
MAZPxxxH_
P
tot
-
T
a
P
tot
T
a
K
MAZPxxxH_
I
Z
-
V
Z
I
Z
V
Z
MAZPxxxH_
I
F
-
V
F
I
F
V
F
250
10 mm 10 mm A
0.8 mm
Print foil
t = 0.035 mm
10
2
T
a
=
25°C
10
2
T
a
=
25°C
Total power dissipation P
tot
(mW)
200
10
150
1
Forward current I
F
(mA)
Zener current I
Z
(mA)
10
1
MAZP068H
MAZP082H
100
10
−1
50
10
−2
10
−1
0
0
40
80
120
160
200
10
−3
2
4
6
8
10
12
14
10
−2
0
0.2
0.4
0.6
0.8
1.0
1.2
Ambient temperature T
a
(°C)
MAZPxxxH_
R
Z
-
I
Z
Zener voltage V
Z
(V)
MAZPxxxH_
S
Z
-
I
Z
Forward voltage V
F
(V)
MAZPxxxH_
C
t
-
V
R
R
Z
I
Z
S
Z
I
Z
C
t
V
R
T
a
=
25°C
Temparature coefficient of zener voltage S
Z
(mV/°C)
10
2
12
10
8
6
T
a
=
25°C to 150°C
30
T
a
=
25°C
Zener operating resistance R
Z
(Ω)
10
MAZP082H
MAZP068H
1
Terminal capacitance C
t
(pF)
20
MAZP082H
4
MAZP068H
2
0
0
10
MAZP068H
MAZP082H
10
−1
1
10
10
2
20
40
60
0
0
4
8
12
Zener voltage I
Z
(mA)
Zener current I
Z
(mA)
Reverse voltage V
R
(V)
2
SKE00029AED
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
