型号
- 型号
- 关键词
SRAM Card, 256KX8, 200ns, CMOS
器件类别：存储
厂商名称：FUJITSU(富士通)
厂商官网：http://edevice.fujitsu.com/fmd/en/index.html
下载文档| 型号 | MB98A90833-20 | HCHP1505K2180DNTF | MB98A90933-20 | MB98A90931-20 | HCHP1505K2911DGTE | MB98A91133-20 | MB98A91131-20 |
|---|---|---|---|---|---|---|---|
| 描述 | SRAM Card, 256KX8, 200ns, CMOS | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 218ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1505, CHIP | SRAM Card, 512KX8, 200ns, CMOS | SRAM Card, 512KX8, 200ns, CMOS | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 2910ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1505, CHIP | SRAM Card, 2MX8, 200ns, CMOS | SRAM Card, 2MX8, 200ns, CMOS |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | EAR99 | 3A991.B.2.A | 3A991.B.2.A | EAR99 | 3A991.B.2.A | 3A991.B.2.A |
| 端子数量 | 68 | 2 | 68 | 68 | 2 | 68 | 68 |
| 最高工作温度 | 55 °C | 155 °C | 55 °C | 55 °C | 155 °C | 55 °C | 55 °C |
| 封装形式 | MICROELECTRONIC ASSEMBLY | SMT | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | SMT | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 表面贴装 | NO | YES | NO | NO | YES | NO | NO |
| 技术 | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS |
| 厂商名称 | FUJITSU(富士通) | - | FUJITSU(富士通) | FUJITSU(富士通) | - | FUJITSU(富士通) | FUJITSU(富士通) |
| 最长访问时间 | 200 ns | - | 200 ns | 200 ns | - | 200 ns | 200 ns |
| JESD-30 代码 | X-XXMA-X68 | - | X-XXMA-X68 | X-XXMA-X68 | - | X-XXMA-X68 | X-XXMA-X68 |
| 内存密度 | 2097152 bit | - | 4194304 bit | 4194304 bit | - | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | SRAM CARD | - | SRAM CARD | SRAM CARD | - | SRAM CARD | SRAM CARD |
| 内存宽度 | 8 | - | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | 1 |
| 字数 | 262144 words | - | 524288 words | 524288 words | - | 2097152 words | 2097152 words |
| 字数代码 | 256000 | - | 512000 | 512000 | - | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 256KX8 | - | 512KX8 | 512KX8 | - | 2MX8 | 2MX8 |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | - | 5.25 V | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | - | 4.75 V | 4.75 V | - | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
| 端子位置 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |