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MBM29SL800BD-10TN

Flash, 512KX16, 100ns, PDSO48, PLASTIC, TSOP1-48

器件类别:存储    存储   

厂商名称:FUJITSU(富士通)

厂商官网:http://edevice.fujitsu.com/fmd/en/index.html

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
FUJITSU(富士通)
零件包装代码
TSOP1
包装说明
PLASTIC, TSOP1-48
针数
48
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
100 ns
备用内存宽度
8
启动块
BOTTOM
命令用户界面
YES
数据轮询
YES
耐久性
100000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G48
JESD-609代码
e0
长度
18.4 mm
内存密度
8388608 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
部门数/规模
1,2,1,15
端子数量
48
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
512KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP1
封装等效代码
TSSOP48,.8,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
电源
2 V
编程电压
1.8 V
认证状态
Not Qualified
就绪/忙碌
YES
座面最大高度
1.2 mm
部门规模
16K,8K,32K,64K
最大待机电流
0.000005 A
最大压摆率
0.025 mA
最大供电电压 (Vsup)
2.2 V
最小供电电压 (Vsup)
1.8 V
标称供电电压 (Vsup)
2 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
切换位
YES
类型
NOR TYPE
宽度
12 mm
文档预览
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20871-3E
FLASH MEMORY
CMOS
8 M (1 M
×
8/512 K
×
16) BIT
MBM29SL800TD/BD
-10/12
s
DESCRIPTION
The MBM29SL800TD/BD are a 8 M-bit, 1.8 V-only Flash memory organized as 1 Mbytes of 8 bits each or 512
Kwords of 16 bits each. The MBM29SL800TD/BD are offered in a 48-pin TSOP (I) , and 48-ball FBGA packages.
These devices are designed to be programmed in-system with the standard system 3.0 V V
CC
supply. 12.0 V V
PP
and 5.0 V V
CC
are not required for write or erase operations. The devices can also be reprogrammed in standard
EPROM programmers.
(Continued)
s
PRODUCT LINE UP
Part No.
Ordering Part No.
V
CC
= +2.0
V
±
0.2
Max. Address Access Time (ns)
Max. CE Access Time (ns)
Max. OE Access Time (ns)
MBM29SL800TD/MBM29SL800BD
−10
100
100
35
−12
120
120
50
s
PACKAGE
48-pin Plastic TSOP (I)
Marking Side
48-pin Plastic TSOP (I)
48-pin Plastic FBGA
Marking Side
(FPT-48P-M19)
(FPT-48P-M20)
(BGA-48P-M02)
MBM29SL800TD
-
10/12
/MBM29SL800BD
-
10/12
(Continued)
The standard MBM29SL800TD/BD offer access times 100 ns and 120 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE) ,
write enable (WE) , and output enable (OE) controls.
The MBM29SL800TD/BD are pin and command set compatible with JEDEC standard E
2
PROMs. Commands
are written to the command register using standard microprocessor write timings. Register contents serve as
input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and erase operations. Reading data out of the devices
is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.
The MBM29SL800TD/BD are programmed by executing the program command sequence. This will invoke the
Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths
and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds.
Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase
Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed
before executing the erase operation. During erase, the devices automatically time the erase pulse widths and
verify proper cell margin.
A sector is typically erased and verified in 1.5 second. (If already completely preprogrammed.)
The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The MBM29SL800TD/BD are erased when shipped from the
factory.
The devices feature single 1.8 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low V
CC
detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ
7
,
by the Toggle Bit feature on DQ
6
, or the RY/BY output pin. Once the end of a program or erase cycle has been
completed, the devices internally reset to the read mode.
Fujitsu’s Flash technology combines years of EPROM and E
2
PROM experience to produce the highest levels
of quality, reliability, and cost effectiveness. The MBM29SL800TD/BD memories electrically erase the entire
chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed
one byte/word at a time using the EPROM programming mechanism of hot electron injection.
2
MBM29SL800TD
-
10/12
/MBM29SL800BD
-
10/12
s
FEATURES
Single 1.8 V read, program, and erase
Minimizes system level power requirements
Compatible with JEDEC-standard commands
Uses same software commands as E
2
PROMs
Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP (I) (Package suffix : TN
Normal Bend Type, TR
Reversed Bend Type)
48-ball FBGA (Package suffix : PBT)
Minimum 100,000 program/erase cycles
High performance
100 ns maximum access time
Sector erase architecture
One 8 Kword, two 4 Kwords, one 16 Kword, and fifteen 32 Kwords sectors in word mode
One 16 Kbyte, two 8 Kbytes, one 32 Kbyte, and fifteen 64 Kbytes sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase
Boot Code Sector Architecture
T
=
Top sector
B
=
Bottom sector
Embedded Erase
TM
Algorithms
Automatically pre-programs and erases the chip or any sector
Embedded Program
TM
Algorithms
Automatically writes and verifies data at specified address
Data Polling and Toggle Bit feature for detection of program or erase cycle completion
Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode
Erase Suspend/Resume
Suspends the erase operation to allow a read in another sector within the same device
Sector protection
Hardware method disables any combination of sectors from program or erase operations
Sector Protection set function by Extended sector Protect command
Temporary sector unprotection
Temporary sector unprotection via the RESET pin
Embedded Erase
TM
and Embedded Program
TM
are trademarks of Advanced Micro Devices, Inc.
3
MBM29SL800TD
-
10/12
/MBM29SL800BD
-
10/12
s
PIN ASSIGNMENTS
TSOP (I)
A
15
A
14
A
13
A
12
A
11
A
10
A
9
A
8
N.C.
N.C.
WE
RESET
N.C.
N.C.
RY/BY
A
18
A
17
A
7
A
6
A
5
A
4
A
3
A
2
A
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(Marking Side)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A
16
BYTE
V
SS
DQ
15
/A
-1
DQ
7
DQ
14
DQ
6
DQ
13
DQ
5
DQ
12
DQ
4
V
CC
DQ
11
DQ
3
DQ
10
DQ
2
DQ
9
DQ
1
DQ
8
DQ
0
OE
V
SS
CE
A
0
Standard Pinout
(FPT-48P-M19)
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
17
A
18
RY/BY
N.C.
N.C.
RESET
WE
N.C.
N.C.
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
(Marking Side)
Reverse Pinout
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
A
0
CE
V
SS
OE
DQ
0
DQ
8
DQ
1
DQ
9
DQ
2
DQ
10
DQ
3
DQ
11
V
CC
DQ
4
DQ
12
DQ
5
DQ
13
DQ
6
DQ
14
DQ
7
DQ
15
/A
-1
V
SS
BYTE
A
16
(FPT-48P-M20)
(Continued)
4
MBM29SL800TD
-
10/12
/MBM29SL800BD
-
10/12
(Continued)
FBGA
(TOP VIEW)
Marking side
A6
A
13
A5
A
9
A4
B6
A
12
B5
A
8
B4
C6
A
14
C5
A
10
C4
D6
A
15
D5
A
11
D4
N.C.
D3
N.C.
D2
A
5
D1
A
1
E6
A
16
E5
DQ
7
E4
DQ
5
E3
DQ
2
E2
DQ
0
E1
A
0
F6
G6
H6
BYTEDQ
15
/A
-1
V
SS
F5
DQ
14
F4
DQ
12
F3
DQ
10
F2
DQ
8
F1
CE
G5
DQ
13
G4
V
CC
G3
DQ
11
G2
DQ
9
G1
OE
H5
DQ
6
H4
DQ
4
H3
DQ
3
H2
DQ
1
H1
V
SS
WE RESET N.C.
A3
RY/BY
A2
A
7
A1
A
3
B3
N.C.
B2
A
17
B1
A
4
C3
A
18
C2
A
6
C1
A
2
(BGA-48P-M02)
5
查看更多>
参数对比
与MBM29SL800BD-10TN相近的元器件有:MBM29SL800TD-12TN。描述及对比如下:
型号 MBM29SL800BD-10TN MBM29SL800TD-12TN
描述 Flash, 512KX16, 100ns, PDSO48, PLASTIC, TSOP1-48 Flash, 512KX16, 120ns, PDSO48, PLASTIC, TSOP1-48
是否Rohs认证 不符合 不符合
厂商名称 FUJITSU(富士通) FUJITSU(富士通)
零件包装代码 TSOP1 TSOP1
包装说明 PLASTIC, TSOP1-48 PLASTIC, TSOP1-48
针数 48 48
Reach Compliance Code unknown unknown
ECCN代码 EAR99 EAR99
最长访问时间 100 ns 120 ns
备用内存宽度 8 8
启动块 BOTTOM TOP
命令用户界面 YES YES
数据轮询 YES YES
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e0 e0
长度 18.4 mm 18.4 mm
内存密度 8388608 bit 8388608 bit
内存集成电路类型 FLASH FLASH
内存宽度 16 16
功能数量 1 1
部门数/规模 1,2,1,15 1,2,1,15
端子数量 48 48
字数 524288 words 524288 words
字数代码 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
组织 512KX16 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 TSOP1
封装等效代码 TSSOP48,.8,20 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
电源 2 V 2 V
编程电压 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified
就绪/忙碌 YES YES
座面最大高度 1.2 mm 1.2 mm
部门规模 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A
最大压摆率 0.025 mA 0.025 mA
最大供电电压 (Vsup) 2.2 V 2.2 V
最小供电电压 (Vsup) 1.8 V 1.8 V
标称供电电压 (Vsup) 2 V 2 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 DUAL DUAL
切换位 YES YES
类型 NOR TYPE NOR TYPE
宽度 12 mm 12 mm
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