型号
- 型号
- 关键词
IC,FLIP-FLOP,DUAL,J/K TYPE,ECL,DIP,16PIN,CERAMIC
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | MC10H135LDS | MC10H135L | MC10H135PS | MC10H135PDS |
|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,DUAL,J/K TYPE,ECL,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ECL,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ECL,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,ECL,DIP,16PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknow |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | ECL | ECL | ECL | ECL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE |
