Freescale Semiconductor
Technical Data
Document Number: MC1322x
Rev. 1.3 10/2010
MC1322x
MC1322x
Advanced ZigBee
™
- Compliant
Platform-in-Package (PiP) for the
2.4 GHz IEEE
®
802.15.4
Standard
1
Package Information
Case 1901-01
99-Pin [9.5X9.5X1.2mm]
Ordering Information
Device
MC13224V
1
MC13224VR2
1
MC13226V
1
MC13226VR2
1
Device Marking
MC13224V
MC13224V
MC13226V
MC13226V
Package
LGA
LGA
LGA
LGA
1
Introduction
See
Table 1
for more details.
Contents
The MC1322x family is Freescale’s third-generation
ZigBee platform which incorporates a complete, low
power, 2.4 GHz radio frequency transceiver, 32-bit
ARM7 core based MCU, hardware acceleration for both
the IEEE 802.15.4 MAC and AES security, and a full set
of MCU peripherals into a 99-pin LGA
Platform-in-Package (PiP).
The MC1322x solution can be used for wireless
applications ranging from simple proprietary
point-to-point connectivity to complete ZigBee mesh
networking. The MC1322x is designed to provide a
highly integrated, total solution, with premier processing
capabilities and very low power consumption.
The MC1322x MCU resources offer superior processing
power for ZigBee applications. A full 32-bit
ARM7TDMI-S core operates up to 26 MHz. A 128
Kbyte FLASH memory is mirrored into a 96 Kbyte
RAM for upper stack and applications software. In
addition, an 80 Kbyte ROM is available for boot
software, standardized IEEE 802.15.4 MAC and
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 High Density, Low Component Count, Integrated
IEEE 802.15.4 Solution
10
4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 MCU Peripherals . . . . . . . . . . . . . . . . . . . . . . 19
6 Pin Assignments and Connections . . . . . . 28
7 System Electrical Specification . . . . . . . . . 36
8 Developer Environment . . . . . . . . . . . . . . . . 48
9 Mechanical Diagrams
(Case 1901-01, non-JEDEC)
51
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.
communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for
transceiver packet data complement the processor core.
The RF radio interface provides for low cost and the high density as shown in
Figure 1.
An onboard balun
along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA
provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides
-96 dBm sensitivity. In addition, separate complementary PA outputs allow use of an external PA and/or
an external LNA for extended range applications. The device also has onboard bypass capacitors and
crystal load capacitors for the smallest footprint in the industry. All components are integrated into the
package except the crystal and antenna.
PA
RF
TX/RX
SWITCH
LNA
ANALOG
TRANSMITTER
BALUN
ANALOG
RECEIVER
Figure 1. MC1322x RF Radio Interface
In addition to the best-in-class MCU performance and power, the MC1322x also provides best-in-class
power savings. Typical transmit current is 29 mA and typical receive current is 22 mA with the CPU at 2
MHz operation and even lower with the bus stealing enabled. Onboard power supply regulation is
provided for source voltages from 2.0 Vdc to 3.6 Vdc. Numerous low current modes are available to
maximize battery life including sleep or restricted performance operation.
Applications include, but are not limited to, the following:
• Residential and commercial automation
— Lighting control
— Security
— Access control
— Heating, ventilation, air-conditioning (HVAC)
— Automated meter reading (AMR)
• Industrial Control
MC1322x Technical Data, Rev. 1.3
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— Asset tracking and monitoring
— Homeland security
— Process management
— Environmental monitoring and control
— HVAC
— Automated meter reading
Health Care
— Patient monitoring
— Fitness monitoring
Consumer
— Remote control
— Entertainment systems
— Cellular phone attach
1.1
Available Devices
The MC1322x family is available as two part numbers. These device types differ only in their ROM
contents, all other device hardware, performance, and specifications are identical:
• MC13224V - this is the original version and is the generic part type.
— The MC13224V is intended for most IEEE 802.15.4 applications including MAC-based,
ZigBee-2007 Profile 1, and ZigBee RF4CE targets.
— It has a more complete set of peripheral drivers in ROM.
• MC13226V - this is a more recent version and is provided specifically for ZigBee-2007 Profile 2
(Pro) applications. Only the onboard ROM image has been changed to optimize ROM usage for
the ZigBee Pro profile and maximize the amount of available RAM for application use.
— The IEEE MAC/PHY functionality has been streamlined to include only that functionality
required by the ZigBee specification. The MAC functionality is 802.15.4 compatible.
— For a typical application, up to 20 kbytes more of RAM is available versus the M13224V
— Some drivers present in the MC13224 ROM have been removed and these include the ADC,
LCDfont, and SSI drivers. These drivers are still available as library functions, but now
compile into the RAM space.
— The Low Level Component (LLC) functionality has also been streamlined for the ZigBee
specification
•
•
NOTE
When running the Freescale IEEE 802.15.4 MAC (or a related stack) on
the MC1322x platform, neither beaconing or GTS are supported.
See the MC1322x Reference Manual (Document No MC1322xRM), for
information on using applications on these devices.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
3
1.2
Ordering Information
Table 1. Orderable Parts Details
Table 1
provides additional details about the MC1322x
Device
Operating
Temp Range
(TA.)
-40° to 105° C LGA
Package
Memory
Options
Description
MC13224V
MC13224VR2
MC13226V
MC13226VR2
-40° to 105° C LGA Tape and Reel
-40° to 105° C LGA
-40° to 105° C LGA Tape and Reel
96KB RAM, Intended for 802.15.4 Standard compliant applications,
128KB Flash Freescale 802.15.4 MAC, and Freescale BeeStack™.
96KB RAM, Intended specifically for Freescale BeeStack™ Pro
128KB Flash applications.
2
2.1
Features
Block Diagram
24 MHz (typ)
32.768 KHz (optional)
This section provides a simplified block diagram and highlights MC1322x features.
Figure 2
shows a simplified block diagram of the MC1322x.
BATTERY
DETECT
RF
OSCILLATOR
&
CLOCK GENERATION
RADIO
INTERFACE
MODULE
(RIF)
DIGITAL
MODEM
TX
MODEM
RX
MODEM
802.15.4
MAC
ACCELERATOR
(MACA)
JTAG/
Nexus
DEBUG
ARM7
TDMI-S
32-BIT
CPU
BUS
INTERFACE
& MEMORY
ARBITRATOR
ARM
INTERRUPT
CONTROLLER
(AITC)
CLOCK &
RESET
MODULE
(CRM)
DUAL
12-BIT
ADC
MODULE
TIMER
MODULE
(TMR)
(4 Tmr Blocks)
UART
MODULE
(UART0)
ANALOG
TRANSMITTER
BALUN
RF
TX/RX
SWITCH
ANALOG
RECEIVER
IEEE 802.15.4 TRANSCEIVER
ADVANCED
SECURITY
MODULE
(ASM)
SYNC SERIAL
INTERFACE
(SSI/i2S)
KEYBOARD
INTERFACE
(KBI)
MC1322x
SPI
FLASH
MODULE
(SPIF)
ANALOG
POWER
MANAGEMENT
&
VOLTAGE
REGULATION
INTER-IC BUS
MODULE
(I2C)
SERIAL
PERIPHERAL
INTERFACE
(SPI)
96KBYTE
SRAM
(24K WORDS x
32 BITS)
80KBYTE
ROM
(20KWORDS x
32 BITS)
Buck
Regulator
128KBYTE
NON-VOLATILE
MEMORY
(SERIAL
FLASH)
GPIO and IO
CONTROL
Figure 2. MC1322x Simplified Block Diagram
MC1322x Technical Data, Rev. 1.3
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Freescale Semiconductor
UP TO 64 IO PINS
UART
MODULE
(UART1)
2.2
•
Features Summary
IEEE 802.15.4 standard compliant on-chip transceiver/modem
— 2.4 GHz ISM Band operation
— 16 selectable channels
— Programmable transmitter output power (-30 dBm to +4 dBm typical)
— World-class receiver sensitivity
– < -96 dBm typical receiver sensitivity using DCD mode (<1% PER, 20-byte packets)
– < -100 dBm typical receiver sensitivity using NCD mode (<1% PER, 20-byte packets)
Hardware acceleration for IEEE 802.15.4 applications
— MAC accelerator (sequencer and DMA interface)
— Advanced encryption/decryption hardware engine (AES 128-bit)
Supports standard IEEE 802.15.4 signaling with 250 kbps data rate
32-bit ARM7TDMI-S CPU core with programmable performance up to 26 MHz (24 MHz typical)
Extensive on-board memory resources
— 128 Kbyte serial FLASH memory (will be mirrored into RAM)
— 96 Kbyte SRAM
— 80 Kbyte ROM
Best-in-class power dissipation
— 22 mA typical RX current draw (DCD mode) with radio and MCU active
— 29 mA typical TX current draw with radio and MCU active (coin cell capable)
— 3.3 mA typical current draw with MCU active (radio off)
— 0.8 mA typical current with MCU idle (radio off)
— 0.85
μA
typical Hibernate current (retain 8 Kbyte SRAM contents)
— 0.4
μA
maximum Off current (device in reset)
Extensive sleep mode control and variation
— Hibernate and Doze low power modes
— Programmable degree of power down
— Clock management
— Onboard 2 kHz oscillator for wake-up timer.
— Optional 32.768 kHz crystal oscillator for accurate real-time sleep mode timing and wake-up
with a possible sleep period greater than 36.4 hours
— Wake-up through programmable timer, external real-time interrupts, or ADC timer
Extensive MCU peripherals set
— Dedicated 802.15.4 modem/radio interface module (RIF)
— Dedicated NVM SPI interface for managing FLASH memory
— Two dedicated UART modules capable of 2 Mbps with CTS/RTS support
— SPI port with programmable master and slave operation
MC1322x Technical Data, Rev. 1.3
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